Temperature sensing system with matched temperature coefficients of expansion

• US 6,649,994 B2
• Filed: 06/20/2002
• Issued: 11/18/2003
• Est. Priority Date: 08/24/2000
• Status: Expired due to Term

• Current Assignee: Firebird Sensors, Inc.
• Original Assignee: Heetronix, Inc.
• Inventors: Parsons, James D.
• Primary Examiner(s): Flynn, Nathan J.
• Assistant Examiner(s): WILSON, SCOTT R
• Application Number:
  US10/175,940
• Publication Number:
  US 20030146502A1
• Time in Patent Office: 516 Days
• Field of Search: 257/467-470, 257/536, 257/537, 318/788, 318/792, 374/185, 438/54, 438/55, 438/48, 438/382, 338/18, 250/338.1
• US Class Current: 257/470
• CPC Class Codes: G01K 7/16 using resistive elements resistive elements per se H01C, H01L
• CPC Class Codes: H01C 7/022 mainly consisting of non-metallic substances H01C7/021 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A high temperature hybrid-circuit structure includes a temperature sensitive device which comprises SiC, AlN and/or Al_xGa_1−xN(x>0.69) connected by electrodes to an electrically conductive mounting layer that is physically bonded to an AlN die. The die, temperature sensitive device and mounting layer (which can be W, WC or W₂C) have temperature coefficients of expansion within 1.06 of each other. The mounting layer can consist entirely of a W, WC or W₂C adhesive layer, or an adhesive layer with an overlay metallization having a thermal coefficient of expansion not greater than about 3.5 times that of the adhesive layer. The device can be encapsulated with a reacted borosilicate mixture, with or without an upper die which helps to hold on lead wires and increases structural integrity. Applications include temperature sensors, pressure sensors, chemical sensors, and high temperature and high power electronic circuits.

Claims

1. A temperature sensitive system, comprising:

an operating system which relies upon a temperature sensing capability, and

a temperature sensitive structure connected to said operating system to provide said temperature sensing capability, said temperature sensitive structure comprising;

a die,

an electrically conductive mounting layer on said die, and

a temperature sensitive device comprising SiC, AlN and/or Al_xGa<sub>1−

x</sub>N(x>

0.69) on said mounting layer,

said mounting layer adhering said device to said die and having a temperature coefficient of expansion (TCE) within 1.00±

0.06 those of said die and device.

2. The temperature sensitive system of claim 1, wherein said mounting layer comprises a discontinuous layer having a plurality of mutually separated mounting elements that are connected to respective mutually separated portions of said device.

3. The temperature sensitive system of claim 1, wherein said die comprises AlN.

4. The temperature sensitive system of claim 3, wherein said mounting layer comprises W, WC and/or W₂C.

6. The temperature sensitive system of claim 4, further comprising electrically conductive lead wires electrically connected to said mounting layer and an encapsulation formed from a borosilicate mixture encapsulating said device, mounting layer and a portion of said lead wires.

8. The temperature sensitive system of claim 1, said operating system comprising a temperature sensor.

9. The temperature sensitive system of claim 1, said operating system comprising an electromagnetic radiation sensor.

10. The temperature sensitive system of claim 1, said operating system comprising a gas flow rate sensor.

11. The temperature sensitive system of claim 1, said operating system comprising a tank fluid level sensor.

12. The temperature sensitive system of claim 1, said operating system comprising a humidity sensor.

13. The temperature sensitive system of claim 1, said operating system comprising a chemical sensor.

14. The temperature sensitive system of claim 1, said operating system comprising a high temperature or high power electronic circuit.

5. A temperature sensitive system, comprising:

an operating system which relies upon a temperature sensing capability, and

a temperature sensitive structure connected to said operating system to provide said temperature sensing capability, said temperature sensitive structure comprising;

an AlN die,

an electrically conductive mounting layer on said die, and

a temperature sensitive device comprising SiC, AlN and/or Al_xGa<sub>1−

x</sub>N(x>

0.69) on said mounting layer,

said mounting layer adhering said device to said die and having a temperature coefficient of expansion (TCE) within 1.00±

0.06 those of said die and device, said mounting layer comprising a W, WC and/or W₂C adhesive layer adhered to said die, and a metallization layer adhered to said adhesive layer and bonded to electrodes on said device, said metallization layer having a thermal coefficient of expansion not greater than about 3.5 times that of said adhesive layer over a temperature range of interest.

7. A The temperature sensitive system, comprising:

an operating system which relies upon a temperature sensing capability, and

a temperature sensitive structure connected to said operating system to provide said temperature sensing capability, said temperature sensitive structure comprising;

an AlN die,

an electrically conductive mounting layer on said die, said mounting layer comprising W, WC and/or W₂C,

a temperature sensitive device comprising SiC, AlN and/or Al_xGa<sub>1−

x</sub>N(x>

0.69) on said mounting layer,

electrically conductive lead wires electrically connected to said mounting layer and an encapsulation formed from a borosilicate mixture encapsulating said device, mounting layer and a portion of said lead wires,

said mounting layer adhering said device to said die and having a temperature coefficient of expansion (TCE) within 1.00±

0.06 those of said die and device, and

a cover of the same material as said die extending over said device, mounting layer and a portion of said lead wires, and held to said die by said encapsulation.

15. A chemical sensor comprising:

a high temperature structure comprising;

a die,

an electrically conductive mounting layer in said die, and

a chemical sensitive device comprising SiC, AlN and/or Al_xGa<sub>1−

x</sub>N(x>

0.69) on said mounting layer, said mounting layer adhering said device to said die and having a temperature coefficient of expansion (TCE) within 1.00±

0.06 those of said die and device, and

an operating system which relies upon a chemical sensing capability, said high temperature structure connected to provide said capability to said operating system.

16. The chemical sensor of claim 15, wherein said mounting layer comprises a discontinuous layer having a plurality of mutually separated mounting elements that are connected to respective mutually separated portions of said device.

17. The chemical sensor of claim 15, wherein said die comprises AlN.

18. The chemical sensor of claim 17, wherein said mounting layer comprises W, WC and/or W₂C.

19. A chemical sensor, comprising:

a high temperature structure comprising;

a AlN die,

an electrically conductive mounting layer on said die, said mounting layer comprising W, WC and/or W₂C, and

a chemical sensitive device comprising SiC, AlN and/or Al_xGa<sub>1−

x</sub>N(x>

0.69) on said mounting layer, said mounting layer adhering said device to said die and having a temperature coefficient of expansion (TCE) within 1.00±

0.06 those of said die and device, and

an operating system which relies upon a chemical sensing capability, said high temperature structure connected to provide said capability to said operating system,

said mounting layer comprising a W, WC and/or W₂C adhesive layer adhered to said die, and a metallization layer adhered to said adhesive layer and bonded to electrodes on said device, said metallization layer having a thermal coefficient of expansion not greater than about 3.5 times that of said adhesive layer over a temperature range of interest.

20. A temperature dependent device, comprising:

an operating system which relies upon a substantially linear positive temperature coefficient of resistance (TCR), and

a doped SiC resistor connected to said operating system to provide said substantially linear positive TCR.

21. A The temperature dependent device, comprising:

an operating system which relies upon a substantially linear positive temperature coefficient of resistance (TCR), and

a doped SiC resistor connected to said operating system to provide said substantially linear positive TCR,

said temperature dependent device intended for operation within the temperature range of approximately 22°

C.-1,300°

C., wherein said SiC resistor is doped n-type.

22. A The temperature dependent device, comprising:

an operating system which relies upon a substantially linear positive temperature coefficient of resistance (TCR), and

a doped SiC resistor connected to said operating system to provide said substantially linear positive TCR,

said temperature dependent device intended for operation within a temperature range having a lower limit within the range of about 100°

C.-600°

C. and an upper limit of about 1,300°

C., wherein said SiC resistor is doped p-type.