Formation of an embedded capacitor plane using a thin dielectric
First Claim
1. A capacitor, which is comprised of a pair of electrically conductive foils comprising a copper substrate and a metal layer on a surface of the copper substrate which metal layer comprises nickel, a pair of dielectric layers, one dielectric layer being on a surface of each of the metal layers and substantially the entirety of the dielectric layers being attached to one another.
2 Assignments
0 Petitions
Accused Products
Abstract
A capacitor, which has a pair of conductive foils each having a dielectric layer on its surface, wherein the dielectric layers are attached to one another. In one process for its production, a capacitor is formed by applying a first dielectric layer onto a surface of a first conductive foil; applying a second dielectric layer onto a surface of a second conductive foil; and then attaching the first and second dielectric layers to one another. The resulting capacitor exhibits excellent void resistance.
-
Citations
29 Claims
- 1. A capacitor, which is comprised of a pair of electrically conductive foils comprising a copper substrate and a metal layer on a surface of the copper substrate which metal layer comprises nickel, a pair of dielectric layers, one dielectric layer being on a surface of each of the metal layers and substantially the entirety of the dielectric layers being attached to one another.
- 19. A capacitor which comprises an electrically conductive foil comprising a copper substrate and a metal layer on a surface of the copper substrate which metal layer comprises nickel, a first dielectric layer on a surface of the metal layer, a second dielectric layer on substantially the entirely of the first dielectric layer and an electrically conductive layer on the second dielectric layer.
-
25. A process for forming a capacitor which comprises providing a first and a second electrically conductive foil, each conductive foil comprising a copper substrate and a metal layer on a surface of the copper substrate which metal layer comprises nickel;
- applying a first dielectric layer onto a surface of the metal layer of the first conductive foil;
applying a second dielectric layer onto a surface of the metal layer of the second conductive foil and then attaching substantially the entirety of the first and second dielectric layers to one another. - View Dependent Claims (26, 27, 28, 29)
- applying a first dielectric layer onto a surface of the metal layer of the first conductive foil;
Specification