Systems and methods of monitoring thin film deposition

• US 6,651,488 B2
• Filed: 10/07/2002
• Issued: 11/25/2003
• Est. Priority Date: 04/23/2001
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Agilent Technologies, Inc.
• Inventors: Ko, Herbert L., Hueschen, Mark A., Larson, John D. III, Karlquist, Richard K., Carey, Kent W.
• Primary Examiner(s): Lefkowitz, Edward
• Assistant Examiner(s): CYGAN, MICHAEL T
• Application Number:
  US10/266,857
• Publication Number:
  US 20030041654A1
• Time in Patent Office: 414 Days
• Field of Search: 427/10, 73/645.3, 73/310.5, 73/240.6, 73/280.1, 73/616.2
• US Class Current: 73/61.62
• CPC Class Codes: C23C 14/546 using crystal oscillators
• CPC Class Codes: G01N 29/036 by measuring frequency or resonance of acoustic waves
• CPC Class Codes: G01N 29/30 Arrangements for calibrating or comparing, e.g. with standard objects
• CPC Class Codes: G01N 29/4436 with a reference signal amplitude comparison G01N29/48

Abstract

Systems and methods of monitoring thin film deposition are described. In one aspect, a thin film deposition sensor includes an acoustical resonator (e.g., a thin film bulk acoustical resonator) that has an exposed surface and is responsive to thin film material deposits on the exposed surface. A substrate clip may be configured to attach the thin film deposition sensor to a substrate. A transceiver circuit may be configured to enable the thin film deposition sensor to be interrogated wirelessly. A method of monitoring a thin film deposition on a substrate also is described.

Claims

1. A system for monitoring a thin film deposition on a substrate in a vacuum deposition chamber, comprising:

a thin film deposition sensor having an exposed surface and being responsive to thin film material deposits on the exposed surface; and

a substrate clip configured to attach the thin film deposition sensor to the substrate so that the thin film deposition sensor and the substrate are exposable to substantially similar conditions during the thin film deposition in the vacuum chamber.

2. The system of claim 1, wherein the substrate clip is operable to be clipped onto a peripheral edge of the substrate.

3. The system of claim 2, wherein the substrate clip is operable to be clipped onto a peripheral edge of a semiconductor wafer.

4. The system of claim 1, wherein the thin film deposition sensor comprises an acoustical resonator having an exposed surface and being responsive to thin film material deposits on the exposed surface.

5. The system of claim 4, the acoustical resonator is a thin film bulk acoustical resonator (FBAR).

6. The system of claim 5, wherein the thin film deposition sensor further comprises a second FBAR thermally coupled to the first acoustical resonator and shielded from deposition of thin film material.

7. The system of claim 6, wherein the first FBAR and the second FBAR are formed on a common semiconductor substrate.

8. The system of claim 6, wherein the first and second acoustical resonators are coupled electrically in series.

9. The system of claim 6, wherein the first and second acoustical resonators are coupled together by an electrical connection shielded from thin film material deposits.

10. The system of claim 6, wherein each of the first FBAR and the second FBAR has a thin film stack structure formed on a first surface of the semiconductor substrate and comprises a piezoelectric layer disposed between a pair of electrode layers, the first FBAR including an isolation cavity formed on a second surface of the semiconductor substrate opposite the first surface and a deposition shield disposed over the isolation cavity and having an exposed surface corresponding to the exposed surface of the first FBAR.

11. The system of claim 6, wherein each of the first FBAR and the second FBAR has a thin film stack structure formed on a first surface of the semiconductor substrate and comprises a piezoelectric layer disposed between a pair of electrode layers, the first FBAR including an isolation cavity extending through the semiconductor substrate to a second surface of the semiconductor substrate opposite the first surface, the thin film stack structure of second FBAR being disposed over an isolation cavity formed in the first surface of the semiconductor substrate.

12. The system of claim 6, further comprising a plurality of pairs of exposed and shielded acoustical resonators disposed on an elongated substrate.

14. The system of claim 12, wherein the FBARs of each pair are coupled electrically in series and the pairs of FBARs are inter-coupled electrically in parallel.

13. A system for monitoring a thin film deposition on a substrate, comprising:

a thin film deposition sensor having an exposed surface and being responsive to thin film material deposits on the exposed surface; and

a substrate clip configured to attach the thin film deposition sensor to the substrate, wherein the substrate clip comprises an antenna.

15. The system of claim 13, wherein the antenna is a loop antenna.

18. The system of claim 15, wherein the antenna is on the order of a few centimeters in size.

16. A system for monitoring a thin film deposition on a substrate, comprising:

a thin film deposition sensor having an exposed surface and being responsive to thin film material deposits on the exposed surface; and

a substrate clip configured to attach the thin film deposition sensor to the substrate, wherein the substrate clip comprises a transceiver circuit configured to enable the thin film deposition sensor to be interrogated wirelessly.

17. The system of claim 16, wherein the transceiver circuit comprises an opto-electronic transducer.

19. The system of claim 16, wherein the transceiver circuit is mounted within a thin film deposition chamber.

20. The system of claim 19, wherein the substrate clip comprises a first antenna and further comprising a second antenna coupled to the transceiver circuit.

21. The system of claims 20, wherein the second antenna is operable to transmit electromagnetic signals to the first antenna and to detect electromagnetic signals transmitted from the first antenna in response to excitation of the thin film deposition sensor by signals received from the second antenna.

22. The system of claim 16, wherein the transceiver circuit is an RFID tag circuit.

23. The system of claim 22, wherein the RFID circuit is electrically coupled to the thin film deposition sensor and comprises a power converter/transceiver, a modulator/demodulator circuit, a frequency discriminator, and a non-volatile memory.

24. A method of monitoring a thin film deposition on a substrate in a vacuum deposition chamber, comprising:

attaching a thin film deposition sensor to the substrate;

disposing the substrate and the attached thin film deposition sensor within the vacuum deposition chamber;

exposing the substrate and the attached thin film deposition sensor to a thin film deposition; and

interrogating the attached thin film deposition sensor to monitor the thin film deposition.

25. The method of claim 24, further comprising detaching the thin film deposition sensor from the substrate after the thin film deposition is complete.