Image pickup device incorporating a position defining member

• US 6,654,064 B2
• Filed: 05/21/1998
• Issued: 11/25/2003
• Est. Priority Date: 05/23/1997
• Status: Expired due to Term

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Ishikawa, Koji
• Primary Examiner(s): Garber, Wendy R.
• Assistant Examiner(s): WHIPKEY, JASON T
• Application Number:
  US09/081,931
• Publication Number:
  US 20030025824A1
• Time in Patent Office: 2,014 Days
• Field of Search: 348/374, 348/340, 348/373, 348/335, 348/76, 439/66, 250/239
• US Class Current: 348/374
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/10446 Mounted on an edge soldering edge mounted components H05K3/3405; edge terminals H05K2201/1034
• CPC Class Codes: H05K 2201/10727 Leadless chip carrier [LCC], e.g. chip-modules for cards
• CPC Class Codes: H05K 2201/2009 Reinforced areas, e.g. for a specific part of a flexible printed circuit
• CPC Class Codes: H05K 2201/2018 Presence of a frame in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 2203/167 Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: H05K 3/305 Affixing by adhesive
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An image pickup device is provided with an optical system for taking the image of an object. A photoelectric converting element photoelectrically converts the object image taken by the optical system and an electric signal outputting board outputs an electrical signal from the photoelectric converting element. A position defining member defines the position of the optical system relative to the photoelectric converting element. The electric signal outputting board is positioned between the photoelectric converting element and the position defining member.

Claims

1. An image pickup apparatus comprising:

an image pickup unit which picks up an object image;

an electrode arranged on said image pickup unit;

a first board having a wiring pattern arranged thereon which outputs a signal from said electrode;

an optical system arranged to focus the object image onto said image pickup unit;

a second board to which said optical system is fixed, said second board having a projection; and

a connection member arranged to connect said first board and said electrode,

wherein said first board is positioned between said image pickup unit and said second board, said connection member is arranged on a surface of said first board facing said image pickup unit, and said image pickup unit is arranged in contact with said projection of said second board.

2. An apparatus according to claim 1, wherein said image pickup unit includes an image pickup element and a package on which said image pickup element is arranged.

3. An apparatus according to claim 1, wherein said first board is a printed circuit board.

4. An electrical part mounting apparatus comprising:

an electrical part;

an electrode arranged on said electrical part;

a first board having a wiring pattern arranged thereon which outputs a signal from said electrode;

a second board to which said electrical part is fixed, said second board having a projection; and

a connection member arranged to connect said first board and said electrode,

wherein said first board is arranged between said electrical part and said second board, said connection member is arranged on a surface of said first board facing said electrical part, and said electrical part is arranged in contact with said projection of said second board.

5. An image pickup apparatus comprising:

an image pickup unit which picks up an object image;

an electrode portion provided for said image pickup unit;

a first board having a wiring pattern arranged thereon which outputs a signal from said electrode portion;

a connection member which connects said first board and said electrode portion, wherein said connection member connects said first board and said electrode portion on a surface of said first board facing said image pickup unit;

an optical system arranged to focus the object image onto said image pickup unit; and

a second board which is arranged between said image pickup unit and said first board and to which said optical system is fixed,

wherein said second board has an opening which is positioned above said connection member, and at least a portion of said connection member is positioned above a surface of said second board facing said first board.

6. An apparatus according to claim 5, wherein said image pickup unit includes an image pickup element and a package on which said image pickup element is arranged.

7. An apparatus according to claim 5, wherein said first board is a printed circuit board.