Method of forming conductive pattern

• US 6,660,457 B1
• Filed: 05/23/2001
• Issued: 12/09/2003
• Est. Priority Date: 11/26/1998
• Status: Expired due to Fees

• Current Assignee: Kansai Paint Company Limited
• Original Assignee: Kansai Paint Company Limited
• Inventors: Kojima, Daisuke, Kogure, Hideo, Imai, Genji
• Primary Examiner(s): Huff, Mark F.
• Assistant Examiner(s): Sagar, Kripa
• Application Number:
  US09/831,892
• Time in Patent Office: 930 Days
• Field of Search: 430/311, 430/313, 430/323, 430/198, 430/299
• US Class Current: 430/315
• CPC Class Codes: G03F 7/0007 Filters, e.g. additive colour filters; Components for display devices
• CPC Class Codes: G03F 7/093 characterised by antistatic means, e.g. for charge depletion
• CPC Class Codes: G03F 7/11 having cover layers or intermediate layers, e.g. subbing layers G03F7/091 - G03F7/093, B41N3/03 take precedence
• CPC Class Codes: G03F 7/40 Treatment after imagewise removal, e.g. baking
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2203/107 Using laser light shaping a substrate by laser ablation H05K3/0026
• CPC Class Codes: H05K 3/0082 characterised by the exposure method of radiation-sensitive masks
• CPC Class Codes: H05K 3/06 the conductive material being removed chemically or electrolytically, e.g. by photo-etch process semi-additive methods H05K3/108
• CPC Class Codes: H05K 3/064 Photoresists

Abstract

The present invention provides a method of forming a conductive pattern, comprising the steps of:

(1) depositing a conductive coating-forming resin layer and an energy beam-sensitive coating layer on a substrate in this order;

(2) irradiating a surface of the energy beam-sensitive coating layer with an active energy beam or heat rays directly or through a mask, so as to obtain a desired pattern;

(3) developing the energy beam-sensitive coating layer to form a resist pattern coating from the energy beam-sensitive coating layer; and

(4) removing revealed portions of the conductive coating-forming resin layer by development.

The present invention also provides a method of forming a conductive pattern, comprising the step (1), the step (2), and the step of:

(3′) developing the energy beam-sensitive coating layer and the conductive coating-forming resin layer simultaneously.

Claims

1. A method of forming a conductive pattern, comprising the steps of:

(1) depositing a first conductive coating-forming thermoplastic resin layer and a second positive photosensitive coating layer on a substrate;

(2) irradiating the surface of positive photosensitive coating layer directly with a laser beam oscillating in the visible region, so as to obtain a desired pattern; and

(3) developing the positive photosensitive coating layer and the conductive coating-forming thermoplastic resin layer simultaneously;

wherein the conductive coating-forming thermoplastic resin layer has a glass transition temperature higher than the temperature of the development of the resin layer.

2. The method according to claim 1, wherein the conductive coating-forming thermoplastic resin layer contains a resin for development which imparts to the resin layer a glass transition temperature higher than the temperature for the development of the resin layer.

3. The method according to claim 1, wherein the conductive coating-forming thermoplastic resin layer comprises

a conductive material,

a thermoplastic resin, and

an inorganic powder fusible by heat;

the method further comprising the step of baking by heating the conductive coating-forming thermoplastic resin layer after development.

4. The method according to claim 1, wherein the positive photosensitive coating layer comprises a liquid resist or a dry resist film.