Method and apparatus providing focal plane array active thermal control elements

• US 6,649,913 B1
• Filed: 02/26/2002
• Issued: 11/18/2003
• Est. Priority Date: 02/26/2002
• Status: Expired due to Term

• Current Assignee: Raytheon Company (Rtx Corporation)
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Ray, Michael, Kennedy, Adam M., Wyles, Richard H., Wyles, Jessica K., Radford, William A.
• Primary Examiner(s): Hannaher, Constantine
• Assistant Examiner(s): Gabor, Otilia
• Application Number:
  US10/084,687
• Time in Patent Office: 630 Days
• Field of Search: 250/352, 250/353, 250/339.03, 250/339.04, 250/370.15, 250/349, 250/330, 250/332, 250/342, 250/338.1, 250/338.4, 250/252.1
• US Class Current: 250/352
• CPC Class Codes: G01J 5/061 by controlling the temperature of the apparatus or parts thereof, e.g. using cooling means or thermostats
• CPC Class Codes: G01J 5/20 using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
• CPC Class Codes: H04N 5/33 Transforming infrared radiation cameras or camera modules for generating image signals from infrared radiation H04N23/20; circuitry of SSIS for transforming infrared radiation into image signals H04N25/20

Abstract

A focal plane array (FPA) of infrared (IR) radiation detectors (20), such as an array of microbolometers, includes an active area (20A) containing a plurality of IR radiation detectors, a readout integrated circuit (ROIC) (12) that is mechanically and electrically coupled to the active area and, disposed on the ROIC, a plurality of heater elements (30A) that are located and operated so as to provide a substantially uniform thermal distribution across at least the active area. The FPA further includes a plurality of temperature sensors (30B), individual ones of which are spatially associated with one of the heater elements for sensing the temperature in the vicinity of the associated heater element for providing closed loop operation of the associated heater element. In one embodiment pairs of the heater elements and associated temperature sensors are distributed in a substantially uniform manner across at least a top or a bottom surface of the ROIC, while in another embodiment pairs of the heater elements and associated temperature sensors, or only the heater elements, are distributed in accordance with a predetermined thermal profile of the FPA. The plurality of heater elements may each be composed of a silicon resistance, and the plurality of temperature sensors may each be each composed of a silicon temperature sensor.

Claims

1. A focal plane array (FPA) of infrared (IR) radiation detectors, comprising:

an active area comprised of a plurality of IR radiation detectors;

a readout integrated circuit (ROIC) that is mechanically and electrically coupled to said active area; and

disposed on said ROIC, a plurality of heater elements that are located and operated so as to provide a substantially uniform temperature across at least said active area.

2. A FPA as in claim 1, and further comprising a plurality of temperature sensors individual ones of which are spatially associated with at least one of said heater elements for sensing the temperature in the vicinity of said associated heater element for providing closed loop operation of said associated heater element.

3. A FPA as in claim 2, wherein pairs of said heater elements and associated temperature sensors are distributed in a substantially uniform manner across at least a first surface of said ROIC.

4. A FPA as in claim 3, wherein said first surface is a surface that underlies said active area.

5. A FPA as in claim 3, wherein said first surface is a surface that is opposite a second surface that underlies said active area.

6. A FPA as in claim 3, wherein pairs of said heater elements and associated temperature sensors are distributed in accordance with a predetermined thermal profile of said FPA across at least a first surface of said ROIC.

7. A FPA as in claim 6, wherein said first surface is a surface that underlies said active area.

8. A FPA as in claim 6, wherein said first surface is a surface that is opposite a second surface that underlies said active area.

9. A FPA as in claim 2, wherein said plurality of heater elements are each comprised of a silicon resistance, and wherein said plurality of temperature sensors are each comprised of a silicon temperature sensor.

10. A FPA as in claim 1, wherein said plurality of heater elements are distributed in accordance with a predetermined thermal profile of said FPA across at least a first surface of said ROIC.

11. A FPA as in claim 1, wherein said plurality of IR radiation detectors are each comprised of a microbolometer structure.

12. A method for operating a focal plane array (FPA) of infrared (IR) radiation detectors, comprising:

providing the FPA so as to be comprised of an active area comprised of a plurality of IR radiation detectors and a readout integrated circuit (ROIC) that is mechanically and electrically coupled to the active area, the FPA exhibiting a non-uniform thermal distribution during operation; and

during the operation of the FPA, operating a plurality of heater elements that are disposed on the ROIC so as to provide a substantially uniform distribution of temperature across at least the active area.

13. A method as in claim 12, where the step of operating also operates a plurality of temperature sensors individual ones of which are spatially associated with at least one of the heater elements for sensing the temperature in the vicinity of the associated heater element for providing closed loop operation of the associated heater element.

14. A method as in claim 13, wherein pairs of the heater elements and associated temperature sensors are distributed in a substantially uniform manner across at least one surface of the ROIC.

15. A method as in claim 13, wherein pairs of the heater elements and associated temperature sensors are distributed in accordance with a predetermined thermal profile of the FPA across at least a first surface of said ROIC.

16. A method as in claim 12, wherein the plurality of IR radiation detectors are each comprised of a microbolometer structure.

17. A focal plane array (FPA) of radiation detectors, comprising:

an active area comprised of an array of microbolometers;

a readout integrated circuit (ROIC) that is mechanically and electrically coupled to said active area; and

a plurality of temperature sensors and heater elements coupled together for operating in a closed loop manner for substantially minimizing a temperature gradient across at least said active area.

18. A FPA as in claim 17, wherein pairs of said heater elements and associated temperature sensors are distributed across at least a first surface of said ROIC in a substantially uniform manner.

19. A FPA as in claim 17, wherein pairs of said heater elements and associated temperature sensors are distributed across at least a first surface of said ROIC in accordance with a predetermined thermal profile.