Method and structure for producing Z-axis interconnection assembly of printed wiring board elements

• US 6,645,607 B2
• Filed: 08/06/2002
• Issued: 11/11/2003
• Est. Priority Date: 04/12/2001
• Status: Active Grant

• Current Assignee: Globalfoundries US Incorporated (GlobalFoundries, Inc.)
• Original Assignee: International Business Machines Corporation
• Inventors: Curcio, Brian E., Farquhar, Donald S., Poliks, Mark D., Papathomas, Konstantinos I.
• Primary Examiner(s): LAM, CATHY FONG FONG
• Application Number:
  US10/213,646
• Publication Number:
  US 20020192444A1
• Time in Patent Office: 462 Days
• Field of Search: 428/209, 439/74, 439/65, 439/81, 439/82, 174/255, 174/259, 174/261, 174/264
• US Class Current: 428/209
• CPC Class Codes: H05K 2201/0959 Plated through-holes or plated blind vias filled with insulating material
• CPC Class Codes: H05K 2201/096 Vertically aligned vias, holes or stacked vias
• CPC Class Codes: H05K 2201/10378 Interposers
• CPC Class Codes: H05K 2203/0353 Making conductive layer thin, e.g. by etching
• CPC Class Codes: H05K 2203/0384 Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
• CPC Class Codes: H05K 2203/0554 Metal used as mask for etching vias, e.g. by laser ablation
• CPC Class Codes: H05K 2203/063 of preperforated insulating layer
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: H05K 3/4069 for via connections in organic insulating substrates
• CPC Class Codes: H05K 3/462 characterized by laminating only or mainly similar double-sided circuit boards
• CPC Class Codes: H05K 3/4623 the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards H05K3/462 takes precedence
• CPC Class Codes: H05K 3/4641 having integrally laminated metal sheets or special power cores
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 428/24917 including metal layer

Abstract

A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed through the substrate extending from one face to the other and through each conductive coating. An electrically conductive material is dispensed in each of the openings extending through the conducting coating. At least a portion of the surface of the conductive coating on one face is removed to allow a nub of the conductive material to extend above the substrate face and any remaining conductive material to thereby form a core that can be electrically joined face-to-face with a second core member or other circuitized structure.

Claims

1. A core member for joining to at least one additional structure to form a wiring board composite comprising:

a dielectric substrate having first and second opposite faces and at least one through opening extending between said opposite faces;

electrically conductive material disposed in each of said openings having a nub extending beyond the opposite faces to thereby form an extended conductive material for electrically connecting to another core member, said electrically conductive material being sufficiently pliable to bond to similar electrically conductive material in another core member.

2. The invention as defined in claim 1 wherein said electrically conductive material is an electrically conductive adhesive.

3. The invention as defined in claim 1 wherein said electrically conductive material is a filled thermoset or thermoplastic polymer.

4. The invention as defined in claim 2 wherein said electrically conductive adhesive is a filled polymer.

5. The invention as defined in claim 3 wherein the polymer is a thermoset and is cured to between about 20% and about 80% of complete cure.

6. The invention as defined in claim 4 wherein the adhesive is a filled epoxy.

7. The invention as defined in claim 1 wherein said through openings include conductive material plated on the surfaces thereof.

8. The invention as defined in claim 1 wherein conductive traces are formed on at least one face thereof.

9. The invention as defined in claim 8 wherein the nub of said electrically conductive material extends beyond the conductive traces.

10. The invention as defined in claim 9 wherein the nub of said electrically conductive material contacts said electrically conductive traces.

11. The invention as defined in claim 9 wherein said conductive material is an electrically conductive adhesive.

12. The invention as defined in claim 11 wherein said electrically conductive adhesive is a filled polymer.

13. The invention as defined in claim 12 wherein the polymer is a thermoset and is cured to between about 20% and about 80% of complete cure.

14. The invention as defined in claim 12 wherein the adhesive is a filled epoxy.