Trench DMOS transistor having a zener diode for protection from electro-static discharge

• US 6,657,256 B2
• Filed: 05/22/2001
• Issued: 12/02/2003
• Est. Priority Date: 05/22/2001
• Status: Expired due to Term

• Current Assignee: General Semiconductor, Inc. (Vishay Intertechnology Incorporated)
• Original Assignee: General Semiconductor, Inc. (Vishay Intertechnology Incorporated)
• Inventors: Hshieh, Fwu-Iuan, So, Koon Chong
• Primary Examiner(s): Lee, Eddie
• Assistant Examiner(s): RICHARDS, N DREW
• Application Number:
  US09/862,541
• Publication Number:
  US 20020175367A1
• Time in Patent Office: 924 Days
• Field of Search: 257/173, 257/330, 257/331, 257/329, 257/339, 257/341, 257/355, 257/356, 257/551
• US Class Current: 257/339
• CPC Class Codes: H01L 29/4916 the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen H01L29/4908, H01L29/4983 take precedence
• CPC Class Codes: H01L 29/7808 the other device being a breakdown diode, e.g. Zener diode
• CPC Class Codes: H01L 29/7813 with trench gate electrode, e.g. UMOS transistors trench gate electrodes per se H01L29/4236
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A trench DMOS transistor having overvoltage protection includes a substrate of a first conductivity type and a body region of a second conductivity type formed over the substrate. At least one trench extends through the body region and the substrate. An insulating layer lines the trench and overlies the body region. A conductive electrode is deposited in the trench so that it overlies the insulating layer. A source region of the first conductivity type is formed in the body region adjacent to the trench. An undoped polysilicon layer overlies a portion of the insulating layer. A plurality of cathode regions of the first conductivity type are formed in the undoped polysilicon layer. At least one anode region is in contact with adjacent ones of the plurality of cathode regions.

Claims

1. A trench DMOS transistor having overvoltage protection, comprising:

a substrate of a first conductivity type;

a body region on the substrate, said body region having a second conductivity type;

at least one trench extending through the body region and the substrate;

an insulating layer that lines the trench and overlies said body region;

a conductive electrode in the trench overlying the insulating layer;

a source region of the first conductivity type in the body region adjacent to each trench;

an undoped polysilicon layer overlying a portion of the insulating layer; and

a plurality of cathode regions of the first conductivity type in the undoped polysilicon layer; and

at least one anode region in contact with adjacent ones of the plurality of cathode regions.

2. The transistor of claim 1 wherein said insulating layer is an oxide layer.

3. The transistor of claim 1 wherein said conductive electrode is polysilicon.

4. The transistor of claim 1 further comprising a drain electrode disposed on a bottom surface of the substrate.

5. The transistor of claim 4 further comprising a source electrode coupled to the source region.

6. The transistor of claim 2 wherein said oxide layer has a thickness between about 500 and 800 angstroms.

7. The transistor of claim 1 wherein said conductive electrode comprises a second layer of undoped polysilicon and a layer of doped polysilicon disposed over said second undoped polysilicon layer.

8. The transistor of claim 1 wherein said undoped polysilicon layer has a thickness between about 5,000-10,000 angstroms.

9. The transistor of claim 1 wherein said undoped polysilicon layer overlies a portion of the insulating layer vertically displaced from said at least one trench.

10. The transistor of claim 1 wherein said plurality of cathode regions include boron implanted therein.