Picosecond imaging circuit analysis probe and system

• US 6,657,446 B1
• Filed: 09/30/1999
• Issued: 12/02/2003
• Est. Priority Date: 09/30/1999
• Status: Expired due to Term

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: Advanced Micro Devices, Inc.
• Inventors: Garcia, Antonio Torres, Goruganthu, Rama R., Bruce, Michael R.
• Primary Examiner(s): Cuneo, Kamand
• Assistant Examiner(s): HOLLINGTON, JERMELE M
• Application Number:
  US09/409,974
• Time in Patent Office: 1,524 Days
• Field of Search: 324/752, 324/754, 324/537, 324/96, 324/753, 324/750, 324/751, 385/14, 438/32, 438/65, 438/69, 356/400, 356/401, 250/310, 250/311
• US Class Current: 324/754.03
• CPC Class Codes: G01R 31/311 of integrated circuits G01R31/31728 takes precedence

Abstract

An apparatus, system, and method are provided for testing an integrated circuit with a probe card having optical fibers. The optical fibers of the probe card are fixed in alignment with test structures in the integrated circuit, and each optical fiber is coupled to an avalanche photo-diode for measuring photoemissions from the test structures. The photoemissions can be analyzed to verify correct circuit behavior. The optical fibers can be alternatives or complements to electrically conductive probes of the probe card.

Claims

1. A system for testing an integrated circuit, comprising:

a test controller;

a probe card having a combination of electrically conductive probes coupled to the test controller and one or more optical fibers aligned with one or more test structures in the integrated circuit, the probe card including a substrate having a plurality of electrical conductors, the electrically conductive probes being coupled to the electrical conductors and extending from the substrate, the one or more optical fibers being supported by the substrate;

one or more photo-diodes optically coupled to the respective one or more optical fibers; and

one or more counters coupled to the respective photo-diodes configured and arranged to time-resolve photoemissions from the respective one or more test structures.

2. The apparatus of claim 1, further comprising a photo-multiplier tube coupled to one or more of the optical fibers.

3. The apparatus of claim 1, further comprising a micro-channel plate photo-multiplier tube coupled to one or more of the optical fibers.

4. The apparatus of claim 1, wherein one or more of the one or more photo-diodes is an avalanche photo-diode.

5. The apparatus of claim 4, wherein one or more of the one or more avalanche photo-diodes is a quadrant avalanche photo-diode.

6. The apparatus of claim 1, wherein each counter includes a timer circuit coupled to the photo-diode to the test controller, the timer circuit arranged to provide an output signal indicative of time expired between a signal from the test controller and a signal from the photo-diode.

7. The apparatus of claim 6, further comprising a computer coupled to the timer circuit, and configured and arranged to record the output signal.

8. The apparatus of claim 6, wherein the timer circuit is a time-to-amplitude converter.

9. The apparatus of claim 8, further comprising an analog-to-digital converter coupled between the timer and the computer.

10. The apparatus of claim 9, further comprising a multi-channel analyzer board coupled to the analog-to-digital converter.

11. A process for testing an integrated circuit with a test controller, comprising:

aligning a probe card with the integrated circuit, the probe card having one or more optical fibers aligned with one or more test structures in the integrated circuit and a plurality of electrically conductive probes aligned with respective contact pads of the integrated circuit, the probe card including a substrate having a plurality of electrical conductors, the electrically conductive probes being coupled to the electrical conductors and extending from the substrate, the one or more optical fibers being supported by the substrate;

coupling the one or more optical fibers to one or more respective photo-diodes;

applying electrical signals to the integrated circuit via the probes;

detecting photo-emissions from the one or more test structures with the photo-diode; and

measuring a duration of time between occurrence of a selected output signal from a test controller and an output signal from the photo-diode.

12. The process of claim 11, further comprising the step of generating a voltage at a level proportional to the duration of time between when a selected signal is output from the test controller and the photo-diode outputs a signal.

13. The process of claim 12, further comprising the step of coupling the photo-dioide and the integrated circuit to a time-to-amplitude converter.

14. The process of claim 13, further comprising the step of coupling the time-to-amplitude converter to a analog-to-digital converter and coupling the analog-to-digital converter to a computer.