Semiconductor pressure sensor decreasing creep stress in <110> crystalline axis direction

• US 6,649,988 B2
• Filed: 04/16/2002
• Issued: 11/18/2003
• Est. Priority Date: 05/10/2001
• Status: Expired due to Fees

• Current Assignee: DENSO Corporation, Nippon Soken, Inc.
• Original Assignee: DENSO Corporation, Nippon Soken, Inc.
• Inventors: Yoshida, Takahiko, Toyoda, Inao, Oda, Kiyonari
• Primary Examiner(s): Zarabian, Amir
• Assistant Examiner(s): Soward, Ida M.
• Application Number:
  US10/122,377
• Publication Number:
  US 20020167058A1
• Time in Patent Office: 581 Days
• Field of Search: 257/108, 257/414, 257/415, 257/417, 257/418, 257/419, 257/420, 257/252, 257/254, 257/619
• US Class Current: 257/417
• CPC Class Codes: G01L 9/0054 integral with a semiconducting diaphragm
• CPC Class Codes: H01L 29/045 by their particular orientation of crystalline planes
• CPC Class Codes: H01L 29/84 controllable by variation of applied mechanical force, e.g. of pressure

Abstract

Metal wiring segments, which are located at peripheral positions of a diaphragm, are formed on a main surface of a thick portion of a semiconductor substrate. A ratio S/d is larger than 100, where an area of the diaphragm is S μm² and a thickness thereof is d μm. Further, a total area of the metal wiring segments arranged on first sides of the substrate is larger than total area of the metal wiring segments arranged on second sides of the substrate, where the first sides indicate the sides in parallel with <110> crystalline axis and the second sides indicate the sides in parallel with <100> crystalline axis.

Claims

1. A semiconductor pressure sensor comprising:

a rectangular semiconductor substrate having a (110) surface as a main surface;

a diaphragm formed on the main surface;

diffusion gauge resistors formed on the diaphragm for outputting a detection signal based on changes in resistance values thereof according to deformation of the diaphragm; and

metal wiring segments formed on the main surface of a thick portion of the substrate, which is a peripheral area of the diaphragm;

wherein, a ratio S/d is larger than 100, where an area of the diaphragm is S μ

m² and a thickness thereof is d μ

m,

a total area of the metal wiring segments arranged on first sides of the substrate is larger than a total area of the metal wiring segments arranged on second sides of the substrate, when the first sides indicate the sides in parallel with a <

110>

crystalline axis and the second sides indicate the sides in parallel with a <

100>

crystalline axis.

2. A semiconductor pressure sensor as in claim 1, wherein the metal wiring segments have a plurality of metal pads arranged on the thick portion for making external connections, and a total area of the metal pads arranged on the first sides is larger than a total area of the metal pads arranged on the second sides.

3. A semiconductor pressure sensor as in claim 1, wherein the metal wiring segments are placed on the first sides and the second sides and a width of the metal wiring segments placed on the first sides is wider than that of the metal wiring segments placed on the second sides.

4. A semiconductor pressure sensor as in claim 1, wherein the metal wiring segments are drawn over only the first sides.

5. A semiconductor pressure sensor comprising:

a rectangular semiconductor substrate having a (110) surface as a main surface, first sides in parallel with a <

110>

crystalline axis and second sides in parallel with a <

100>

crystalline axis;

a diaphragm formed on the main surface, wherein the substrate further has a thick portion formed around a periphery of the diaphragm;

diffusion gauge resistors formed on the diaphragm for outputting a detection signal based on changes in resistance values thereof according to deformation of the diaphragm; and

metal wiring segments formed on the thick portion of the substrate;

wherein, a ratio S/d is larger than 100 μ

m, where an area of the diaphragm is S μ

m² and a thickness thereof is d μ

m,

a total area of the metal wiring segments arranged closer to the first sides than the second sides is larger than a total area of the metal wiring segments arranged closer to the second sides than the first sides.

6. A semiconductor pressure sensor as in claim 5, wherein the metal wiring segments have a plurality of metal pads for making external connections and arranged on the thick portion, and all of the metal pads are arranged on the first sides closer than the second sides.