High temperature tag having enclosed transceiver

• US 6,648,232 B1
• Filed: 10/24/2000
• Issued: 11/18/2003
• Est. Priority Date: 10/24/2000
• Status: Expired due to Term

• Current Assignee: Moore North America Incorporated (RR Donnelley & Sons Company)
• Original Assignee: Moore North America Incorporated (RR Donnelley & Sons Company)
• Inventors: Emmert, David R.
• Primary Examiner(s): Lee, Diane I.
• Assistant Examiner(s): RIZKALLAH, KIMBERLY NGUYEN
• Application Number:
  US09/694,573
• Time in Patent Office: 1,120 Days
• Field of Search: 235/488, 235/480, 235/492
• US Class Current: 235/488
• CPC Class Codes: B31D 1/027 involving, marking, printing or coding
• CPC Class Codes: B31D 1/028 Applying RFID chips
• CPC Class Codes: G06K 19/041 Constructional details G06K19/06 takes precedence
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/0773 the record carrier comprising means to protect itself against external heat sources
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A high temperature RFID tag is provided that is adapted to receive thermal transfer print to provide indicia on an outer surface thereof and adapted to be disposed on a part that is subject to high temperature exposure. The RFID tag is formed as a lamination of a high temperature material such as high temperature polyester and including a window for an RFID generator component, a layer of high temperature resistant material that overlies the opening, and an adhesive material disposed in the window to secure the RFID generator component therein. The layer of high temperature resistant material is preferably transparent so that the indicia can be seen therethrough.

Claims

1. A process for forming a high temperature tag having at least one electronic component, comprising the steps of:

providing a heat resistant base material having an upper limit temperature so as to maintain form and integrity to a temperature in the range from about 300°

F. to 700°

F.;

cutting a window in said base material;

securing a heat resistant layer to a first surface of said base material so that said layer overlies at least a portion of said window, said heat resistant layer having an upper limit temperature so as to maintain form and integrity to a temperature in the range from about 300°

F. to 700°

F.;

disposing an adhesive material on at least a portion of said layer exposed in said window of said base material; and

applying said electronic component to an open end of said window so that said electronic device is adhered by said adhesive in said window.

2. A process for forming a high temperature tag as in claim 1, wherein said heat resistant layer has an adhesive applied to at least select portions of a first surface thereof thereby to secure said heat resistant layer to said base material and to dispose said adhesive material in said window.

3. A process for forming a high temperature tag as in claim 1, wherein said base material is a high temperature polyester.

4. A process for forming a high temperature tag as in claim 1, wherein said heat resistant layer is translucent, at least in part.

5. A process for forming a high temperature tag as in claim 4, wherein said heat resistant layer is transparent, at least in part.

6. A process for forming a high temperature tag as in claim 1, wherein said heat resistant layer is a clear, high temperature polyester.

7. A process for forming a high temperature tag as in claim 1, wherein said heat resistant layer has a width generally corresponding to a width of said base material.

8. A process for forming a high temperature tag as in claim 7, wherein said heat resistant layer has an adhesive applied to substantially the entire first surface thereof thereby to secure said heat resistant layer to said base material and to dispose said adhesive material in said window.

9. A process for forming a high temperature tag as in claim 1, further comprising printing indicia on at least one surface of said base material.

10. A process for forming a high temperature tag as in claim 9, wherein said printing step precedes said securing step.

11. A process for forming a high temperature tag as in claim 9, wherein said printing step precedes said applying step.