Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
First Claim
1. A carrier for planarizing a first surface of a work piece comprising:
- a carrier housing;
a carrier insert coupled to the work piece carrier housing, the carrier insert comprising;
a work piece bladder having a work piece diaphragm with a surface configured to press against a second surface of a work piece and having a plurality of ribs integrally formed with the work piece diaphragm;
an optically transparent carrier backing plate adapted for coupling to the carrier housing; and
a plurality of clamps for scaling the ribs to the carrier backing plate;
a plurality of web plenums bounded by the work piece diaphragm, ribs, and carrier backing plate and in each of which the pressure can be controlled; and
a plurality of carrier plenums bounded by the ribs and the carrier backing plate and in each of which the pressure can be controlled to control pressure exerted on a corresponding one of the plurality of ribs; and
a floating wear ring coupled to the carrier housing and surrounding and closely spaced apart from the work piece bladder.
2 Assignments
0 Petitions
Accused Products
Abstract
An apparatus for planarizing a work piece includes an easily assembled work carrier. The carrier includes a carrier insert having a work piece bladder clamped to a carrier backing plate with a plurality of clamps to form a plurality of web plenums. The outer edge of the bladder is supported by a rib that is coupled to a carrier plenum. By adjusting the pressure in the carrier plenum, the pressure exerted on the edge of a work piece during a planarization operation can be adjusted. The carrier also includes a floating wear ring that surrounds the work piece bladder and a work piece mounted on that bladder. By adjusting the force exerted by the wear ring on a polishing pad, independently of the pressure exerted by the rib at the edge of the bladder, the material removal rate near the edge of the work piece can be controlled.
106 Citations
21 Claims
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1. A carrier for planarizing a first surface of a work piece comprising:
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a carrier housing;
a carrier insert coupled to the work piece carrier housing, the carrier insert comprising;
a work piece bladder having a work piece diaphragm with a surface configured to press against a second surface of a work piece and having a plurality of ribs integrally formed with the work piece diaphragm;
an optically transparent carrier backing plate adapted for coupling to the carrier housing; and
a plurality of clamps for scaling the ribs to the carrier backing plate;
a plurality of web plenums bounded by the work piece diaphragm, ribs, and carrier backing plate and in each of which the pressure can be controlled; and
a plurality of carrier plenums bounded by the ribs and the carrier backing plate and in each of which the pressure can be controlled to control pressure exerted on a corresponding one of the plurality of ribs; and
a floating wear ring coupled to the carrier housing and surrounding and closely spaced apart from the work piece bladder. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A carrier insert for a CMP apparatus comprising:
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a work piece bladder comprising a work piece diaphragm and a plurality of concentric ribs integrally formed with the work piece diaphragm;
an optically transparent carrier backing plate adapted for coupling to the CMP apparatus; and
a plurality of circular clamps coupled to the carrier backing plate and sealing the plurality of ribs to the carrier backing plate. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
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18. A work piece bladder for use with a CMP apparatus comprising a work piece diaphragm having a first surface adapted for pressing against a surface of a work piece and a plurality of concentric ribs extending substantially orthogonally from a second surface of the work piece diaphragm, each of the plurality of concentric ribs terminating in an expanded portion substantially parallel to the work piece diaphragm, the expanded portion adapted for clamping to a carrier backing plate of a CMP apparatus, the expanded portion comprising a shaped, upwardly extending portion having a first bulbous portion and a second alignment portion.
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19. A method for planarizing a first surface of a work piece utilizing a CMP apparatus comprising:
- a polishing pad, a work piece diaphragm supported by a plurality of ribs including an outermost rib, each of the ribs having a pressure adjustable carrier plenum associated therewith, the work piece diaphragm having a first surface for pressing against a second surface of the work piece, a plurality of pressure adjustable web plenums positioned adjacent a second surface of the work piece diaphragm, and a wear ring surrounding the work piece diaphragm and configured to press against the polishing pad, the pressure with which the wear ring presses against the polishing pad being adjustable, the method comprising the steps of;
positioning a second surface of a work piece adjacent the first surface of the work piece diaphragm;
positioning the first surface of the work piece in contact with the polishing pad;
establishing a predetermined pressure in each of the pressure adjustable web plenums;
pressing the wear ring against the polishing pad with a predetermined force;
adjusting, independent of the predetermined force, the pressure in the carrier plenum associated with the outermost rib; and
initiating relative motion between the work piece diaphragm and the polishing pad. - View Dependent Claims (20, 21)
- a polishing pad, a work piece diaphragm supported by a plurality of ribs including an outermost rib, each of the ribs having a pressure adjustable carrier plenum associated therewith, the work piece diaphragm having a first surface for pressing against a second surface of the work piece, a plurality of pressure adjustable web plenums positioned adjacent a second surface of the work piece diaphragm, and a wear ring surrounding the work piece diaphragm and configured to press against the polishing pad, the pressure with which the wear ring presses against the polishing pad being adjustable, the method comprising the steps of;
Specification