Electronic control apparatus

• US 6,640,645 B2
• Filed: 04/23/2001
• Issued: 11/04/2003
• Est. Priority Date: 05/06/2000
• Status: Expired due to Fees

• Current Assignee: Wabco GmbH (Wabco Holdings Incorporated)
• Original Assignee: Wabco GmbH (Wabco Holdings Incorporated)
• Inventors: Gröger, Jens
• Primary Examiner(s): Lefkowitz, Edward
• Assistant Examiner(s): JENKINS, JERMAINE L
• Application Number:
  US09/841,549
• Publication Number:
  US 20010049965A1
• Time in Patent Office: 925 Days
• Field of Search: 737/15, 737/56, 737/53
• US Class Current: 73/753
• CPC Class Codes: G01L 19/0007 Fluidic connecting means
• CPC Class Codes: G01L 19/14 Housings G01L19/0007, G01L19/0084, G01L19/0092, G01L19/04, G01L19/06 take precedence

Abstract

An electronic control apparatus contained within a housing comprises a printed circuit board with both electronic components and at least one pressure sensor. A pressure conduit is used to channel a pressure medium to be measured to the pressure sensor. The perimeter edge of the pressure conduit facing the pressure sensor is hermetically sealed around the pressure sensor, so that the other components on the printed circuit board, as well as the housing itself, are not subjected to the pressure medium to be measured.

Claims

1. An electronic control apparatus having both electrical and mechanical functions, including the measurement of a pressure medium, comprising:

a) a housing,

b) a cover for said housing,

c) at least one printed circuit board attached to the interior side of said cover, said at least one printed circuit board having a first side facing the interior of said housing, and a second side, opposite to said first side, facing said interior side of said cover,

d) electronic components mounted on said first and second sides of said at least one printed circuit board,

e) at least one pressure sensor and at least one other electronic component mounted on said first side of said at least one printed circuit board,

f) a pressure conduit, mounted within said housing, having a first open end for receiving said pressure medium to be measured,

g) said pressure conduit having a second open end for channeling said pressure medium to said at least one pressure sensor,

wherein said pressure conduit encloses said at least one pressure sensor within said second open end in a pressure tight seal against said first side of said at least one printed circuit board thereby to form a pressure tight chamber on said first side of said at least one printed circuit board which separates said at least one pressure sensor from said at least one other electronic component.

2. The electronic control apparatus of claim 1, wherein said second open end of said pressure conduit contains a first sealing ring for making said pressure tight seal against said first side of said at least one printed circuit board.

3. The electronic control apparatus of claim 2, wherein said at least one printed circuit board includes a copper coating on said first side where said first sealing ring contacts said first side of said at least one printed circuit board.

4. The electronic control apparatus of claim 3, wherein said at least one printed circuit board is configured in layers, and wherein electrical connections of said pressure sensor are made with strip conductors within said at least one printed circuit board.

5. The electronic control apparatus of claim 1, wherein a pressure equalization chamber, having the same cross-sectional surface area as said second open end of said pressure conduit, is formed within said cover on said second side of said at least one printed circuit board, directly opposite said second open end of said pressure conduit, which is on said first side of said at least one printed circuit board.

6. The electronic control apparatus of claim 5, wherein said at least one printed circuit board contains a pressure equalization bore adjacent to said second open end of said pressure conduit, said pressure equalization leading into said pressure equalization chamber.

7. The electronic control apparatus of claim 6, wherein said pressure equalization bore is coated with metal.

8. The electronic control apparatus of claim 5, wherein said pressure equalization chamber is pressure sealed against said second side of said at least one printed circuit board by a second sealing ring.

9. The electronic control apparatus of claim 5, wherein said pressure equalization chamber is pressure sealed against said second side of said at least one printed circuit board by a pressure-proof glue.

10. The electronic control apparatus of claim 1, wherein said at least one printed circuit board contains both plug-in components and SMD components.

11. The electronic control apparatus of claim 1, wherein said at least one printed circuit board is configured as a heat sink board, having only SMD components mounted on said first side facing the interior of said housing.

12. The electronic control apparatus of claim 11, wherein said heat sink board is attached to the inside of said cover by glue.

13. The electronic control apparatus of claim 1, wherein said pressure conduit is directly attached to said housing.

14. The electronic control apparatus of claim 13, wherein said pressure conduit is glued into a bore of said housing.

15. The electronic control apparatus of claim 13, wherein said pressure conduit is attached to a sidewall of said housing by extrusion coating.

16. The electronic control apparatus of claim 1, wherein said cover is attached to said housing by screws.