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Method for selectively applying solder mask

  • US 6,641,865 B2
  • Filed: 12/31/2002
  • Issued: 11/04/2003
  • Est. Priority Date: 09/11/2000
  • Status: Expired due to Fees
First Claim
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1. A method of selectively applying solder mask to a Printed Circuit Board, the method comprising the steps:

  • repairing solder mask having been damaged as a result of removing at least one of a component and solder from the Printed Circuit Board, registering a selective solder mask applicator, the selective solder mask applicator comprising a pattern for applying a solder mask material, to a pattern of electronic pads respective to the damaged solder mask of the Printed Circuit Board, and applying the solder mask material proximate the pattern of electronic pads respective to the damaged solder mask on the Printed Circuit Board, wherein the solder mask material is applied between the electronic pads and leaving the electronic pads exposed.

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