Implantable devices having a liquid crystal polymer substrate

• US 6,643,552 B2
• Filed: 05/30/2002
• Issued: 11/04/2003
• Est. Priority Date: 05/30/2001
• Status: Expired due to Fees

• Current Assignee: Innersea Technology, Foster-Miller Incorporated (Thermo Fisher Scientific Incorporated)
• Original Assignee: Innersea Technology, Foster-Miller Incorporated (Thermo Fisher Scientific Incorporated)
• Inventors: Farrell, Brian, Edell, David J.
• Primary Examiner(s): Schaetzle, Kennedy
• Application Number:
  US10/158,510
• Publication Number:
  US 20020198582A1
• Time in Patent Office: 523 Days
• Field of Search: 607/116, 607/117, 607/119, 607/129, 607/137, 607/148, 607/152, 600/373, 600/378, 600/393, 600/395, 600/377
• US Class Current: 607/116
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0531 Brain cortex electrodes
• CPC Class Codes: A61N 1/0534 Electrodes for deep brain stimulation
• CPC Class Codes: A61N 1/0539 Anchoring of brain electrode systems, e.g. within burr hole
• CPC Class Codes: A61N 1/0541 Cochlear electrodes
• CPC Class Codes: A61N 1/0543 Retinal electrodes
• CPC Class Codes: A61N 1/0551 Spinal or peripheral nerve electrodes
• CPC Class Codes: A61N 1/0553 Paddle shaped electrodes, e.g. for laminotomy
• CPC Class Codes: A61N 1/0558 Anchoring or fixation means therefor

Abstract

An implantable medical device (IMD) is disclosed that is formed on a substrate composed of liquid crystal polymer (LCP). In one embodiment, the IMD can be an interconnection module for interconnecting an electrode array to an equipment module. The interconnecting module includes conductors disposed on the LCP substrate and coupled to the electrode array, and wherein the conductors are encapsulated using a silicone or LCP encapsulant. In another embodiment, the IMD is an electrode array and interconnect module disposed on an integral LCP substrate. An equipment module can be coupled to the interconnect module. Alternatively, a hybrid electronic circuit can be coupled to the interconnect module for signal processing and conditioning signals received from the electrode array or for providing stimulus signals to the electrode array. In this embodiment, all of the conductors and at least a portion of the electrodes in the electrode array are encapsulated using a silicone or LCP encapsulant. In another embodiment, the IMD is an electrode array, an interconnecting module, and a hybrid circuit that are disposed on an LCP substrate. The interconnecting module is used to provide signal paths to and from the electrodes in the electrode array to the hybrid circuit. In this embodiment, all of the conductors, the hybrid electronic circuit and at least a portion of the electrodes in the electrode array are encapsulated using a silicone or LCP encapsulant.

Claims

1. An implantable electrode and interconnect module comprising:

a first substrate;

a second substrate composed of LCP;

the first substrate including at least one electrode conductor disposed thereon and an associated interconnect conductor disposed thereon electrically connected to the electrode conductor;

the second substrate including an electrical interconnection bonding pad electrically coupled to the interconnect conductor of the first substrate and a conductor electrically connected to the interconnection bonding pad;

a first encapsulant covering a portion of the electrode conductor and completely covering the interconnect conductor, the first encapsulant chemically bonded to the first substrate, wherein the portion of the electrode conductor and the interconnect conductor are protected from an external environment; and

a second encapsulant completely covering the interconnect conductor and the electrical interconnection bonding pad, the second encapsulant chemically bonded to the second substrate, wherein the interconnect conductor and the electrical interconnection bonding pad are protected from an external environment.

2. The implantable electrode of claim 1 wherein the first substrate is silicon.

3. The implantable electrode of claim 1 wherein the first substrate is LCP.

4. The implantable electrode of claim 1 wherein the first encapsulant is silicone.

5. The implantable electrode of claim 1 wherein the first encapsulant is LCP.

6. The implantable electrode of claim 1 wherein the second encapsulant is silicone.

7. The implantable electrode of claim 1 wherein the second encapsulant is LCP.

8. The implantable electrode of claim 1 wherein the electrical interconnection bonding pad is electrically coupled to the interconnect conductor of the first substrate via an encapsulated conductor.

9. The implantable electrode of claim 1 further including an equipment module electrically coupled to the conductor of the second substrate.

10. The implantable electrode of claim 9 wherein the equipment module is electrically coupled to the conductor of the second substrate via an encapsulated conductor.

11. The implantable electrode of claim 9 wherein the equipment module is a percutaneous connector.

12. The implantable electrode of claim 11 wherein the percutaneous connector includes a percutaneous substrate that is LCP.

13. The implantable electrode of claim 9 wherein the equipment module is a telemetry module.

14. The implantable electrode of claim 13 wherein the telemetry module includes a substrate that is LCP.

15. The implantable electrode of claim 9 wherein the equipment module includes a equipment module substrate that is LCP.

16. The implantable electrode of claim 1 further including a hybrid electronic circuit electrically coupled to the conductor of the second substrate.

17. The implantable electrode of claim 16 wherein the hybrid electronic circuit is electrically coupled to the conductor of the second substrate via an encapsulated conductor.

18. The implantable electrode of claim 16 further including an equipment module electrically coupled to the hybrid electronic circuit.

19. The implantable electrode of claim 18 wherein the equipment module is electrically coupled to the hybrid electronic circuit via an encapsulated conductor.

20. The implantable electrode of claim 19, wherein the equipment module includes an LCP substrate.

21. The implantable electrode of claim 18, wherein the equipment module includes an LCP substrate.

22. The implantable electrode of claim 16 wherein the hybrid electronic circuit includes a hybrid substrate that is LCP.

23. The implantable electrode of claim 22 wherein the hybrid substrate is integral with the second substrate.

24. An electrode array comprising:

an LCP substrate having an electrode portion and an interconnect portion;

an electrode disposed on the surface of the electrode portion of the LCP substrate;

an electrode interconnect conductor disposed on the electrode portion of the LCP substrate, the conductor electrically connected to the electrode;

an interconnect conductor formed on the interconnect portion of the LCP substrate, the interconnect conductor electrically connected to the electrode interconnect conductor;

an encapsulant covering the interconnect conductor formed on the interconnect portion of the LCP substrate, the electrode interconnect conductor formed on the electrode portion of the LCP substrate, and covering a portion the electrode formed on the electrode portion of the LCP substrate, the encapsulant chemically bonded to the LCP substrate, wherein the encapsulated electrode interconnect conductor, the encapsulated interconnect conductor and the encapsulated portion of the electrode are protected from an external environment.

25. The electrode array of claim 24 wherein the electrode portion of the LCP substrate includes two or more shafts formed with the LCP substrate, and each of the at least two shafts includes at least one electrode disposed on the surface of the respective shaft, and wherein the electrode interconnect conductor includes a number of electrode interconnect conductors corresponding to the number of electrodes, and wherein the interconnect conductor includes a number of interconnect conductors corresponding to the number of electrode interconnect conductors.

26. The electrode array of claim 25 wherein the encapsulant is a silicone encapsulant.

27. The electrode array of claim 25 wherein the encapsulant is an LCP encapsulant.

28. The electrode array of claim 25 further including an equipment module electrically coupled to at least one of the interconnect conductors.

29. The electrode array of claim 28 wherein the equipment module is electrically coupled to the at least one interconnect conductor via an encapsulated conductor.

30. The implantable electrode of claim 28 wherein the equipment module is a percutaneous connector.

31. The electrode array of claim 30 wherein the percutaneous connector includes a percutaneous substrate that is LCP.

32. The implantable electrode of claim 28 wherein the equipment module is a telemetry module.

33. The electrode array of claim 32 wherein the telemetry module includes a substrate that is LCP.

34. The electrode array of claim 28 wherein the equipment module includes a equipment module substrate that is LCP.

35. The implantable electrode of claim 25 further including a hybrid electronic circuit electrically coupled to at least one interconnect conductor.

36. The implantable electrode of claim 35 wherein the hybrid electronic circuit is electrically coupled to the at least one interconnect conductor via at least one encapsulated conductor.

37. The implantable electrode of claim 36 further including an equipment module electrically coupled to the hybrid electronic circuit.

38. The implantable electrode of claim 37 wherein the equipment module is electrically coupled to the hybrid electronic circuit via an encapsulated conductor.

39. The electrode array of claim 37 wherein the equipment module includes an LCP substrate.

40. The implantable electrode of claim 36 wherein the hybrid electronic circuit includes a hybrid substrate that is composed of LCP.

41. The implantable electrode of claim 40 wherein the hybrid substrate is integral with the second substrate.

42. The electrode array of claim 35 wherein the hybrid electronic circuit includes a hybrid substrate that is composed of LCP.

43. The electrode array of claim 42 wherein the hybrid substrate is integral with the second substrate.

44. An electrode array comprising

an LCP substrate having an electrode portion, an interconnect portion, and a hybrid circuit portion;

an electrode disposed on the surface of the electrode portion of the LCP substrate;

an electrode interconnect conductor disposed on the electrode portion of the LCP substrate, the conductor electrically connected to the electrode;

an interconnect conductor formed on the interconnect portion of the LCP substrate, the interconnect conductor electrically connected to the electrode interconnect conductor;

a hybrid circuit disposed on the hybrid circuit portion of the LCP substrate, the hybrid circuit electrically connected to the interconnect conductor formed on the interconnect portion of the LCP substrate;

an encapsulant covering the interconnect conductor formed on the interconnect portion of the LCP substrate, the electrode interconnect conductor formed on the electrode portion of the LCP substrate, the hybrid circuit, and covering a portion the electrode formed on the electrode portion of the LCP substrate, the encapsulant chemically bonded to the LCP substrate, wherein the encapsulated electrode interconnect conductor, the encapsulated interconnect conductor, the hybrid circuit and the encapsulated portion of the electrode are protected from an external environment.

45. The electrode array of claim 44 wherein the electrode portion of the LCP substrate includes two or more shafts formed with the LCP substrate, and each of the at least two shafts includes at least one electrode disposed on the surface of the respective shaft, and wherein the electrode interconnect conductor includes a number of electrode interconnect conductors corresponding to the number of electrodes, and wherein the interconnect conductor includes a number of interconnect conductors corresponding to the number of electrode interconnect conductors.

46. The electrode array of claim 45 wherein the encapsulant is a silicone encapsulant.

47. The electrode array of claim 45 wherein the encapsulant is an LCP encapsulant.

48. The electrode array of claim 45 further including an equipment module electrically coupled to the hybrid circuit.

49. The electrode array of claim 48 wherein the equipment module is electrically coupled to the hybrid circuit via an encapsulated conductor.

50. The electrode array of claim 49 wherein the hybrid electronic circuit includes a hybrid substrate that is composed of LCP.

51. The implantable electrode of claim 50 wherein the hybrid substrate is integral with the LCP substrate.

52. The implantable electrode of claim 48 wherein the equipment module is a percutaneous connector.

53. The electrode array of claim 52 wherein the percutaneous connector includes an LCP substrate.

54. The implantable electrode of claim 48 wherein the equipment module is a telemetry module.

55. The electrode array of claim 54 wherein the telemetry module includes a substrate that is LCP.

56. The electrode array of claim 54 wherein the equipment module includes an LCP substrate.

57. The electrode array of claim 48 wherein the equipment module includes a an LCP substrate.

58. A micro-wire electrode array comprising:

an LCF substrate;

a plurality of electrodes disposed on the surface of the LCP substrate;

a plurality of interconnecting conductors corresponding to the plurality of electrodes, wherein an electrode is electrically connected to a corresponding interconnecting conductor and wherein the LCP substrate is approximately 100 micrometers wide and 25 micrometers thick.