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Method and structure for producing Z-axis interconnection assembly of printed wiring board elements

  • US 6,645,607 B2
  • Filed: 08/06/2002
  • Issued: 11/11/2003
  • Est. Priority Date: 04/12/2001
  • Status: Active Grant
First Claim
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1. A core member for joining to at least one additional structure to form a wiring board composite comprising:

  • a dielectric substrate having first and second opposite faces and at least one through opening extending between said opposite faces;

    electrically conductive material disposed in each of said openings having a nub extending beyond the opposite faces to thereby form an extended conductive material for electrically connecting to another core member, said electrically conductive material being sufficiently pliable to bond to similar electrically conductive material in another core member.

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