Chip component assembly

• US 6,650,546 B2
• Filed: 02/27/2001
• Issued: 11/18/2003
• Est. Priority Date: 02/27/2001
• Status: Expired due to Fees

• Current Assignee: Hewlett Packard Enterprise Development LP (Hewlett-Packard Enterprise Company)
• Original Assignee: 3Com Corporation (HP Inc.)
• Inventors: Giles, Rick, Oliphant, David, Nelson, Jon A.
• Primary Examiner(s): Martin, David
• Assistant Examiner(s): Bui, Hung
• Application Number:
  US09/794,515
• Publication Number:
  US 20020118517A1
• Time in Patent Office: 994 Days
• Field of Search: 361/738, 361/766, 361/763, 361/799, 361/803, 361/807, 361/830, 361/736, 361/748, 361/753, 361/800, 361/818, 361/816, 174/35.R, 174/51.R
• US Class Current: 361/738
• CPC Class Codes: H05K 1/0231 Capacitors or dielectric substances
• CPC Class Codes: H05K 2201/10371 Shields or metal cases
• CPC Class Codes: H05K 2201/10492 Electrically connected to another device mounted components directly electrically connected to each other H05K2201/1053
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 5/0256 of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
• CPC Class Codes: H05K 9/0039 Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing printed shielding conductors, ground planes or power planes for reduction of cross-talk or noise in printed circuits H05K1/0218
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A chip component assembly is provided that includes a plurality of chip components each having respective first and second terminal elements, the first terminal elements being joined to corresponding solder pads on a printed circuit board, the solder pads being in communication with electronic circuitry of the printed circuit board, and the second terminal elements being joined together by an array ground plane of a grounding device. The grounding device additionally includes a ground path structure which physically and electrically connects the array ground plane, and thus the chip components, to a ground pad located on the printed circuit board so as to provide a ground path from the chip components. Preferably, the array ground plane additionally includes a plurality of resilient contact elements which provide for substantial and continuous contact between the array ground plane and an ancillary ground plane, such as the top cover of a PC card. The grounding device serves to foreclose electrostatic discharge or EMI by the chip components and in some applications further serves to direct undesirable noise to ground. The relatively small size of the grounding device permits the use of a relatively smaller ground pad on the printed circuit board, thereby conserving valuable printed circuit board surface area. Finally, the ground path structure is configured for automated attachment to the chip components, and the chip component assembly thus formed is well suited for installation on the printed circuit board by pick-and-place manufacturing techniques.

Claims

1. A chip component assembly suitable for use in connection with a printed circuit board that includes electronic circuitry and a ground pad disposed on a top surface of the printed circuit board, the printed circuit board being configured to be substantially disposed within a housing of an electronic component, the chip component assembly comprising:

an array of chip components, each chip component including respective first and second terminal elements, and each of the chip components being mounted to the top surface of the printed circuit board in an edgewise orientation and extending upwardly from the top surface of the printed circuit board so that the respective first terminal elements are joined at least indirectly to the top surface of the printed circuit board while each of the respective second terminal elements are disposed in a position above the top surface of the printed circuit board;

an array ground plane contacting each of the respective second terminal elements so that the array ground plane is interposed between the chip components and the housing when the chip component assembly is disposed in the housing, and the array ground plane being in contact with the housing when so disposed; and

a ground path structure configured and arranged to electrically connect the ground pad and the array ground plane.

2. The chip component assembly as recited in claim 1, wherein the array of chip components includes at least one of:

a tip capacitor;

a ring capacitor;

a chip semiconductor;

a high current impedance chip;

a chip inductor;

a chip capacitor;

a chip bead;

a chip resistor; and

, a chip filter.

3. The chip component assembly as recited in claim 1, wherein the array ground plane comprises a plurality of clips, each of said clips receiving a corresponding second terminal element of a chip component.

4. The chip component assembly as recited in claim 1, wherein the array ground plane comprises at least one resilient contact element configured and arranged to contact the housing when the chip component assembly is disposed within the housing.

5. The chip component assembly as recited in claim 1, wherein the ground path structure comprises a component selected from the group consisting of:

a dummy chip; and

, an integral grounding leg.

6. The chip component assembly as recited in claim 1, wherein the array ground plane substantially comprises solder coated phosphor bronze.

7. The chip component assembly as recited in claim 1, wherein the ground path structure is joined to one of the chip components by an adhesive.

8. The chip component assembly as recited in claim 1, wherein each chip component is joined to an adjacent chip component by an adhesive.

9. The chip component assembly as recited in claim 1, wherein the array ground plane comprises a single piece of material.