Conductor strip arrangement for a molded electronic component and process for molding
First Claim
1. A conductor strip arrangement for a molded electronic component (11), comprising at least one semiconductor element (5a-c) located on an electrically conducting conductor strip (1), and a housing (12) made of a molding material arranged around the conductor strip (1) and the at least one semiconductor element (5a-c) such that there are still sections (8) of the conductor strip (1) outside the housing (12), wherein a widened section (8.1) among the sections of the conductor strip (1) features a widening (10) such that the widened section (8.1) of the conductor strip (1) contacts an outer surface of housing (12) so as to prevent a mold material ridge (19) from being formed on the outer surface of the housing (12) at a location of the widened section, and wherein the widened section is not fixedly embedded in the housing so as to be free and removable from the housing.
1 Assignment
0 Petitions
Accused Products
Abstract
At least one semiconductor element is located on an electrically conducting conductor strip. Around the conductor strip and the at least one semiconductor element, a housing made of a molding material is arranged such that there are still frame sections of the conductor strip outside the housing. An enlarged frame section of the conductor strip is widened so as to extend into contact with, e.g. directly adjacent to or even protruding into the housing, in order to prevent the formation of a molding flash ridge on this housing surface. The enlarged frame section is finally removed. The avoidance of a molding flash ridge allows the component to be suction-held by a suction needle at this housing surface.
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Citations
25 Claims
- 1. A conductor strip arrangement for a molded electronic component (11), comprising at least one semiconductor element (5a-c) located on an electrically conducting conductor strip (1), and a housing (12) made of a molding material arranged around the conductor strip (1) and the at least one semiconductor element (5a-c) such that there are still sections (8) of the conductor strip (1) outside the housing (12), wherein a widened section (8.1) among the sections of the conductor strip (1) features a widening (10) such that the widened section (8.1) of the conductor strip (1) contacts an outer surface of housing (12) so as to prevent a mold material ridge (19) from being formed on the outer surface of the housing (12) at a location of the widened section, and wherein the widened section is not fixedly embedded in the housing so as to be free and removable from the housing.
- 7. A process for molding a housing (12) of an electronic component (11) in a mold form, with the component (1) featuring an electrically conducting conductor strip (1) having connection pins (2) located to one side, and having a frame (8) including frame sections (8.1, 8.2) that is arranged to form the lateral boundary between top and bottom sections of the mold form and that has a transverse dimension slightly larger than a transverse dimension of the mold form, and comprising a step of molding a mold material around at least a portion of the electronic component in a mold cavity of the mold form to form the housing of the mold material, wherein a widened frame section (8.1) among the frame sections of the frame features a widening (10) that extends inwardly toward the electronic component sufficiently to at least reach a side boundary wall of the mold cavity of the mold form in order to prevent the formation of a mold material ridge (19) on the housing (12), and further comprising a step of removing the widened frame section from the housing.
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18. A molded electronics arrangement comprising:
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an electrically conductive conductor strip including a chip mount section and frame sections around at least a portion of a perimeter of said chip mount section with frame spacing gaps between said chip mount section and said frame sections;
a semiconductor element mounted on said chip mount section of said conductor strip; and
a housing made of a molded material that is molded around said semiconductor element and said chip mount section of said conductor strip, and with said molded material also received in said spacing gaps;
wherein said frame sections include a projecting frame section that has an inner frame edge that projects toward said chip mount section, said frame spacing gaps include a projecting frame spacing gap defined between said chip mount section and said inner frame edge of said projecting frame section, said inner frame edge at least reaches a major outer surface of said housing and contacts said molded material, and said projecting frame section is not fixedly embedded in said molded material so as to be free and removable from said housing. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25)
further comprising a mold including a first mold half and a second mold half enclosing a mold cavity therebetween; and wherein;
said frame sections are arranged and held along a parting plane between said first mold half and said second mold half;
said chip mount section, said semiconductor element and said housing are received in said mold cavity; and
said inner frame edge flushly borders said mold cavity without projecting into said mold cavity.
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21. The molded electronics arrangement according to claim 18, wherein said projecting frame section projects through said major outer surface of said housing, and said inner frame edge is recessed into said molded material forming said housing.
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22. The molded electronics arrangement according to claim 21,
further comprising a mold including a first mold half and a second mold half enclosing a mold cavity therebetween; -
and wherein;
said frame sections are arranged and held along a parting plane between said first mold half and said second mold half;
said chip mount section, said semiconductor element and said housing are received in said mold cavity; and
said inner frame edge projects into said mold cavity.
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23. A method of making and further processing the molded electronics arrangement according to claim 18, comprising the steps:
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a) providing said semiconductor element mounted on said chip mount section of said electrically conductive conductor strip;
b) arranging said conductor strip with said frame sections received along a parting plane between a first mold half and a second mold half defining therebetween a mold cavity containing said semiconductor element mounted on said chip mount section, wherein said mold halves include a cavity bounding wall that bounds said mold cavity;
c) closing said first and second mold halves to close said mold cavity, wherein said conductor strip is positioned relative to said mold halves so that a cavity spacing gap between said chip mount section and said cavity bounding wall adjacent to said projecting frame section is at least as large as said projecting frame spacing gap;
d) injecting said molded material into said mold cavity to mold said molded material around said semiconductor element and said chip mount section to form said housing, wherein said cavity bounding wall molds and forms said major outer surface of said housing;
e) opening said mold halves and removing said molded electronics arrangement; and
f) removing said projecting frame section from said housing.
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24. The method according to claim 23, wherein said inner frame edge is flush with said cavity bounding wall without projecting into said mold cavity and said cavity spacing gap is equal to said projecting frame spacing gap in said step c).
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25. The method according to claim 23, wherein said projecting frame section projects beyond said cavity bounding wall with said inner frame edge protruding into said mold cavity and said cavity spacing gap is greater than said projecting frame spacing gap in said step c).
Specification