Multi-level waveguide

• US 6,650,817 B2
• Filed: 10/15/2002
• Issued: 11/18/2003
• Est. Priority Date: 12/29/2000
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Murali, Venkatesan
• Primary Examiner(s): Font, Frank G.
• Assistant Examiner(s): KIANNI, KAVEH C
• Application Number:
  US10/271,688
• Publication Number:
  US 20030174967A1
• Time in Patent Office: 399 Days
• Field of Search: 385/131, 385/2, 385/8, 385/14, 385/15, 385/25, 385/39, 385/129, 385/130, 385/132
• US Class Current: 385/131
• CPC Class Codes: G02B 6/12002 Three-dimensional structures
• CPC Class Codes: G02B 6/1221 made from organic materials
• CPC Class Codes: G02B 6/3644 the coupling means being through-holes or wall apertures
• CPC Class Codes: G02B 6/3672 with fibres arranged in a regular matrix array
• CPC Class Codes: G02B 6/3688 using laser ablation
• CPC Class Codes: G02B 6/3692 with surface micromachining involving etching, e.g. wet or dry etching steps surface micromachining involving subtractive techniques B81C1/00055
• CPC Class Codes: G02B 6/42 Coupling light guides with opto-electronic elements
• CPC Class Codes: G02B 6/4204 the coupling comprising intermediate optical elements, e.g. lenses, holograms encapsulated active devices H01S5/02208, H01L33/52
• CPC Class Codes: G02B 6/4224 using visual alignment markings, e.g. index methods
• CPC Class Codes: G02B 6/4249 comprising arrays of active devices and fibres
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections

Abstract

A multi-level waveguide to transmit light through a series of substrates. The multi-level waveguide is made up of stacked substrates, each containing a two dimensional array of transparent material filled vias. Transparent materials such as optical fiber, cladding, and gas may be used to provide a pathway for light. Optionally, a conductive layer may be deposited on a substrate in the multi-level waveguide. The conductive layer can then interact with the multi-level waveguide through light detecting devices such as photodetectors.

Claims

1. A method of making a multi-level waveguide comprising:

etching a hole in a first substrate;

etching a hole in a second substrate;

lithographically aligning said first substrate hole to said second substrate hole; and

attaching said first substrate to a second substrate, said first substrate hole and said second substrate hole together form said multi-level waveguide.

2. The method of claim 1 further comprising growing a cladding in said first substrate hole before lithographically aligning said first substrate hole to said second substrate hole.

3. The method of claim 1, further comprising:

radially growing a cladding on walls of said first substrate hole to a depth less than the first substrate hole'"'"'s radius; and

inserting transparent material having an index of refraction greater than an index of refraction of the cladding material into said first substrate hole before lithographically aligning said first substrate hole to said second substrate hole.

4. The method of claim 1, wherein said aligning comprises:

placing a solder bump on said first substrate relative to said first substrate hole;

placing a metal pad on said second substrate relative to said second substrate hole;

moving said first substrate and said second substrate relative to each other to contact said solder bump to said metal pad; and

melting said solder bump to said metal pad.

5. The method of claim 1, wherein said aligning comprises:

etching a marker hole in said first substrate relative to said first substrate hole;

etching a marker hole in said second substrate relative to said second substrate hole;

moving said first substrate and said second substrate relative to each other until a source of electromagnetic radiation radiates through said first substrate marker hole and said second substrate marker hole; and

detecting said source of electromagnetic radiation with a detector of electromagnetic radiation.

6. The method of claim 1 further comprising applying conductive layers on said first substrate.

7. A method of making a multi-level waveguide comprising:

etching a hole in a first substrate;

etching a hole in a second substrate;

heating said first substrate;

inserting an optical fiber into said first substrate hole;

lithographically aligning said first substrate to said second substrate; and

attaching said first substrate to said second substrate.

8. The method of claim 7, wherein said first substrate is heated to a temperature between approximately 75°

C. and 175°

C.

9. The method of claim 7 further comprising applying a conductive layer to said second substrate.

10. The method of claim 7, wherein said aligning comprises:

placing a solder bump on said first substrate relative to said first substrate hole;

placing a metal pad on said second substrate relative to said second substrate hole;

moving said first substrate and said second substrate relative to each other to contact said solder bump to said metal pad; and

melting said solder bump to said metal pad.

11. The method of claim 7, wherein said aligning comprises:

placing a solder bump on said first substrate relative to a first substrate optical fiber core;

placing a metal pad on said second substrate relative to a second substrate optical fiber core;

moving said first substrate and second substrate relative to each other to contact said solder bump to said metal pad; and

melting said solder bump to said metal pad.

12. The method of claim 7, wherein said aligning comprises:

etching a marker hole in said first substrate relative to at said first substrate hole;

etching a marker hole in said second substrate relative to said second substrate hole;

moving said first substrate and said second substrate relative to each other until a source of electromagnetic radiation radiates through said first substrate marker hole and said second substrate marker hole; and

detecting said source of electromagnetic radiation with a detector of electromagnetic radiation.

13. The method of claim 7, wherein said aligning comprises:

etching a marker hole in said first substrate relative to a first substrate optic fiber core;

etching a marker hole in said second substrate relative to a second substrate optic fiber core;

moving said first substrate and said second substrate relative to each other until a source of electromagnetic radiation radiates through said first substrate marker hole and said second substrate marker hole; and

detecting said source of electromagnetic radiation with a detector of electromagnetic radiation.