Cooling device and surface emitting device comprising same

• US 6,643,302 B1
• Filed: 07/27/2000
• Issued: 11/04/2003
• Est. Priority Date: 07/30/1999
• Status: Expired due to Fees

• Current Assignee: Fanuc Ltd (Fanuc Corporation)
• Original Assignee: Fanuc Ltd (Fanuc Corporation)
• Inventors: Takigawa, Hiroshi, Nishikawa, Yuji
• Primary Examiner(s): Ip, Paul
• Assistant Examiner(s): Nguyen, Phillip
• Application Number:
  US09/627,095
• Time in Patent Office: 1,195 Days
• Field of Search: 372/34, 372/35, 372/36, 372/69, 372/70, 372/75, 361/704
• US Class Current: 372/35
• CPC Class Codes: F28D 2021/0029 Heat sinks
• CPC Class Codes: F28D 9/0043 the plates having openings therein for circulation of at least one heat-exchange medium from one conduit to another
• CPC Class Codes: F28F 3/083 capable of being taken apart
• CPC Class Codes: F28F 3/086 having one or more openings therein forming tubular heat-exchange passages
• CPC Class Codes: H01S 5/02365 by clamping
• CPC Class Codes: H01S 5/02423 Liquid cooling, e.g. a liquid cools a mount of the laser
• CPC Class Codes: H01S 5/4018 Lasers electrically in series
• CPC Class Codes: H01S 5/4025 Array arrangements, e.g. constituted by discrete laser diodes or laser bar H01S5/42 takes precedence

Abstract

A cooling device is provided wherein are stacked cooling units on which laser diode arrays are mounted, comprising intake openings provided such that they pass through first portions in the cooling units in order to conduct cooling liquid about the peripheries of each of the laser diode arrays, outlet openings provided such that they pass through second portions of the cooling units in order to discharge to the outside of the cooling device the cooling liquid that has cooled each of the laser diode arrays, and inflow openings that pass through third portions in the cooling units, and are connected to the intake openings, and through which cooling liquid is supplied from the outside.

Claims

1. A cooling device wherein planar cooling units, on which heat-generating electronic parts to be cooled are mounted, are stacked parallel from a first end to a second end along an axis, said cooling units comprising first cooling units and second cooling units,

wherein each of said first cooling units includes,

at least one first opening which opens to a first cooling liquid supply passage passing through a first portion transverse of the axis of at least two of said stacked cooling units to supply cooling liquid to each of said parts to be cooled, and

at least one second opening which opens to a first cooling liquid discharge passage passing through a second different transverse portion of at least two of said stacked cooling units to discharge to outside of the cooling device said cooling liquid that has cooled each of said parts,

wherein each of said second cooling units includes,

at least one third opening which opens to the first cooling liquid supply passage,

at least one fourth opening which opens to the first cooling liquid discharge passage, and

at least one fifth opening which opens to a second cooling liquid supply passage which is different from said first cooling liquid supply passage and which passes through a third different transverse portion of at least two of said stacked cooling units and is in fluid communication with said first cooling liquid supply passage, and through which the cooling liquid is supplied from outside of the cooling device, and

wherein a length of said second cooling unit is greater than a corresponding length of said first cooling unit, so that said second cooling unit has an extended portion which extends beyond said first cooling unit.

2. The cooling device according to claim 1, wherein said at least one fifth opening which opens to said second cooling liquid supply passage is provided in said extended portion of the second cooling unit.

3. The cooling device according to claim 2, wherein said first cooling liquid supply passage is in fluid communication with said second cooling liquid supply passage via a plurality of flow passages partitioned by ridges.

4. The cooling device according to claim 2, further comprising pressure bonding means for pressure bonding said stacked cooling units.

5. The cooling device according to claim 4, wherein said pressure bonding means is a belt or belts that securely tighten said stacked cooling units.

6. The cooling device according to claim 1, further comprising a cooling liquid induction pipeline that is connected to said second cooling liquid supply passage.

7. The cooling device according to claim 1, wherein said extended portion of the second cooling unit is formed with at least one sixth opening which opens to a second cooling liquid discharge passage which is different from said first cooling liquid discharge passage, and passes through a fourth different transverse portion of at least two of the stacked cooling units through which said cooling liquid is discharged to the outside of the cooling device.

8. The cooling device according to claim 1, further comprising:

third cooling units, each of which has sixth, seventh and eighth openings which open, respectively, to said first cooling liquid supply passage, said first cooling liquid discharge passage and to a second cooling liquid discharge passage, which is in a fourth different transverse portion of at least two of the stacked cooling units and is in fluid communication with the first cooling liquid discharge passage,

wherein a length of said third cooling unit is greater than a corresponding length of said first cooling unit, and less than or equal to the length of the second cooling units so that said third cooling unit has an extended portion which extends beyond said first cooling unit, and

wherein the third cooling units are located adjacent at least one of the first and second cooling units,

wherein the eighth opening which opens to said second liquid cooling discharge passage is provided in the extended portion of the third cooling units.

9. The cooling device according to claim 8, further comprising a cooling liquid discharge line that is connected to said second cooling liquid discharge passage.

10. The cooling device according to claim 1, wherein the parts to be cooled are laser diode arrays.

14. A surface emitting device comprising the cooling device recited in claim 1.

15. A surface emitting device comprising the cooling device recited in claim 2.

16. A surface emitting device comprising the cooling device recited in claim 2.

11. A surface light emitting device wherein planar laser diode arrays to be cooled are mounted on cooling units and are stacked parallel from a first end to a second end along an axis, said cooling units comprising:

first cooling units and second cooling units,

wherein each of said first cooling units includes,

at least one first opening which opens to a first cooling liquid supply passage passing through a first portion transverse of the axis of at least two of the stacked cooling units to supply cooling liquid to each of said laser diode arrays to be cooled, and

at least one second opening which opens to a first cooling liquid discharge passage passing through a second different transverse portion of at least two of said cooling units to discharge to outside of the cooling device said cooling liquid that has cooled each of said laser diode arrays,

wherein each of said second cooling units includes,

at least one third opening which opens to the first cooling liquid supply passage,

at least one fourth opening which opens to the cooling liquid discharge passage, and

at least one fifth opening which opens to a second cooling liquid supply passage which is different from said first cooling liquid supply passage and which passes through a third different transverse portion of at least two of the stacked cooling units and is in fluid communication with said first cooling liquid supply passage, and through which the cooling liquid is supplied from outside of the cooling device, and

wherein a length of said second cooling unit is greater than a corresponding length of said first cooling unit, so that said second cooling unit has an extended portion which extends beyond said first cooling unit.

12. The surface emitting device according to claim 11, further comprising a belt or belts that securely tighten said stacked cooling units.

13. The surface emitting device according to claim 12, further comprising lenses deployed in opposition to a surface formed by said stacked laser diode arrays and held by said belt or belts.