Methods for the electronic assembly and fabrication of devices

• US 6,652,808 B1
• Filed: 12/06/1996
• Issued: 11/25/2003
• Est. Priority Date: 11/07/1991
• Status: Expired due to Fees

• Current Assignee: Gamida for Life B.V., Nanotronics Incorporated, Regents of the University of California (University of California)
• Original Assignee: Nanotronics Incorporated, Regents of the University of California (University of California)
• Inventors: Cable, Jeffrey M., Esener, Sadik C., Heller, Michael J.
• Primary Examiner(s): Marschel, Ardin H.
• Application Number:
  US08/760,933
• Time in Patent Office: 2,545 Days
• Field of Search: 422/287, 422/68.1, 422/50, 422/76, 422/82.01, 422/82.02, 422/82.05, 435/6.5, 435/91.1, 435/7.1, 435/7.2, 204/456, 436/149, 436/150, 436/806, 436/807, 530/300, 530/350, 530/333, 536/24.3, 536/24.32, 536/24.33, 536/23.1
• US Class Current: 422/68.1
• CPC Class Codes: B01J 19/0046 Sequential or parallel reactions, e.g. for the synthesis of polypeptides or polynucleotides; Apparatus and devices for combinatorial chemistry or for making molecular arrays synthesis methods per se C40B50/00
• CPC Class Codes: B01J 19/0093 Microreactors, e.g. miniaturised or microfabricated reactors laboratory containers with capillary fluid transport in microfabricated channels or chambers B01L3/5027
• CPC Class Codes: B01J 2219/00315 Microtiter plates
• CPC Class Codes: B01J 2219/00317 Microwell devices, i.e. having large numbers of wells
• CPC Class Codes: B01J 2219/00497 Features relating to the solid phase supports
• CPC Class Codes: B01J 2219/00527 Sheets
• CPC Class Codes: B01J 2219/00529 DNA chips
• CPC Class Codes: B01J 2219/00536 in the shape of disks
• CPC Class Codes: B01J 2219/00545 Colours
• CPC Class Codes: B01J 2219/00585 Parallel processes
• CPC Class Codes: B01J 2219/0059 Sequential processes
• CPC Class Codes: B01J 2219/00596 Solid-phase processes
• CPC Class Codes: B01J 2219/00605 the compounds being directly bound or immobilised to solid supports
• CPC Class Codes: B01J 2219/00608 DNA chips
• CPC Class Codes: B01J 2219/00612 the surface being inorganic
• CPC Class Codes: B01J 2219/00617 by chemical means
• CPC Class Codes: B01J 2219/00626 Covalent
• CPC Class Codes: B01J 2219/00637 by coating it with another layer
• CPC Class Codes: B01J 2219/00653 the compounds being bound to electrodes embedded in or on the solid supports
• CPC Class Codes: B01J 2219/00659 Two-dimensional arrays
• CPC Class Codes: B01J 2219/00686 : Automatic
• CPC Class Codes: B01J 2219/00689 : using computers
• CPC Class Codes: B01J 2219/00707 : separated from the reactor apparatus
• CPC Class Codes: B01J 2219/00711 : Light-directed synthesis
• CPC Class Codes: B01J 2219/00713 : Electrochemical synthesis
• CPC Class Codes: B01J 2219/0072 : Organic compounds
• CPC Class Codes: B01J 2219/00722 : Nucleotides
• CPC Class Codes: B01J 2219/00725 : Peptides
• CPC Class Codes: B01J 2219/00731 : Saccharides
• CPC Class Codes: B01L 2200/025 : Align devices or objects to ensure defined positions relative to each other
• CPC Class Codes: B01L 2200/0663 : Stretching or orienting elongated molecules or particles
• CPC Class Codes: B01L 2200/12 : Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/0636 : Integrated biosensor, microarrays
• CPC Class Codes: B01L 2300/0645 : Electrodes
• CPC Class Codes: B01L 2400/0421 : electrophoretic flow
• CPC Class Codes: B01L 3/502707 : characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B01L 3/502715 : characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
• CPC Class Codes: B01L 3/502761 : specially adapted for handling suspended solids or molecules independently from the bulk fluid flow, e.g. for trapping or sorting beads, for physically stretching molecules investigating characteristics of particles G01N15/00
• CPC Class Codes: B01L 3/5085 : for multiple samples, e.g. microtitration plates
• CPC Class Codes: B82B 3/00 : Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
• CPC Class Codes: B82Y 10/00 : Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: B82Y 20/00 : Nanooptics, e.g. quantum optics or photonic crystals
• CPC Class Codes: B82Y 30/00 : Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: B82Y 40/00 : Manufacture or treatment of nanostructures
• CPC Class Codes: B82Y 5/00 : Nanobiotechnology or nanomedicine, e.g. protein engineering or drug delivery
• CPC Class Codes: C07B 2200/11 : Compounds covalently bound to a solid support
• CPC Class Codes: C07H 21/00 : Compounds containing two or more mononucleotide units having separate phosphate or polyphosphate groups linked by saccharide radicals of nucleoside groups, e.g. nucleic acids
• CPC Class Codes: C07K 1/04 : on carriers C07K1/003, C07K1/006 take precedence
• CPC Class Codes: C07K 1/045 : using devices to improve synthesis, e.g. reactors, special vessels
• CPC Class Codes: C07K 1/047 : Simultaneous synthesis of different peptide species; Peptide libraries
• CPC Class Codes: C12Q 1/6813 : Hybridisation assays
• CPC Class Codes: C12Q 1/6816 : characterised by the detection means C12Q1/6804 takes precedence
• CPC Class Codes: C12Q 1/6818 : involving interaction of two or more labels, e.g. resonant energy transfer
• CPC Class Codes: C12Q 1/6825 : Nucleic acid detection involving sensors
• CPC Class Codes: C12Q 1/6837 : using probe arrays or probe chips C12Q1/6874 takes precedence
• CPC Class Codes: C12Q 2565/515 : characterised by the interaction between or sequential use of two or more arrays
• CPC Class Codes: C12Q 2565/607 : being a sensor, e.g. electrode
• CPC Class Codes: C40B 40/06 : Libraries containing nucleotides or polynucleotides, or derivatives thereof
• CPC Class Codes: C40B 40/08 : Libraries containing RNA or DNA which encodes proteins, e.g. gene libraries
• CPC Class Codes: C40B 40/10 : Libraries containing peptides or polypeptides, or derivatives thereof
• CPC Class Codes: C40B 40/12 : Libraries containing saccharides or polysaccharides, or derivatives thereof
• CPC Class Codes: C40B 50/14 : Solid phase synthesis, i.e. wherein one or more library building blocks are bound to a solid support during library creation; Particular methods of cleavage from the solid support
• CPC Class Codes: C40B 60/14 : for creating libraries
• CPC Class Codes: C40B 70/00 : Tags or labels specially adapted for combinatorial chemistry or libraries, e.g. fluorescent tags or bar codes
• CPC Class Codes: G01N 33/54366 : Apparatus specially adapted for solid-phase testing
• CPC Class Codes: G02B 6/1225 : comprising photonic band-gap structures or photonic lattices
• CPC Class Codes: G06N 3/002 : Biomolecular computers, i.e. using biomolecules, proteins, cells using DNA G06N3/123; using neurons G06N3/061
• CPC Class Codes: G06N 3/061 : using biological neurons, e.g. biological neurons connected to an integrated circuit
• CPC Class Codes: G06N 3/123 : DNA computing
• CPC Class Codes: G11B 7/0037 : with discs
• CPC Class Codes: G11B 7/0045 : Recording G11B7/006, G11B7/0065 take precedence
• CPC Class Codes: G11B 7/00455 : involving reflectivity, absorption or colour changes
• CPC Class Codes: G11B 7/005 : Reproducing G11B7/0065 takes precedence
• CPC Class Codes: G11B 7/0052 : involving reflectivity, absorption or colour changes
• CPC Class Codes: G11B 7/24 : Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the arrangement of information on the carrier G11B7/007
• CPC Class Codes: G11B 7/244 : comprising organic materials only
• CPC Class Codes: G11C 13/0014 : comprising cells based on organic memory material
• CPC Class Codes: G11C 13/0019 : comprising bio-molecules
• CPC Class Codes: G11C 13/04 : using optical elements ; using other beam accessed elements, e.g. electron or ion beam
• CPC Class Codes: H01L 21/7806 : involving the separation of the active layers from a substrate
• CPC Class Codes: H01L 2224/95085 : being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95145 : Electrostatic alignment, i.e. polarity alignment with Coulomb charges
• CPC Class Codes: H01L 2224/95147 : by molecular lock-key, e.g. by DNA
• CPC Class Codes: H01L 24/95 : at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 25/16 : the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01011 : Sodium [Na]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01025 : Manganese [Mn]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/01052 : Tellurium [Te]
• CPC Class Codes: H01L 2924/01072 : Hafnium [Hf]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/10336 : Aluminium gallium arsenide [AlGaAs]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H10K 10/701 : Organic molecular electronic devices
• CPC Class Codes: H10K 85/761 : Biomolecules or bio-macromolecules, e.g. proteins, chlorophyl, lipids or enzymes

Abstract

Methods provide for electric field assisted self-assembly of functionalized programmable nucleic acids, nucleic acid modified structures, and other selective affinity or binding moieties as building blocks for: creating molecular electronic and photonic mechanisms; organization, assembly, communication and interconnection of nanostructures, submicron and micron sized components onto silicon or other materials; organization, assembly, communication and interconnection of nanostructures, submicron and micron sized components within parameters of microelectronic or optoelectronic components and devices; creating, arraying, and manufacturing photonic and electronic structures, devices, and systems. Methods for the fabrication of microscale and nanoscale devices include the steps of: releasing at least one component device from a support, transporting at least one component device to a support, and attaching at least one component device to the support. Optionally, the methods may further include the step of fabricating at least one component device on a first support.

Claims

1. A method for fabrication of structures including nanoscale and microscale components comprising the steps of:

providing a microscale or nanoscale structure with a first specific DNA sequence on a first region of the structure and a second specific DNA sequence on a second region of the structure, the second specific DNA sequence having a net charge, the structure including said first and second specific DNA sequences having a non-uniform charge distribution,

providing a host support having a third specific DNA sequence thereon,

orienting the structure with the first and second specific DNA structures in an electric field so as to selectively orient the first DNA sequence or the second DNA sequence toward the third DNA sequence on the host support, and

hybridizing the oriented first or second DNA sequence with the third DNA sequence.

2. The method of claim 1 for fabrication of structures wherein the multiple affinity surface identities are arranged in a polar fashion.

3. The method of claim 1 for fabrication of structures wherein the multiple affinity surface identities are arranged in a tetrahedral fashion.

4. The method for fabrication of structures of claim 1 wherein the first DNA sequence is complementary to the third DNA sequence.

5. The method for fabrication of structures of claim 1 wherein the first DNA sequence is hybridized with a fourth DNA specific sequence, the fourth DNA specific sequence in turn being complementary to the third DNA specific sequence, and hybridizable thereto.

56. The method of claim 1 for fabrication of structures wherein the multiple affinity surface identities are arranged in a polar fashion.

57. The method of claim 1 for fabrication of structures wherein the multiple affinity surface identities are arranged in a equitorial fashion.

6. A method for the fabrication of devices including microscale or nanoscale components comprising the steps of:

fabricating first microscale or nanoscale component devices on a first region of a support, said first component devices including at least a first specific DNA polymer sequence thereon and a non-nucleic acid component,

releasing at least one first component device from the first support into a solution,

electrophoretically transporting the released first component device to a second region of the support, and

attaching the first component device to a selected location on the second region of the support, the second region of the support containing complementary DNA polymer sequences to the first specific DNA polymer sequence on the first component device, the attachment including at least hybridizing of the first specific DNA polymer sequence on the first component device and the complementary DNA polymer sequence on the second region of the support.

7. The method of claim 6 for the fabrication of devices wherein the step of releasing the device is performed by epitaxial lift-off.

8. The method of claim 6 for the fabrication of devices wherein the transporting is accomplished through a fluid.

9. The method of claim 8 for the fabrication of devices further including the step of drying at least the host support and attached device.

10. The method of claim 6 for the fabrication of devices wherein the transport is electrophoretic.

11. The method of claim 6 for the fabrication of devices wherein the attachment of devices to the host support is performed by grafting.

12. The method of claim 6 for the fabrication of devices wherein the second component device is attached to the first component device.

13. The method of claim 6 for the fabrication of devices wherein the host support is a microelectronic array.

14. The method of claim 6 for the fabrication of devices further including the step of forming contacts on the host support.

15. The method of claim 6 for the fabrication of devices wherein the released first component device is an electrical component structure.

16. The method of claim 6 for the fabrication of devices wherein the released first component device is a general component structure.

17. The method of claim 6 for the fabrication of devices wherein the transport is achieved by use of an electric field.

18. The method of claim 17 for the fabrication of devices wherein the electric field is an alternating current electric field.

19. The method of claim 16 for the fabrication of devices wherein the electric field is a direct current electric field.

20. The method of claim 16 for the fabrication of devices wherein the attachment of the released first component device to the host support is achieved at least in part by the use of an electric field.

21. A method for the fabrication of devices including microscale or nanoscale components comprising the steps of:

fabricating first and second microscale or nanoscale component devices on a common first support, said component devices including at least a specific DNA polymer sequence thereon and a non-nucleic acid component,

releasing at least one first component device and at least one second component device from the first support into a solution,

electrophoretically transporting the released first component device and second component device to a host support, and

attaching the first component device and second component device to selected locations on the host support, the host support containing complementary DNA polymer sequences to the specific DNA polymer sequences on the component devices, the attachment including at least hybridization of the specific DNA polymer sequence on the component devices and the complementary DNA polymer sequence on the host support.

22. The method of claim 21 for the fabrication of devices wherein the step of releasing the device is performed by epitaxial lift-off.

23. The method of claim 21 for the fabrication of devices wherein the transporting is accomplished through a fluid.

24. The method of claim 23 for the fabrication of devices further including the step of drying at least the host support and attached device.

25. The method of claim 21 for the fabrication of devices wherein the transport is electrophoretic.

26. The method of claim 21 for the fabrication of devices wherein the attachment of devices to the host support is performed by grafting.

27. The method of claim 21 for the fabrication of devices wherein the second component device is attached to the first component device.

28. The method of claim 21 for the fabrication of devices wherein the host support is a microelectronic array.

29. The method of claim 21 for the fabrication of devices wherein the first support and host support are physically distinct structures.

30. The method of claim 21 for the fabrication of devices wherein the first support and the host support are separate regions of a common structure.

31. The method of claim 21 for the fabrication of devices further including the step of forming contacts on the host support.

32. The method of claim 21 for the fabrication of devices wherein the released first component device is an electrical component structure.

33. The method of claim 21 for the fabrication of devices wherein the released first component device is a general component structure.

34. The method of claim 21 for the fabrication of devices wherein the transport is achieved by use of an electric field.

35. The method of claim 34 for the fabrication of devices wherein the electric field is an alternating current electric field.

36. The method of claim 34 for the fabrication of devices wherein the electric field is a direct current electric field.

37. The method of claim 34 for the fabrication of devices wherein the attachment of the released first component device to the host support is achieved at least in part by the use of an electric field.

38. A method for the fabrication of a photonic bandgap devices including microscale or nanoscale components comprising the steps of:

fabricating first microscale or nanoscale component devices on a first support, said first component devices including at least a first specific DNA polymer sequence thereon and a non-nucleic acid component,

releasing at least one first component device from the first support into a solution,

electrophoretically transporting the released first component device to a host support,

attaching the first component device to a selected location on the host support, the host support containing complementary DNA polymer sequences to the first specific DNA polymer sequence on the first component device, the attachment including at least hybridization of the first specific DNA polymer sequence on the first component device and the complementary DNA polymer sequence on the host support, and

forming a structure on the first component device after the first component device is attached to the host support to form a photonic bandgap device.

39. The method of claim 38 for the fabrication of devices wherein the step of releasing the device is performed by epitaxial lift-off.

40. The method of claim 38 for the fabrication of devices wherein the transporting is accomplished through a fluid.

41. The method of claim 40 for the fabrication of devices further including the step of drying at least the host support and attached device.

42. The method of claim 38 for the fabrication of devices wherein the transport is electrophoretic.

43. The method of claim 38 for the fabrication of devices wherein the attachment of devices to the host support is performed by grafting.

44. The method of claim 38 for the fabrication of devices further including the steps of:

fabricating second component devices on a second support,

releasing at least one second component device from the second support,

transporting the second component device to the host support, and

attaching the second component device on the host support.

45. The method of claim 44 for the fabrication of devices wherein the second component device is attached to the first component device.

46. The method of claim 44 for the fabrication of devices wherein the host support is a microelectronic array.

47. The method of claim 38 for the fabrication of devices wherein the first support and host support are physically distinct structures.

48. The method of claim 38 for the fabrication of devices wherein the first support and the host support are separate regions of a common structure.

49. The method of claim 38 for the fabrication of devices further including the step of forming contacts on the host support.

50. The method of claim 38 for the fabrication of devices wherein the released first component device is an electrical component structure.

51. The method of claim 38 for the fabrication of devices wherein the released first component device is a general component structure.

52. The method of claim 38 for the fabrication of devices wherein the transport is achieved by use of an electric field.

53. The method of claim 52 for the fabrication of devices wherein the electric field is an alternating current electric field.

54. The method of claim 52 for the fabrication of devices wherein the electric field is a direct current electric field.

55. The method of claim 52 for the fabrication of devices wherein the attachment of the released first component device to the host support is achieved at least in part by the use of an electric field.

58. A method for the fabrication of devices including microscale or nanoscale components comprising the steps of:

fabricating first microscale or nanoscale component devices on a first support, said first component devices including at least a first specific DNA polymer sequence thereon and a non-nucleic acid component,

releasing at least one first component device from the first support into a solution by epitaxial lift-off,

electrophoretically transporting the released first component device to a host support, and

attaching the first component device to a selected location on the host support, the host support containing complementary DNA polymer sequences to the first specific DNA polymer sequence on the first component device, the attachment including at least hybridization of the first specific DNA polymer sequence on the first component device and the complementary DNA polymer sequence on the host support.

59. The method of claim 58 for the fabrication of devices wherein the released first component device is a display element.

60. The method of claim 58 for the fabrication of devices wherein the attachment of devices to the host support is performed by grafting.

61. The method of claim 58 for the fabrication of devices further including the steps of:

fabricating second component devices on a second support,

releasing at least one second component device from the second support,

transporting the second component device to the host support, and

attaching the second component device on the host support.

62. The method of claim 61 for the fabrication of devices wherein the second component device is attached to the first component device.

63. The method of claim 61 for the fabrication of devices wherein the host support is a microelectronic array.

64. The method of claim 61 for the fabrication of devices wherein the first support and the second support are separate regions of a common structure.

65. The method of claim 58 for the fabrication of devices wherein the released first component devices include emitters and the host device is an emitter array.

66. The method of claim 58 for the fabrication of devices including the further step of forming a structure on the first component device after the first component device is attached to the host support.

67. The method of claim 66 for the fabrication of devices wherein the combined first component device and attached structure forms a photonic band gap device.

68. The method of claim 58 for the fabrication of devices further including the step of forming contacts on the host support.

69. The method of claim 68 for the fabrication of devices wherein the contacts are formed by transporting and attaching conductive materials on the host support.

70. The method of claim 58 for the fabrication of devices wherein the released first component device is a component semiconductor device.

71. The method of claim 58 for the fabrication of devices wherein the released first component device is a component optoelectronic device.

72. The method of claim 58 for the fabrication of devices wherein the released first component device is a component electronic device.

73. The method of claim 58 for the fabrication of devices wherein the released first component device is an optical component structure.

74. The method of claim 58 for the fabrication of devices wherein the released first component device is an electrical component structure.

75. The method of claim 58 for the fabrication of devices wherein the transport is achieved by use of an electric field.

76. The method of claim 75 for the fabrication of devices wherein the electric field is an alternating current electric field.

77. The method of claim 75 for the fabrication of devices wherein the electric field is a direct current electric field.

78. The method of claim 75 for the fabrication of devices wherein the attachment of the released first component device to the host support is achieved at least in part by the use of an electric field.

79. The method of claim 61 for the fabrication of devices wherein n-component devices are attached to n-separate supports, where n>

2.

80. A method for the fabrication of devices including microscale or nanoscale components comprising the steps of:

fabricating first microscale or nanoscale component devices on a first support, said first component devices including at least a first specific DNA polymer sequence thereon and a non-nucleic acid component,

releasing at least one first component device from the first support into a solution,

electrophoretically transporting the released first component device to a host support through a fluid, and

attaching the first component device to a selected location on the host support, the host support containing complementary DNA polymer sequences to the first specific DNA polymer sequence on the first component device, the attachment including at least hybridization of the first specific DNA polymer sequence on the first component device and the complementary DNA polymer sequence on the host support, and

drying at least the host support and attached device.

81. The method of claim 80 for the fabrication of devices wherein the released first component device is a laser.

82. The method of claim 80 for the fabrication of devices wherein the released first component device is a display element.

83. The method of claim 82 for the fabrication of devices wherein the display element is an active display element.

84. The method of claim 80 for the fabrication of devices wherein the step of releasing the device is performed by epitaxial lift-off.

85. The method of claim 80 for the fabrication of devices further including the steps of:

fabricating second component devices on a second support,

releasing at least one second component device from the second support,

transporting the second component device to the host support, and

attaching the second component device on the host support.

86. The method of claim 85 for the fabrication of devices wherein the second component device is attached to the first component device.

87. The method of claim 85 for the fabrication of devices wherein the host support is a microelectronic array.

88. The method of claim 80 for the fabrication of devices wherein the released first component devices include emitters and the host device is an emitter array.

89. The method of claim 80 for the fabrication of devices including the further step of forming a structure on the first component device after the first component device is attached to the host support.

90. The method of claim 89 for the fabrication of devices wherein the combined first component device and attached structure forms a photonic band gap device.

91. The method of claim 80 for the fabrication of devices wherein the host support is a microelectronic array.

92. The method of claim 80 for the fabrication of devices wherein the first support comprises a host board.

93. The method of claim 80 for the fabrication of devices wherein the released first component device is a component semiconductor device.

94. The method of claim 80 for the fabrication of devices wherein the released first component device is a component optoelectronic device.

95. The method of claim 80 for the fabrication of devices wherein the released first component device is a component electronic device.

96. The method of claim 80 for the fabrication of devices wherein the released first component device is an optical component structure.

97. The method of claim 80 for the fabrication of devices wherein the released first component device is an electrical component structure.

98. The method of claim 80 for the fabrication of devices wherein the released first component device is a general component structure.

99. The method of claim 80 for the fabrication of devices wherein the transport is achieved by use of an electric field.

100. The method of claim 99 or the fabrication of devices wherein the electric field is an alternating current electric field.

101. The method of claim 99 for the fabrication of devices wherein the electric field is a direct current electric field.

102. A method for the fabrication of devices including microscale or nanoscale components comprising the steps of:

fabricating first microscale or nanoscale component devices on a first support, said first component devices including at least a first specific DNA polymer sequence thereon and a non-nucleic acid component,

releasing at least one first component device from the first support into a solution,

electrophoretically transporting the released first component device to a host support, and

attaching the first component device to a selected location on the host support, wherein the host support is a microelectronic array containing complementary DNA polymer sequences to the first specific DNA polymer sequence on the first component device, the attachment including at least hybridization of the first specific DNA polymer sequence on the first component device and the complementary DNA polymer sequence on the host support.

103. The method of claim 102 for the fabrication of devices wherein the released first component device is a laser.

104. The method of claim 102 for the fabrication of devices wherein the released first component device is a display element.

105. The method of claim 104 for the fabrication of devices wherein the display element is an active display element.

106. The method of claim 102 for the fabrication of devices further including the steps of:

fabricating second component devices on a second support,

releasing at least one second component device from the second support,

transporting the second component device to the host support, and

attaching the second component device on the host support.

107. The method of claim 106 for the fabrication of devices wherein the second component device is attached to the first component device.

108. The method of claim 102 for the fabrication of devices wherein the first support and host support are physically distinct structures.

109. The method of claim 102 for the fabrication of devices wherein the first support and the host support are separate regions of a common structure.

110. The method of claim 106 for the fabrication of devices wherein the first support and the second support are physically distinct structures.

111. The method of claim 106 for the fabrication of devices wherein the first support and the second support are separate regions of a common structure.

112. The method of claim 102 for the fabrication of devices wherein the released first component devices include emitters and the host device is an emitter array.

113. The method of claim 102 for the fabrication of devices wherein the released first component devices include chromophoric memory units and the device is an optical memory.

114. The method of claim 102 for the fabrication of devices including the further step of forming a structure on the first component device after the first component device is attached to the host support.

115. The method of claim 114 for the fabrication of devices wherein the combined first component device and attached structure forms a photonic band gap device.

116. The method of claim 102 for the fabrication of devices wherein the released first component device is a component semiconductor device.

117. The method of claim 102 for the fabrication of devices wherein the released first component device is a component optoelectronic device.

118. The method of claim 102 for the fabrication of devices wherein the released first component device is a component electronic device.

119. The method of claim 102 for the fabrication of devices wherein the released first component device is an optical component structure.

120. The method of claim 102 for the fabrication of devices wherein the released first component device is an electrical component structure.

121. The method of claim 102 for the fabrication of devices wherein the released first component device is a general component structure.

122. The method of claim 121 for the fabrication of devices wherein the general component structure is a nanobead.

123. The method of claim 121 for the fabrication of devices wherein the general component structure is a nanoparticle.

124. The method of claim 102 for the fabrication of devices wherein the transport is achieved by use of an electric field.

125. The method of claim 124 for the fabrication of devices wherein the attachment of the released first component device to the host support is achieved at least in part by the use of an electric field.

126. The method of claim 106 for the fabrication of devices wherein n-component devices are attached to n-separate supports, where n>

2.