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High temperature tag having enclosed transceiver

  • US 6,648,232 B1
  • Filed: 10/24/2000
  • Issued: 11/18/2003
  • Est. Priority Date: 10/24/2000
  • Status: Expired due to Term
First Claim
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1. A process for forming a high temperature tag having at least one electronic component, comprising the steps of:

  • providing a heat resistant base material having an upper limit temperature so as to maintain form and integrity to a temperature in the range from about 300°

    F. to 700°

    F.;

    cutting a window in said base material;

    securing a heat resistant layer to a first surface of said base material so that said layer overlies at least a portion of said window, said heat resistant layer having an upper limit temperature so as to maintain form and integrity to a temperature in the range from about 300°

    F. to 700°

    F.;

    disposing an adhesive material on at least a portion of said layer exposed in said window of said base material; and

    applying said electronic component to an open end of said window so that said electronic device is adhered by said adhesive in said window.

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