Thermally conductive dielectric mounts for printed circuitry and semi-conductor devices and method of preparation
First Claim
1. The method of preparing a thermally conductive circuit mounting pad for use in combination with heat generating semi-conductor devices which includes the steps of:
- (a) preparing a dispersion of thermoplastic polymer resin having a glass transition temperature greater than 170°
C. and selected from the group consisting of polysulfone (PS), poly-ethersulfone (PES), poly-phenylsulfone (PPSU), and poly-etherimides (PI);
(b) providing first and second metallic members, said first metallic member having a first side and a generally opposing second side, and said second metallic member having a first side and a generally opposing second side;
(c) applying a coating of said dispersion onto said first side of said first metallic member and said second side of said second metallic member;
(d) drying said dispersion coatings to create adherent thermoplastic films on the respective sides of said first and second metallic members;
(e) positioning said first and second metallic members such that said first side of said first metallic member is in facing relationship with said second side of said second metallic member such that the respective thermoplastic films are in face-to-face contact with one another to form a multiple metallic layer pad; and
(f) subjecting said multiple metallic layer pad to a temperature above about 250°
C., and an external pressure of between about 100 psi and 800 psi for a period of greater than 30 minutes to thereby cause said thermoplastic films to commingle and merge into a single uniform thermoplastic film that bondedly secures said two metallic members to one another.
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Accused Products
Abstract
Methods and formulations for use in preparing thermally conductive dielectric mounts for heat generating semi-conductor devices and associated circuitry. The formulations include a thermoplastic resin selected from the group consisting of polysulfone, poly-ethersulfone, poly-phenylsulfone, and poly-etherimides, with these resins being applied as a dispersion onto the surfaces of opposed metallic members. The dispersion is dried and thereafter treated under heat and pressure at temperatures greater than the glass transition temperature under unit pressures of between 100 psi and 800 psi and for periods in excess of about 30 minutes. The polymer resin may be filled with solid particulate such as alumina and/or boron nitride.
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Citations
10 Claims
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1. The method of preparing a thermally conductive circuit mounting pad for use in combination with heat generating semi-conductor devices which includes the steps of:
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(a) preparing a dispersion of thermoplastic polymer resin having a glass transition temperature greater than 170°
C. and selected from the group consisting of polysulfone (PS), poly-ethersulfone (PES), poly-phenylsulfone (PPSU), and poly-etherimides (PI);
(b) providing first and second metallic members, said first metallic member having a first side and a generally opposing second side, and said second metallic member having a first side and a generally opposing second side;
(c) applying a coating of said dispersion onto said first side of said first metallic member and said second side of said second metallic member;
(d) drying said dispersion coatings to create adherent thermoplastic films on the respective sides of said first and second metallic members;
(e) positioning said first and second metallic members such that said first side of said first metallic member is in facing relationship with said second side of said second metallic member such that the respective thermoplastic films are in face-to-face contact with one another to form a multiple metallic layer pad; and
(f) subjecting said multiple metallic layer pad to a temperature above about 250°
C., and an external pressure of between about 100 psi and 800 psi for a period of greater than 30 minutes to thereby cause said thermoplastic films to commingle and merge into a single uniform thermoplastic film that bondedly secures said two metallic members to one another.- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification