Sandwich-structured intelligent power module

• US 6,646,884 B1
• Filed: 04/04/2002
• Issued: 11/11/2003
• Est. Priority Date: 05/31/1999
• Status: Expired due to Fees

• Current Assignee: EM Holdings (Luxembourg) S.a.r.l.
• Original Assignee: Tyco Electronics Logistics AG (TE Connectivity Limited)
• Inventors: Winkens, Bernd, Frisch, Michael
• Primary Examiner(s): Martin, David
• Assistant Examiner(s): BUI, HUNG S
• Application Number:
  US09/980,382
• Time in Patent Office: 586 Days
• Field of Search: 361/728, 361/770, 361/783, 361/792, 361/799, 361/679, 361/697, 361/702, 361/709, 361/711, 361/760, 361/715
• US Class Current: 361/728
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 2201/048 Second PCB mounted on first PCB by inserting in window or holes of the first PCB
• CPC Class Codes: H05K 2201/09172 Notches between edge pads
• CPC Class Codes: H05K 2201/09645 Patterning on via walls; Plural lands around one hole
• CPC Class Codes: H05K 3/366 substantially perpendicularly to each other H05K3/361 takes precedence

Abstract

The power substrate is inserted in a housing (1) as base plate and together with the same forms a standardized power part from whose top side (11) there are projecting terminal pins (5) which are soldered by through-soldering to via holes of the board (4). The circuit board (4), in a strip portion (6) thereof that remains free, has contact pads (7) as control and power terminals by means of which the module can be soldered directly into the slot-like opening of a system circuit board (8).

Claims

1. An intelligent power module having control and power terminals, in which a board is arranged in a second plane parallel to a power substrate being arranged in a first plane and having at least one power semiconductor component, the power substrate being inserted as a base plate into a housing of electrically insulating material so that the power substrate and the housing, forms a power part with a plurality of terminal pins facing the board and extending through the board via a plurality of holes, said holes being arranged proximate an edge portion of the board;

said terminal pins being soldered by through soldering to said holes of the board, with at least a strip portion along one edge of the board being left free from the holes and control components; and

said board, on a second edge, has contact pads as control and power terminals by means of which the module can be soldered directly into the slot-like opening of a system circuit board, wherein control components are arranged in a portion of the board that is located directly opposite the top surface of said at least one power semiconductor component.

2. An intelligent power module according to claim 1, wherein the board projects beyond the top side of the power part on all sides.

3. An intelligent power module, comprising:

a housing of electrically insulating material;

a power substrate having at least one power semiconductor component, the power substrate being positioned within said housing and, together with the housing forming a power part, said power substrate being arranged in a first plane;

terminal pins projecting from a top side of said power part;

a board arranged in a second plane parallel to said power substrate with said terminal pins being soldered by through soldering to the holes of the board, with at least a strip portion along an outer side of the board being left free from the holes and control components; and

contact pads provided on the outer side of the board, as control and power terminals, profiled such that the module can be soldered directly into slot-like opening of a system circuit board;

wherein the control components are arranged in a portion of the board that is located directly opposite the top surface of said at least one power semiconductor substrate.

4. An intelligent power module according to claim 3, wherein the board projects beyond the top side of the power part on all sides.