Wafer stage for wafer processing apparatus and wafer processing method

• US 6,646,233 B2
• Filed: 03/05/2002
• Issued: 11/11/2003
• Est. Priority Date: 03/05/2002
• Status: Expired due to Fees

• Current Assignee: Hitachi High-Technologies Corporation (Hitachi, Ltd.)
• Original Assignee: Hitachi High-Technologies Corporation (Hitachi, Ltd.)
• Inventors: Nishio, Ryoji, Kanno, Seiichiro, Kihara, Hideki, Okuda, Koji, Kanai, Saburou, Yoshioka, Ken
• Primary Examiner(s): Walberg, Teresa
• Assistant Examiner(s): Fuqua, Shawntina T.
• Application Number:
  US10/087,747
• Publication Number:
  US 20030168439A1
• Time in Patent Office: 616 Days
• Field of Search: 219/390, 219/405, 219/411, 118/724, 118/725, 118/728, 118/50.1, 392/416, 392/418
• US Class Current: 219/390
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/6831 using electrostatic chucks

Abstract

A wafer stage for use in wafer processing apparatus which comprises a liquid cooling jacket with a built-in coolant liquid circulation path and a ceramic plate that is attached onto the liquid cooling jacket and has therein a heater and an electrode for electrostatic chuck use, the wafer stage performing wafer processing while letting a wafer be mounted on the ceramic plate, wherein the liquid cooling jacket permits attachment of the ceramic plate through a coolant gas circulating gap as formed over the liquid cooling jacket while disposing between the liquid cooling jacket and the ceramic plate more than one heat resistant seal material containing therein an elastic body for sealing the coolant gas.

Claims

1. A wafer stage for use in a wafer processing apparatus comprising a liquid cooling jacket with a built-in coolant liquid circulation path and a ceramic plate as attached onto said liquid cooling jacket and having therein a heater and an electrode for an electrostatic chuck, said wafer stage being for performing wafer processing while letting a wafer be mounted on the ceramic plate,

wherein said liquid cooling jacket permits attachment of said ceramic plate through a gap for circulation of a coolant gas as formed over the liquid cooling jacket while disposing between said liquid cooling jacket and said ceramic plate a heat resistant seal material containing therein an elastic body for sealing said coolant gas, and

wherein said ceramic plate is attached to the liquid cooling jacket by more than one adhesive clamping element made of zirconia ceramic material.

2. A wafer stage for use in a wafer processing apparatus comprising a liquid cooling jacket with a built-in coolant liquid circulation path and a ceramic plate as attached onto said liquid cooling jacket and having therein a heater and an electrode for an electrostatic chuck, said wafer stage being for performing wafer processing while letting a wafer be mounted on the ceramic plate,

wherein said liquid cooling jacket permits attachment of said ceramic plate through a gap for circulation of a coolant gas as formed over the liquid cooling jacket while disposing between said liquid cooling jacket and said ceramic plate a heat resistant seal material containing therein an elastic body for sealing said coolant gas, and

wherein any one of said heater and the electrode for electrostatic chuck comprises a cylindrical plug as built in the ceramic plate and a stem-like terminal with a spring member insertable into the cylindrical member being engaged therewith.