Wafer bonded vertical cavity surface emitting laser systems

• US 6,658,041 B2
• Filed: 03/20/2002
• Issued: 12/02/2003
• Est. Priority Date: 03/20/2002
• Status: Active Grant

• Current Assignee: Broadcom International Pte Ltd. (Broadcom, Inc.)
• Original Assignee: Agilent Technologies, Inc.
• Inventors: Uebbing, John J.
• Primary Examiner(s): Ip, Paul
• Assistant Examiner(s): Vy, Hung T
• Application Number:
  US10/102,294
• Publication Number:
  US 20030179800A1
• Time in Patent Office: 622 Days
• Field of Search: 372/96, 359/180, 438/47, 438/289, 257/98
• US Class Current: 372/96
• CPC Class Codes: H01S 5/0215 Bonding to the substrate
• CPC Class Codes: H01S 5/02251 using optical fibres
• CPC Class Codes: H01S 5/0234 Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
• CPC Class Codes: H01S 5/0237 by soldering
• CPC Class Codes: H01S 5/18305 with emission through the substrate, i.e. bottom emission
• CPC Class Codes: H01S 5/18313 by oxidizing at least one of the DBR layers
• CPC Class Codes: H01S 5/18333 only above the active layer
• CPC Class Codes: H01S 5/18388 Lenses

Abstract

Vertical cavity surface emitting laser systems and methods of making the same are described. In one aspect, a vertical cavity surface emitting laser system has a bottom side that may be flip-chip mounted to a driver substrate and a top side that is configured to transmit light through an optically transparent substrate. By this configuration, vertical cavity surface emitting laser systems may be packed together with a greater density and operated at greater speeds relative to, for example, wire bonded vertical cavity surface emitting laser systems. In addition, such systems may be flexibly tailored to produce light over a wide range of wavelengths. Such systems also may be efficiently packaged on a wafer scale.

Claims

1. A vertical cavity surface emitting laser (VCSEL) system, comprising:

a substrate optically transparent to light in a selected wavelength range;

a vertical stack structure having a substantially planar top side wafer bonded to the optically transparent substrate and a bottom side, and including

a top mirror,

a bottom mirror, and

a cavity region disposed between the top mirror and the bottom mirror and including an active light generation region operable to generate light in the selected wavelength range,

wherein the vertical stack structure is constructed and arranged to direct light generated in the cavity region to the optically transparent substrate; and

first and second contacts disposed over the bottom side of the vertical stack structure and electrically connected for driving the cavity region.

2. The VCSEL system of claim 1, wherein the optically transparent substrate comprises glass.

3. The VCSEL system of claim 2, wherein the optically transparent substrate comprises borosilicate glass.

4. The VCSEL system of claim 1, wherein the optically transparent substrate comprises gallium phosphide.

5. The VCSEL system of claim 1, further comprising a lens disposed on the substrate in alignment with the active light generation region.

6. The VCSEL system of claim 1, wherein at least one of the top mirror and the bottom mirror has a layer with a peripheral region oxidized into an electrical insulator as a result of exposure to an oxidizing agent.

7. The VCSEL system of claim 6, further comprising two or more etched holes each extending from a substantially planar surface of the bottom mirror to the oxidized peripheral region.

8. The VCSEL system of claim 1, wherein the top mirror and the bottom mirror each comprises a system of alternating layers of different refractive index materials.

9. The VCSEL system of claim 8, wherein the top mirror and the bottom mirror each comprises a system of alternating layers of relatively high aluminum content AlGaAs and relatively low aluminum content AlGaAs.

10. The VCSEL system of claim 1, further comprising an integrated circuit bonded to the pair of contacts and operable to drive the cavity region.

21. The VCSEL system of claim 1, wherein the first and second contacts are respectively disposed on surfaces of different active layers each extending to the light generation region of the cavity region.

11. A method of fabricating a vertical cavity surface emitting laser (VCSEL) system, comprising:

providing a sacrificial substrate;

forming over the sacrificial substrate a vertical stack structure having a substantially planar top side and a bottom side, and including

a top mirror,

a bottom mirror, and

a cavity region disposed between the top mirror and the bottom mirror and including an active light generation region operable to generate light in a selected wavelength range,

wherein the vertical stack structure is constructed and arranged to direct light generated in the cavity region away from the sacrificial substrate; and

wafer bonding the substantially planar top side of the vertical stack structure to a substrate optically transparent to light in the selected wavelength range;

removing the sacrificial substrate after the optically transparent substrate has been wafer bonded to the substantially planar top side of the vertical stack structure; and

forming over the bottom side of the vertical stack structure first and second contacts electrically connected for driving the cavity region.

12. The method of claim 11, wherein the optically transparent substrate comprises glass.

13. The method of claim 12, wherein the optically transparent substrate comprises borosilicate glass.

14. The method of claim 11, wherein the optically transparent substrate comprises gallium phosphide.

15. The method of claim 11, further comprising forming a lens on the glass substrate in alignment with the active light generation region.

16. The method of claim 11, wherein at least one of the top mirror and the bottom mirror has a layer with a peripheral region oxidized into an electrical insulator as a result of exposure to an oxidizing agent.

17. The method of claim 16, further comprising forming two or more etched holes each extending from a substantially planar surface of the bottom mirror to the oxidized peripheral region.

18. The method of claim 11, wherein the top mirror and the bottom mirror each comprises a system of alternating layers of different refractive index materials.

19. The method of claim 18, wherein the top mirror and the bottom mirror each comprises a system of alternating layers of relatively high aluminum content AlGaAs and relatively low aluminum content AlGaAs.

20. The method of claim 11, further comprising bonding to the pair of contacts an integrated circuit operable to drive the cavity region.

22. The method of claim 11, wherein the first and second contacts are respectively formed on surfaces of different active layers each extending to the light generation region of the cavity region.