Heat sink-type cooling device

• US 6,648,062 B2
• Filed: 07/30/2001
• Issued: 11/18/2003
• Est. Priority Date: 07/31/2000
• Status: Expired due to Fees

• Current Assignee: Honda Giken Kogyo Kabushiki Kaisha (Honda Motor Company)
• Original Assignee: Honda Giken Kogyo Kabushiki Kaisha (Honda Motor Company)
• Inventors: Fukazu, Tomohiro, Yamagishi, Tomoya, Koike, Hirotomo
• Primary Examiner(s): Bennett, Henry
• Assistant Examiner(s): Duong, Tho V
• Application Number:
  US09/916,322
• Publication Number:
  US 20020011327A1
• Time in Patent Office: 841 Days
• Field of Search: 165/80.4, 165/109.1, 165/153, 165/177, 361/699, 257/714
• US Class Current: 165/80.3
• CPC Class Codes: F28F 3/04 the means being integral with the element
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

A heat sink-type cooling device is provided which can enhance the amount of heat dissipated without increasing the size of the fins, and which is miniaturized and has high cooling capacity. A heat sink-type cooling device comprises a heat sink that is provided with a passage through which coolant flows, and that removes heat from electronic devices contacting with the upper surface of the heat sink. Fin groups are provided in the passage, each of which is comprised of a plurality of fins that are disposed in parallel with the direction of the coolant flow and are aligned in the thickness direction thereof. Fins of a fin group and other fins of another fin group adjoining the fin group in the direction of the flow are placed at a distance in the thickness direction of the fins.

Claims

1. A heat sink-type cooling device comprising:

a heat sink which is provided with a passage through which coolant flows, and a plurality of discrete fin groups being relocatable within the passage, each fin group being comprised of a plurality of fins that are disposed in parallel with a direction of the flow,

wherein the heat sink removes heat from a heat source which contacts with a surface of the heat sink, and the fin groups are arranged discretely in the direction of the flow to obtain increased performance by relocating the fin groups, and a fin of a fin group and another fin of another fin group adjoining to the fin group in the direction of the flow are arranged at an offset distance in the thickness direction of the fins, and adjoining fin groups contact with each other in the direction of the flow.

2. A heat sink-type cooling device according to claim 1, wherein a surface of the heat sink is provided with a heat source arrangement portion for arranging the heat source at the position closest to the fin groups.

3. A heat sink-type cooling device according to claim 1, wherein the fin groups are arranged in a manner such that coolant flow from two adjoining spaces formed by three adjoining fins of the upstream fin group joins at a space between adjoining fins of the downstream fin group to make the coolant flow turbulent.

4. A heat sink-type cooling device according to claim 1, wherein the fin groups are arranged in a manner such that the coolant flowing near a surface of the fins of an upstream fin group flows at portions distant from the surface of the fins of a downstream fin group contacting the upstream fin group in the direction of the flow, and a part of the coolant flowing at spaces between the fins of the upstream fin group flow near the surface of the fins of the downstream fin group.

5. A heat sink-type cooling device according to claim 1, wherein the pitch of the fin is made as narrow as possible and the thickness of the fin is made as thick as possible without blocking the flow.