Apparatus and method for reactive atom plasma processing for material deposition

• US 6,660,177 B2
• Filed: 11/07/2001
• Issued: 12/09/2003
• Est. Priority Date: 11/07/2001
• Status: Expired due to Term

• Current Assignee: Imreal Enterprises, LLC
• Original Assignee: Rapt Industries, Inc.
• Inventors: Carr, Jeffrey W.
• Primary Examiner(s): Powell, William A.
• Application Number:
  US10/008,236
• Publication Number:
  US 20030087530A1
• Time in Patent Office: 762 Days
• Field of Search: 216/38, 216/63, 216/67, 216/79, 216/80, 216/37, 438/710, 438/723, 438/743, 156/345.26, 156/345.55
• US Class Current: 216/63
• CPC Class Codes: C23C 16/0245 by etching with a plasma
• CPC Class Codes: C23C 16/047 using irradiation by energy or particles
• CPC Class Codes: C23C 16/513 using plasma jets
• CPC Class Codes: H01J 37/32376 Scanning across large workpieces
• CPC Class Codes: H01L 21/31051 Planarisation of the insulating layers H01L21/31058 takes precedence
• CPC Class Codes: H05H 1/30 using applied electromagnetic fields, e.g. high frequency or microwave energy H05H1/28 takes precedence

Abstract

Reactive atom plasma processing can be used to shape, polish, planarize, and clean surfaces of difficult materials with minimal subsurface damage. The apparatus and methods use a plasma torch, such as a conventional ICP torch. The workpiece and plasma torch are moved with respect to each other, whether by translating and/or rotating the workpiece, the plasma, or both. The plasma discharge from the torch can be used to shape, planarize, polish, clean and/or deposit material on the surface of the workpiece, as well as to thin the workpiece. The processing may cause minimal or no damage to the workpiece underneath the surface, and may involve removing material from, and/or redistributing material on, the surface of the workpiece.

Claims

1. A method for shaping a surface of a workpiece, comprising:

placing the workpiece in a plasma processing chamber including a plasma torch;

translating at least one of the workpiece and the plasma torch; and

using reactive atom plasma processing to add material to the surface of the workpiece and shape the surface with the discharge from the plasma torch.

2. A method according to claim 1, wherein the step of using reactive plasma processing to shape the surface of the workpiece further comprises removing material from the surface of the workpiece.

3. A method according to claim 1, further comprising:

altering the chemistry of the surface of the workpiece with the plasma.

4. A method according to claim 1, wherein the step of using reactive plasma processing to shape the surface of the workpiece causes minimal or no damage to the workpiece underneath the surface.

5. A method according to claim 1, further comprising:

rotating the workpiece with respect to the plasma torch.

6. A method according to claim 1, further comprising:

creating a reactive species in the plasma.

7. A method according to claim 1, further comprising:

placing a precursor in a central channel of the plasma torch.

8. A method according to claim 1, further comprising:

placing a precursor in the plasma torch and creating a reactive species in the plasma.

9. A method according to claim 1, further comprising:

placing a precursor in the plasma torch.

10. A method according to claim 1, further comprising:

controlling the mass flow of a precursor into the plasma.

11. A method according to claim 1, further comprising:

controlling the mass flow of a precursor into the plasma from between about 0 ml/min to about 2,000 ml/min.

12. A method according to claim 1, further comprising:

controlling the mass flow of a precursor into the plasma from between about 0 ml/min to about 50,000 ml/min.

13. A method according to claim 1, further comprising:

selecting a concentration of precursor to be introduced into a central channel of the plasma.

14. A method according to claim 1, further comprising:

introducing a plasma gas through an outer tube of the plasma torch.

15. A method according to claim 1, further comprising:

coupling energy to the discharge in an annular region of the plasma torch.

16. A method according to claim 1, further comprising:

introducing an auxiliary gas through a second of three concentric tubes in the plasma torch.

17. A method according to claim 1, further comprising:

using an auxiliary gas to keep hot plasma away from a central channel of the plasma torch.

18. A method according to claim 1, further comprising:

using an auxiliary gas to adjust the position of a discharge.

19. A method according to claim 1, further comprising:

controlling the size of a discharge by selecting the inner diameter of an outer tube of the plasma torch.

20. A method according to claim 1, further comprising:

introducing a plasma gas tangentially.

21. A method according to claim 1, further comprising:

metering gas flow in the plasma torch.

22. A method according to claim 1, further comprising:

maintaining the temperature of the plasma between 5,000 and 15,000 degrees C.

23. A method according to claim 1, further comprising:

producing a volatile reaction on the surface of the workpiece.

24. A method according to claim 1, further comprising:

maintaining the processing chamber at about atmospheric pressure.

25. A method according to claim 1, further comprising:

cleaning the surface of the workpiece with the plasma.

26. A method according to claim 1, further comprising:

polishing the surface of the workpiece with the plasma.

27. A method according to claim 1, further comprising:

planarizing the surface of the workpiece with the plasma.

28. A method according to claim 1, further comprising:

using a plasma torch with a multiple head to increase the plasma etch rate.

29. A method according to claim 1, further comprising:

using a precursor solution to control the etch rate of the plasma.

30. A method according to claim 1, further comprising:

using a precursor to control the etch rate of the plasma, the precursor being any one of a solid, liquid, or gas.

31. A method for planarizing a surface of a workpiece, comprising:

placing the workpiece in a plasma processing chamber including a plasma torch;

translating at least one of the workpiece and the plasma torch;

depositing material on the surface of the workpiece using the plasma torch;

removing material from the surface of the workpiece using a discharge from the plasma torch; and

using reactive atom plasma processing to redeposit the removed material on the surface of the workpiece.

32. A method according to claim 31, further comprising:

rotating the workpiece with respect to the plasma torch.

33. A method according to claim 31, further comprising:

introducing reactive species into the plasma through a central channel in the plasma torch.

34. A method according to claim 31, further comprising:

placing a precursor in a central channel of the plasma.

35. A method according to claim 31, further comprising:

controlling the mass flow of a precursor into the processing chamber.

36. A method according to claim 31, further comprising:

selecting a concentration of precursor to be introduced into a central channel of the plasma.

37. A method according to claim 31, further comprising:

introducing a plasma gas through an outer tube of the plasma torch.

38. A method according to claim 31, further comprising:

coupling energy to the discharge in an annular region of the plasma torch.

39. A method according to claim 31, further comprising:

introducing an auxiliary gas through a second of three concentric tubes in the plasma torch.

40. A method according to claim 31, further comprising:

using an auxiliary gas to adjust the size of a discharge.

41. A method according to claim 31, further comprising:

controlling the size of a discharge by selecting the inner diameter of an outer tube of the plasma torch.

42. A method according to claim 31, further comprising:

maintaining the temperature of the plasma.

43. A method according to claim 31, further comprising:

producing a volatile reaction in the processing chamber.

44. A method according to claim 31, further comprising:

maintaining the processing chamber at atmospheric pressure.

45. A method according to claim 31, further comprising:

altering the chemistry of the surface of the workpiece with the plasma.

46. A method according to claim 31, further comprising:

polishing the surface of the workpiece with the plasma.

47. A method according to claim 31, further comprising:

controlling the removal rate at which material is removed from the surface of the workpiece.

48. A method according to claim 31, further comprising:

controlling the deposition rate at which material is deposited onto the surface of the workpiece.

49. A method according to claim 31, further comprising:

controlling the redeposition rate at which material removed from the surface during processing is redeposited on the surface.

50. A method for cleaning a surface, comprising:

placing the workpiece in a plasma processing chamber including a plasma torch;

translating at least one of the workpiece and the plasma torch; and

using reactive atom plasma processing to deposit and remove material from the surface of the workpiece.

51. A method for redistributing a material on a surface, comprising:

placing the workpiece in a plasma processing chamber including a plasma torch;

translating at least one of the workpiece and the plasma torch; and

using reactive atom plasma processing to deposit and redistribute material on the surface of the workpiece.

52. A tool for shaping the surface of a workpiece, the tool being able to accomplish the following steps:

positioning a workpiece in a plasma processing chamber including a plasma torch;

translating at least one of the workpiece and the plasma torch; and

using reactive atom plasma processing to deposit material on the surface of the workpiece and shape the surface with the discharge from the plasma torch.

53. A tool for shaping the surface of a workpiece, comprising:

means for positioning a workpiece in a plasma processing chamber including a plasma torch;

means for translating at least one of the workpiece and the plasma torch; and

means for using reactive atom plasma processing to deposit material on the surface of the workpiece and shape the surface with the discharge from the plasma torch.

54. A tool for shaping the surface of a workpiece, comprising:

a plasma torch;

a translator that can translate at least one of a workpiece and said torch; and

wherein said torch is configured to deposit material and shape the surface of a workpiece using a reactive plasma process.

55. A chemical reactor for shaping the surface of a workpiece, comprising:

a plasma processing chamber including a plasma torch;

a translator that can translate at least one of a workpiece and said plasma torch, whereby said torch can shape the surface of a workpiece using a reactive plasma process; and

a temperature regulator for affecting the at least one of the rate of removal and the rate of deposition of material by controlling at least one of the position of the workpiece, the power, the plasma gas flow rate, and the distance of the workpiece from the plasma torch.

56. A method for shaping an optic, comprising:

placing an optic workpiece in a plasma processing chamber including a plasma torch;

translating at least one of the optic workpiece and the plasma torch; and

using reactive atom plasma processing to shape the surface of the optic workpiece with the discharge from the plasma torch by depositing and redistributing material on the surface.

57. A method for shaping a high-damage threshold optic, comprising:

placing a high-damage threshold optic workpiece in a plasma processing chamber including a plasma torch;

translating at least one of the optic workpiece and the plasma torch; and

using reactive atom plasma processing to shape the surface of the optic workpiece with the discharge from the plasma torch by depositing and redistributing material on the surface.