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System and method for mounting electronic components onto flexible substrates

  • US 6,642,485 B2
  • Filed: 12/03/2001
  • Issued: 11/04/2003
  • Est. Priority Date: 12/03/2001
  • Status: Expired due to Term
First Claim
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1. A system for reflowing solder to interconnect a plurality of electronic components to a substrate, the system comprising:

  • an oven for preheating the substrate and the plurality of electronic components disposed thereon;

    a supplemental heat source positioned within the oven for providing additional heat energy to reflow the solder, wherein the supplemental heat source creates a stream of hot gas that flows transversely across the substrate; and

    a pallet for supporting and absorbing heat from the substrate.

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