Method and apparatus for the transport and tracking of an electronic component

• US 6,644,982 B1
• Filed: 03/01/1999
• Issued: 11/11/2003
• Est. Priority Date: 12/04/1998
• Status: Expired due to Fees

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Ondricek, Douglas S., Pedersen, David V.
• Primary Examiner(s): Abrams, Neil
• Application Number:
  US09/260,466
• Time in Patent Office: 1,716 Days
• Field of Search: 439/73, 439/70, 439/525, 439/526, 206/724, 206/725, 361/807, 361/810, 361/767, 174/52.4
• US Class Current: 439/73
• CPC Class Codes: G01R 1/0408 Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets G01R1/067 takes precedence; mass production testing systems G01R31/59; testing of connections G01R31/66; for testing printed circuit boards G01R31/2808
• CPC Class Codes: G01R 1/0433 Sockets for IC's or transistors
• CPC Class Codes: G01R 1/0466 concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
• CPC Class Codes: G01R 31/01 Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station testing of cables continuously passing the testing apparatus G01R31/59; testing dielectric strength or breakdown voltage G01R31/12
• CPC Class Codes: G01R 31/2863 Contacting devices, e.g. sockets, burn-in boards or mounting fixtures in general G01R1/04
• CPC Class Codes: G01R 31/2867 Handlers or transport devices, e.g. loaders, carriers, trays
• CPC Class Codes: G01R 31/2893 Handling, conveying or loading, e.g. belts, boats, vacuum fingers G01R31/2867 takes precedence; handling semiconductor devices or wafers during manufacture or treatment H01L21/67
• CPC Class Codes: H01L 21/67294 using identification means, e.g. labels on substrates or labels on containers
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/72 Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 2224/73251 on different surfaces
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/32 Holders for supporting the complete device in operation, i.e. detachable fixtures H01L23/40 takes precedence
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 24/72 Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H05K 2201/09472 : Recessed pad for surface mounting recess in pad H05K2201/09745; Recessed electrode of component
• CPC Class Codes: H05K 3/325 : by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308

Abstract

An apparatus for use in manipulating one or more IC die through testing after they have been cut from the original wafer. A carrier supports the die during the transport, testing, and/or final application. The die is placed into the carrier through an opening and then resides on a ledge lining some portion of the base of the opening. The spring components of the die extend downward through the opening and past the lower side of the ledge to allow for electrical contact. The die may be secured within the carrier opening in a variety of ways, including a cover coupled to the top of the carrier or through use of snap locks in the carrier. One useful cover has openings revealing a portion of the backside of the die. The cover openings allow access to the backside of the die. The carrier can be mounted onto a test bed for testing or a printed circuit board for a specific application. Alternatively, the carrier may first be positioned on the board with the die and the cover subsequently mounted thereon. Carrier standoffs for protection of leads and identification labels and marks for carrier and die may be used.

Claims

1. An apparatus comprising:

a test bed comprising positioning holes and a plurality of pads, each positioning hole including at least one sloped side wall;

a carrier comprising an opening, a ledge lining at least a portion of said opening, and stand offs corresponding to said positioning holes, said standoffs interacting with said sloped side walls before being completely positioned in said positioning holes such that said interconnected elements wipingly engage said test bed pads;

an unpackaged semiconductor die comprising a plurality of elongate, resilient interconnect elements, said die disposed within said carrier on said ledge such that said interconnect elements extend outside of said carrier through said opening to make electrical contact with said pads; and

a cover for retaining said die within said carrier.

2. The apparatus of claim 1, wherein both said carrier and said cover are comprised of an organic material.

3. The apparatus of claim 1, wherein said carrier is comprised of an organic material and said cover is comprised of a metallic material.

4. The apparatus of claim 1, wherein said cover further comprises a heat transfer medium.

5. The apparatus of claim 1, wherein said carrier is coupled to said cover by a plurality of mechanical components.

6. The apparatus of claim 5, wherein said mechanical components comprise at least one of screws, bolts, snaps, snap locks, and clamps.

7. The apparatus of claim 1, said carrier having eight of said openings.

8. The apparatus of claim 7, wherein said eight openings are positioned in a single row.

9. The apparatus of claim 7, wherein said eight openings are positioned in two rows of four openings.

10. The apparatus of claim 1 further comprising securing means for first temporarily securing said carrier to said test bed and then securing said carrier to a final application substrate.

11. The apparatus of claim 10, wherein said final application substrate comprises a printed circuit board.

12. The apparatus of claim 10, wherein said securing means compresses said interconnect elements less while temporarily securing said test bed than said securing means compresses said interconnect elements while securing said carrier to said final application substrate.

13. The apparatus of claim 1, wherein said cover includes an opening.

14. The apparatus of claim 13, wherein said cover includes a plurality of said openings.

15. The apparatus of claim 13, wherein said die includes a tracking mechanism that is accessible from outside said carrier through said opening in said cover.

16. The apparatus of claim 15, wherein said tracking mechanism comprises a tracking label.

17. The apparatus of claim 15, wherein said tracking mechanism comprises an EEPROM.

18. The apparatus of claim 15, wherein said tracking mechanism comprises a machine readable code.

19. The apparatus of claim 1 further including a plurality of said dice.

20. The apparatus of claim 19 further including a plurality of said openings in said carrier.

21. The apparatus of claim 19, wherein said tracking mechanism comprises an identification label on.

22. The apparatus of claim 21, wherein said identification label comprises an ink dot.

23. An apparatus comprising:

a carrier means for carrying a plurality of singulated semiconductor dice during testing of said dice, said carrier means having a plurality of openings and at least one ledge lining at least a portion of each of said openings;

a plurality of unpackaged semiconductor dice each having a plurality of elongate, resilient interconnect elements, each said dice disposed within said carrier means on said at least one ledge such that said interconnect elements of each of said dice extend outside of said carrier means through said openings;

retaining means for retaining said dice within said carrier means;

positioning means for positioning said carrier means on a substrate having a sloped section such that said contact elements wipe across pads on said substrate as said positioning means interacts with said sloped section of said substrate before the positioning means is completely positioned on said substrate; and

securing means for securing said carrier means to said substrate such that said contact elements are compressed against contact pads on said substrate and thereby make electrical contact with said contact pads.

24. The apparatus of claim 23, wherein said substrate is one of a test bed for testing said plurality of dice and a final application substrate.

25. The apparatus of claim 24, wherein said securing means compresses said interconnect elements less while securing said carrier to said test bed than said securing means compresses said interconnect elements while securing said carrier to said final application substrate.

26. The apparatus of claim 23, wherein said retaining means comprises a snap lock.

27. The apparatus of claim 23, wherein said retaining means comprises a cover.

28. The apparatus of claim 27, wherein said cover includes at least one opening.

29. The apparatus of claim 28, wherein each of said dice includes a tracking mechanism that is accessible from outside said through said at least one opening in said cover.