Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads
First Claim
1. In a flexible plastic thermally conductive multi-layer semiconductor mounting pad having a highly thermally conductive bulk layer with thermally conductive surface skin layers bonded integrally to at least one of a pair of opposed major surfaces thereof, said semiconductor mounting pad being characterized in that:
- (a) said central bulk layer being filled with a finely divided thermally conductive particulate, and comprising a flexible polymeric resin matrix selected from the group consisting of silicone, epoxy, acrylic, polyurethane, polyester, and polybutadiene;
(1) said particulate being present in said polymeric matrix in an amount ranging from between about 10% and 85% by volume and being sufficient in amount to produce a bulk layer having a hardness of between 10-80 Shore 00;
(b) said surface skin layers having a thickness of between 2 and 50 microns and selected from a polymeric resin being compatible with the polymeric matrix of said bulk layer and selected from the group consisting of silicone, epoxy, acrylic, polyurethane, polyester, and polybutadiene, and with said surface layers being blended with a thermally conductive finely divided particulate filler in an amount ranging less than that present in said bulk layer and ranging from between about 5% and 60% by volume;
(1) the hardness of said skin layer being substantially greater than that of the bulk layer, and ranging from between about 20 Shore 00 and 60 Shore A.
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Accused Products
Abstract
A flexible plastic thermally conductive multilayer semiconductor mounting pad having a highly thermally conductive bulk layer with thermally conductive surface skin layers bonded integrally to opposed major surfaces thereof. The bulk layer and the surface skin layers are each filled with a finely divided thermally conductive particulate, with the skin layers being harder than the bulk layer and being blended with an amount of filler which is less than that present in the bulk layer.
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Citations
13 Claims
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1. In a flexible plastic thermally conductive multi-layer semiconductor mounting pad having a highly thermally conductive bulk layer with thermally conductive surface skin layers bonded integrally to at least one of a pair of opposed major surfaces thereof, said semiconductor mounting pad being characterized in that:
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(a) said central bulk layer being filled with a finely divided thermally conductive particulate, and comprising a flexible polymeric resin matrix selected from the group consisting of silicone, epoxy, acrylic, polyurethane, polyester, and polybutadiene;
(1) said particulate being present in said polymeric matrix in an amount ranging from between about 10% and 85% by volume and being sufficient in amount to produce a bulk layer having a hardness of between 10-80 Shore 00;
(b) said surface skin layers having a thickness of between 2 and 50 microns and selected from a polymeric resin being compatible with the polymeric matrix of said bulk layer and selected from the group consisting of silicone, epoxy, acrylic, polyurethane, polyester, and polybutadiene, and with said surface layers being blended with a thermally conductive finely divided particulate filler in an amount ranging less than that present in said bulk layer and ranging from between about 5% and 60% by volume;
(1) the hardness of said skin layer being substantially greater than that of the bulk layer, and ranging from between about 20 Shore 00 and 60 Shore A. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification