Semiconductor wire bond machine leadframe thermal map system

• US 6,652,138 B2
• Filed: 07/18/2002
• Issued: 11/25/2003
• Est. Priority Date: 10/03/1997
• Status: Expired due to Fees

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Clyne, Craig T.
• Primary Examiner(s): Gibson, Randy
• Application Number:
  US10/198,817
• Publication Number:
  US 20020181538A1
• Time in Patent Office: 495 Days
• Field of Search: 374/137, 374/141, 374/161
• US Class Current: 374/137
• CPC Class Codes: G01K 11/20 using thermoluminescent materials G01K11/32 takes precedence
• CPC Class Codes: G01R 31/2853 Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections G01R31/31717 takes precedence; test of chip-to-PCB or lead-to-PCB connections G01R31/66
• CPC Class Codes: G01R 31/311 of integrated circuits G01R31/31728 takes precedence

Abstract

A method and apparatus for measuring the surface temperatures of wire-bonded semiconductor devices and the like for preparing thermal maps include a conventional ultrasonic wire bonding machine adapted for mounting a fluorescence-decay temperature sensor in the capillary holder. A trigger box circuit is provided to trigger a temperature measurement based on initiation of an electrical voltage signal from the ultrasonic wire bonding controller. A computer is provided for coordinating the stage control and temperature measurements, and for collating and plotting the temperature, time and location indications as thermal maps and other displayed/printed correlations.

Claims

1. An apparatus for measuring temperatures on at least a portion of a surface of an object for correlating measured temperatures with locations on said surface of said object, said apparatus comprising:

a wire bonding machine having a bonding arm and an ultrasonic bonding generator controller;

a sensor probe mount attached to said bonding arm of said wire bonding machine, said sensor probe mount including a plurality of members for a conductor mounted in a capillary holder attached to a portion of said bonding arm of said wire bonding machine;

a decay temperature sensor probe having a conductor having a sensing tip located on one end thereof and having an opposite signal output end, said decay temperature sensor probe attached to one member of said plurality of members of said sensor probe mount attached to said bonding arm of said wire bonding machine;

pulse generating apparatus connected to said opposite signal output end of said decay temperature sensor probe to generate a pulse through said conductor to material at said sensing tip and to receive from said opposite signal output end a signal representative of a temperature at said sensing tip;

an electronic trigger circuit connected to said wire bonding machine for initiating the generation of said pulse, said electronic trigger circuit initiating a signal for a temperature measurement upon receiving a voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;

thermometer apparatus for calculating a temperature indication from said signal representative of a temperature at said sensing tip;

stage apparatus attached to a portion of said wire bonding machine for mounting said object thereon;

control apparatus for manipulating a position of said stage apparatus relative to said sensing tip; and

computing apparatus having software for receiving said temperature indication and correlating and storing said temperature indication in machine-readable form as a function of one of time and location on said at least a portion of said surface of said object.

2. The apparatus of claim 1, wherein said sensor probe mount comprises a plurality of concentric tubular members connected together for passage of said conductor therethrough and attachment of said decay temperature sensor probe at one end thereof.

3. The apparatus of claim 1, wherein said computing apparatus comprises software for correlating said temperature indication with one of time and location on said surface of said object as a thermal map.

4. The apparatus of claim 1, wherein said sensor probe mount is mountable in a channel of a capillary holder.

5. The apparatus of claim 1, wherein said sensor probe mount is permanently mounted in a capillary holder removable from said bonding arm of said wire bonding machine.

6. An apparatus for mapping temperatures on at least a portion of a surface of an object and for correlating measured temperatures on said surface, said apparatus comprising:

a wire bonding machine including an arm and an ultrasonic bonding generator controller;

a sensor probe mount attached to said arm of said wire bonding machine, said sensor probe mount including a plurality of members for passage of a conductor therethrough mounted in a capillary holder on a portion of said arm;

a decay temperature sensor probe having a conductor having an end having a sensing tip thereon and an opposite signal output end, said decay temperature sensor probe attached to one member of said plurality of members of said sensor probe mount attached to said arm of said wire bonding machine;

pulse generating apparatus connected to said opposite signal output end of said conductor of said decay temperature sensor probe for generating a pulse of light through said conductor to material at said sensing tip and for receiving from said opposite signal output end a signal representative of a temperature at said sensing tip;

an electronic trigger circuit connected to said wire bonding machine for initiating the generation of said pulse of light, said electronic trigger circuit initiating a signal for a temperature measurement upon receiving a voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;

thermometer apparatus for calculating a temperature indication from said signal representative of a temperature at said sensing tip;

apparatus for mounting said object thereon;

control apparatus for manipulating a position of said apparatus for mounting relative to said sensing tip; and

computing apparatus having software for receiving said temperature indication and for correlating and storing said temperature indication as a function of time and location on said at least a portion of said surface of said object.

7. The apparatus of claim 6, wherein said sensor probe mount comprises a plurality of concentric tubular members connected together for passage of said conductor therethrough and attachment of said decay temperature sensor probe mounted at one end thereof.

8. The apparatus of claim 6, wherein said computing apparatus includes software for correlating said temperature indication with time and location on said surface of said object as a thermal map.

9. The apparatus of claim 6, wherein said sensor probe mount is mountable in a channel of a capillary holder.

10. The apparatus of claim 6, wherein said sensor probe mount is mounted in a capillary holder removable from said arm of said wire bonding machine.

11. An apparatus for mapping of temperatures on at least a portion of a surface of an object and for correlating measured temperatures, said apparatus comprising:

a wire bonding machine including an arm and an ultrasonic bonding generator controller;

a sensor probe mount attached to said arm of said wire bonding machine, said sensor probe mount including a plurality of members and a conductor mounted in a capillary holder on a portion of said arm;

a fluorescence decay temperature sensor probe having a conductor having a sensing tip on one end thereof and having an opposite signal output end, said fluorescence decay temperature sensor probe mountable in said sensor probe mount attached to said arm of said wire bonding machine;

pulse generating apparatus connected to said opposite signal output end for generating a pulse through said conductor to phosphorescent material at said sensing tip and for receiving from said opposite signal output end of said conductor a decaying phosphorescent signal representative of a temperature at said sensing tip;

an electronic trigger circuit connected to said wire bonding machine for initiating the generation of said pulse, said electronic trigger circuit initiating a signal for a temperature measurement upon receiving a voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;

thermometer apparatus for calculating a temperature indication from said decaying phosphorescent signal;

a stage apparatus for mounting said object thereon;

control apparatus for manipulating a position of said stage apparatus relative to said sensing tip; and

computing apparatus having software for receiving said temperature indication and for correlating and storing said temperature indication as a function of time and location on said at least a portion of said surface of said object.

12. The apparatus of claim 11, wherein said object includes one of a semiconductor die, leadframe, substrate, and other electronic device.

13. The apparatus of claim 11, wherein said sensor probe mount attached to said arm of said wire bonding machine comprises a plurality of connected concentric tubular members for passage of said conductor therethrough and attachment of said sensor probe mount at one end thereof.

14. The apparatus of claim 11, wherein said computing apparatus comprises software for correlating said temperature indication with time and location on said surface as a thermal map.

15. The apparatus of claim 11, wherein said sensor probe mount is mountable in a channel of a capillary holder.

16. The apparatus of claim 11, wherein said sensor probe mount is permanently mounted in a capillary holder removable from said arm of said wire bonding machine.

17. A method for mapping at least one temperature of at least a portion of a surface of an object using a wire bonding machine having an arm and an ultrasonic bonding generator controller comprising:

providing a sensor probe mount on said arm of said wire bonding machine;

providing a temperature sensor probe having a conductor having a sensing tip on one end thereof and a signal output end on another end thereof attached to said arm of said wire bonding machine;

initiating generation of a radiation pulse using an electronic trigger circuit connected to said arm of said wire bonding machine for a temperature measurement upon receiving a voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;

generating said radiation pulse through said conductor to material at said sensing tip via means connected to said signal output end;

receiving from said signal output end a signal representative of a temperature at said sensing tip in a computational apparatus having software;

calculating a temperature indication from said signal; and

storing said temperature indication for generating a thermal map.

18. The method of claim 17, further including:

correlating said temperature indication as a function of time and location on said at least a portion of said surface of said object.

19. The method of claim 18, further including:

mounting said object on a support apparatus; and

manipulating a position of said support apparatus relative to said sensing tip using a control apparatus.

20. The method of claim 17, wherein said object includes one of a semiconductor wafer, semiconductor die, leadframe, substrate, and other electronic device.

21. The method of claim 17, wherein said sensor probe mount comprises a plurality of connected members for passage of said conductor therethrough and attachment of said sensor probe mount at one end thereof.

22. The method of claim 18, wherein said correlating said temperature indication as a function of time and location on said at least a portion of said surface includes correlating said temperature indication as a thermal map of said at least a portion of said surface of said object.

23. The method of claim 17, further including mounting said sensor probe mount in a channel of a capillary holder on said arm of said wire bonding machine.

24. The method of claim 17, further including permanently mounting said sensor probe mount in a capillary holder removable from said arm.

25. A method for mapping of at least a portion of a surface of an object comprising:

providing a wire bonding apparatus including an arm and an ultrasonic bonding generator controller;

mounting a sensor probe mount on said wire bonding apparatus;

providing a temperature sensor probe having a conductor having a sensing tip end and a signal output end;

mounting said temperature sensor probe in said sensor probe mount on said wire bonding apparatus;

initiating generation of a radiation pulse using an electronic trigger circuit connected to said wire bonding apparatus, said electronic trigger circuit initiating a signal for a temperature measurement upon receiving a voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding apparatus;

generating said radiation pulse through said conductor to material at said sensing tip end via apparatus connected to said signal output end;

receiving from said signal output end a signal representative of a temperature at said sensing tip end in computational apparatus having software;

calculating a temperature indication from said signal; and

correlating temperature as a thermal map and storing said temperature indication as a function of time and location on said surface of said object.

26. The method of claim 25, further including:

mounting said object on a support apparatus, said support apparatus being part of said wire bonding apparatus; and

manipulating a position of said support apparatus relative to said sensing tip end using a control apparatus.

27. The method of claim 25, wherein said object includes one of a semiconductor wafer, semiconductor die, leadframe, substrate, and other electronic device.

28. The method of claim 25, wherein said sensor probe mount comprises at least two concentric connected tubular members for passage of said conductor therethrough and attachment of said sensor probe mount at one end thereof.

29. The method of claim 25, wherein said correlating said temperature indication as a function of time and location on said surface of said object includes correlating said temperature as a thermal map using said computational apparatus.

30. The method of claim 25, wherein said sensor probe mount is mountable in a channel of a capillary holder.

31. The method of claim 25, wherein said sensor probe mount is permanently mounted in a capillary holder removable from said wire bonding apparatus.

32. A method for measuring temperatures on at least a portion of a surface of an object comprising:

providing a wire bonding machine including an arm, a mounting apparatus, and an ultrasonic bonding generator controller;

mounting a sensor probe mount on said wire bonding machine;

providing a miniature fluorescence temperature sensor probe having a conductor having a sensing tip end and an opposite signal output end, said miniature fluorescence temperature sensor probe mounted in said sensor probe mount on said wire bonding machine;

providing an apparatus connected to said opposite signal output end;

initiating a signal using an electronic trigger circuit connected to said wire bonding machine for a temperature measurement upon receiving a voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;

initiating generation of a pulse of light using said electronic trigger circuit connected to said wire bonding machine;

generating said pulse of light through said conductor to phosphorescent material at said sensing tip end;

receiving from said opposite signal output end a decaying phosphorescent signal representative of a temperature at said sensing tip end;

calculating a temperature indication from said decaying phosphorescent signal;

mounting said object on said mounting apparatus of said wire bonding machine;

manipulating a position of said mounting apparatus relative to said sensing tip end;

computing, correlating, and storing said temperature indication as a function of time and location on said surface of said object using a computational apparatus having software for correlating said temperature indication with at least one location.

33. The method claim 32, wherein said object includes one of a semiconductor wafer, semiconductor die, leadframe, substrate, and other electronic device.

34. The method of claim 32, wherein said sensor probe mount comprises a plurality of concentric connected tubular members for passage of said conductor therethrough and attachment of said sensor probe mount at one end thereof.

35. The method of claim 32, wherein said computational apparatus includes software for correlating said temperature indication with location on said surface as a thermal map.

36. The method of claim 32, wherein said computational apparatus includes software for correlating said temperature indication with time and location on said surface as a thermal map.

37. The method of claim 36, wherein said sensor probe mount is permanently mounted in a capillary holder removable from said arm of said wire bonding machine.

38. An apparatus for measuring temperatures on a semiconductor die having an active surface having at least one bond pad thereon having one end of a wire bonded thereto in a wire bonding operation and for correlating measured temperatures with locations on said active surface of said semiconductor die at a time of the measurement of said temperatures after bonding of said one end of said wire to said at least one bond pad on said surface of said semiconductor die, said apparatus comprising:

a wire bonding machine having a bonding arm and an ultrasonic bonding generator controller;

a sensor probe mount attached to said bonding arm of said wire bonding machine, said sensor probe mount removable from said bonding arm of said wire bonding machine;

a decay temperature sensor probe having a fiber optic conductor with a sensing tip and an opposite signal output end, said decay temperature sensor probe mountable in said sensor probe mount attached to said bonding arm of said wire bonding machine;

pulse of light generating apparatus connected to said opposite signal output end for generating a pulse of light through said fiber optic conductor to material at said sensing tip and for receiving from said opposite signal output end a decaying signal representative of a temperature at said sensing tip;

a signal isolation trigger circuit connected to said wire bonding machine for initiating said generation of said pulse of light, said signal isolation trigger circuit initiating a signal for a temperature measurement upon receiving an electrical voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;

apparatus for determining a temperature indication from said decaying signal;

stage apparatus for mounting said semiconductor die thereon attached to a portion of said wire bonding machine;

control apparatus for manipulating a position of said stage apparatus relative to said sensing tip; and

computing apparatus having software for receiving said temperature indication and for correlating and storing said temperature indication in machine-readable form as a function of one of time and location on said active surface of said semiconductor die subsequent to the bonding of said one end of said wire to said at least one bond pad on said active surface of said semiconductor die.

39. The apparatus of claim 38, wherein said semiconductor die includes one of a semiconductor die in wafer form, a semiconductor die having at least one bond pad connected to a portion of a leadframe and other semiconductor die electronic devices.

40. The apparatus of claim 38, wherein said sensor probe mount comprises a plurality of concentric tubular members overlappingly fitted together for passage of said fiber optic conductor therethrough and attachment of said decay temperature sensor probe at one end thereof.

41. The apparatus of claim 38, wherein said sensor probe mount is permanently mounted in a capillary holder removable from said bonding arm of said wire bonding machine.

42. A measuring apparatus comprising:

a wire bonding machine having an arm and an ultrasonic bonding generator controller;

a sensor probe mount attached to said arm of said wire bonding machine, said sensor probe mount removable from said bonding arm of said wire bonding machine;

a decay temperature sensor probe having a fiber optic conductor with a sensing tip and an opposite signal output end, said decay temperature sensor probe mounted in said sensor probe mount attached to said arm of said wire bonding machine;

pulse of light generating apparatus connected to said opposite signal output end for generating a pulse of light through said fiber optic conductor to material at said sensing tip and for receiving from said opposite signal output end a decaying signal representative of a temperature at said sensing tip;

a signal isolation trigger circuit connected to said wire bonding machine for initiating said generation of said pulse of light, said signal isolation trigger circuit initiating a signal for a temperature measurement upon receiving an electrical voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;

apparatus for calculating a temperature indication from said decaying signal;

apparatus for mounting a semiconductor die thereon located on a portion of said wire bonding machine;

control apparatus for manipulating a position of said apparatus for mounting relative to said sensing tip; and

computing apparatus having software for receiving said temperature indication and for correlating and storing said temperature indication in machine-readable form as a function of one of time and location on at least a portion of a surface of said semiconductor die.

43. The apparatus of claim 42, wherein said semiconductor die includes one of a semiconductor die in wafer form, a semiconductor die connected to a leadframe and other semiconductor die type electronic devices.

44. The apparatus of claim 42, wherein said sensor probe mount is permanently mounted in a capillary holder removable from said arm of said wire bonding machine.

45. A measuring apparatus comprising:

a wire bonding machine having an arm and an ultrasonic bonding generator controller;

a sensor probe mount removably attached to a portion of said arm of said wire bonding machine;

a fluorescence decay temperature sensor probe having a fiber optic conductor with a sensing tip and an opposite signal output end, said fluorescence decay temperature sensor probe mountable in said sensor probe mount attached to said arm of said wire bonding machine;

pulse of light generating apparatus connected to said opposite signal output end for generating a pulse of light through said fiber optic conductor to phosphorescent material at said sensing tip and for receiving from said opposite signal output end a decaying phosphorescent signal representative of a temperature at said sensing tip;

a signal isolation trigger circuit connected to said wire bonding machine for initiating said generation of said pulse of light, said signal isolation trigger circuit initiating a signal for a temperature measurement upon receiving an electrical voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;

apparatus for calculating a temperature indication from said decaying phosphorescent signal;

a stage for mounting an object thereon on a portion of said wire bonding machine;

control apparatus for manipulating a position of said stage relative to said sensing tip; and

computing apparatus having software for receiving said temperature indication and for correlating and storing said temperature indication in machine-readable form as a function of one of time and location on at least a portion of a surface of said object.

46. The apparatus of claim 45, wherein said sensor probe mount removably attached to said portion of said arm of said wire bonding machine comprises a plurality of concentric tubular members overlappingly fitted together for passage of said fiber optic conductor therethrough and attachment of said fluorescence decay temperature sensor probe at one end thereof.

47. The apparatus of claim 45, wherein said computing apparatus comprises software for correlating said temperature indication with one of time and location on said surface as a thermal map.

48. A measuring method comprising:

providing a wire bonding machine having an arm and an ultrasonic bonding generator controller;

providing a removable sensor probe mount on a portion of said arm of said wire bonding machine;

providing a decay temperature sensor probe having a fiber optic conductor with a sensing tip and a signal output end attached to said arm of said wire bonding machine;

initiating generation of a pulse of light using a signal isolation trigger circuit connected to said arm of said wire bonding machine for a temperature measurement upon receiving an electrical voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;

generating said pulse of light through said fiber optic conductor to material at said sensing tip via means connected to said signal output end;

receiving from said signal output end a signal representative of a temperature at said sensing tip in machine-readable form in a computational apparatus having software; and

determining a temperature indication from said electrical voltage signal.

49. The method of claim 48, further including:

providing a mounting apparatus for mounting an object thereon; and

manipulating a position of said mounting apparatus relative to said sensing tip using a control apparatus.

50. The method of claim 48, wherein said removable sensor probe mount comprises a plurality of tubular members fitted together for passage of said fiber optic conductor therethrough and attachment of said decay temperature sensor probe at one end thereof.

51. The method of claim 48, further including:

correlating said temperature indication with one of time and location on a surface of an object as a thermal map.

52. A method for measuring at least one temperature on at least a portion of a surface of an object comprising:

providing a wire bonding apparatus having an arm and an ultrasonic bonding generator controller;

providing a removable sensor probe mount attached to a portion of said arm of said wire bonding apparatus;

providing a decay temperature sensor probe having a fiber optic conductor with a sensing tip and a signal output end;

mounting said decay temperature sensor probe in said removable sensor probe mount attached to said portion of said arm of said wire bonding apparatus;

initiating generation of a pulse of light using a signal isolation trigger circuit connected to said wire bonding apparatus, said signal isolation trigger circuit initiating a signal for a temperature measurement upon receiving an electrical voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding apparatus;

generating said pulse of light through said fiber optic conductor to material at said sensing tip via apparatus connected to said signal output end;

receiving from said signal output end a signal representative of a temperature at said sensing tip in machine-readable form in a computational apparatus having software;

determining a temperature indication from said signal; and

correlating and storing said temperature indication as a function of one of time and location on said at least a portion of said surface of said object.

53. A method for measuring at least one temperature on at least a portion of a surface of an object comprising:

providing a wire bonding machine having an arm, a mounting apparatus, and an ultrasonic bonding generator controller;

mounting a removable sensor probe mount to a portion of said arm of said wire bonding machine;

providing a miniature fluorescence decay temperature sensor probe having a fiber optic conductor with a sensing tip and an opposite signal output end, said miniature fluorescence decay temperature sensor probe mounted in said removable sensor probe mount of said portion of said arm of said wire bonding machine;

providing an apparatus connected to said opposite signal output end;

initiating a signal using a signal isolation trigger circuit connected to said wire bonding machine for a temperature measurement upon receiving an electrical voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;

generating a pulse of light through said fiber optic conductor to phosphorescent material at said sensing tip;

receiving from said opposite signal output end a decaying phosphorescent signal representative of a temperature at said sensing tip;

initiating the generation of said pulse of light using said signal isolation trigger circuit connected to said wire bonding machine;

determining a temperature indication from said decaying phosphorescent signal;

mounting said object on said mounting apparatus of said wire bonding machine;

manipulating a position of said mounting apparatus relative to said sensing tip;

computing, correlating, and storing said temperature indication in machine-readable form as a function of one of time and location on said at least a portion of said surface of said object using a computational apparatus.