Single level microelectronic device package with an integral window

• US 6,661,084 B1
• Filed: 02/25/2002
• Issued: 12/09/2003
• Est. Priority Date: 05/16/2000
• Status: Expired due to Term

• Current Assignee: National Technology & Engineering Solutions Of Sandia LLC (Honeywell International Inc.)
• Original Assignee: Sandia Corporation (Martin Marietta Corporation)
• Inventors: Peterson, Kenneth A., Watson, Robert D.
• Primary Examiner(s): Graybill, David E.
• Assistant Examiner(s): THAI, LUAN C
• Application Number:
  US10/083,454
• Time in Patent Office: 652 Days
• Field of Search: 257/680, 257/778, 257/682, 257/693, 257/698, 257/704, 257/737, 257/738, 257/779, 257/780, 257/432, 257/433, 257/434
• US Class Current: 257/680
• CPC Class Codes: B81B 7/0067 for controlling the passage of optical signals through the package
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48237 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/854 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06517 Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06558 the devices having passive surfaces facing each other, i.e. in a back-to-back arrangement
• CPC Class Codes: H01L 2225/06565 the devices having the same size and there being no auxiliary carrier between the devices
• CPC Class Codes: H01L 2225/06572 : Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 2225/1011 : the containers being in a stacked arrangement
• CPC Class Codes: H01L 2225/1052 : Wire or wire-like electrical connections
• CPC Class Codes: H01L 2225/1064 : Electrical connections provided on a side surface of one or more of the containers
• CPC Class Codes: H01L 23/053 : the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/10 : characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 25/16 : the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 27/14618 : Containers
• CPC Class Codes: H01L 27/14636 : Interconnect structures
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/04941 : TiN
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15151 : the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/16235 : Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
• CPC Class Codes: H01L 2924/1627 : stacked type assemblies, e.g. stacked multi-cavities
• CPC Class Codes: H01L 2924/16788 : Glasses, e.g. amorphous oxides, nitrides or fluorides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H05K 1/02 : Details
• CPC Class Codes: H05K 1/181 : associated with surface mounted components

Abstract

A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed in-between the window and the package. The device can be a semiconductor chip, CCD chip, CMOS chip, VCSEL chip, laser diode, MEMS device, or IMEMS device. The package can be formed of a multilayered LTCC or HTCC cofired ceramic material, with the integral window being simultaneously joined to the package during cofiring. The microelectronic device can be flip-chip interconnected so that the light-sensitive side is optically accessible through the window. A glob-top encapsulant or protective cover can be used to protect the microelectronic device and electrical interconnections. The result is a compact, low profile package having an integral window that is hermetically sealed to the package prior to mounting and interconnecting the microelectronic device.

Claims

1. A package with an integral window for housing a microelectronic device, comprising:

an electrically insulating, multilayered plate having a first surface, an opposing second surface, and an aperture disposed through the plate;

a first electrical conductor disposed on the second surface of the plate; and

an integral window disposed across the aperture and bonded directly to the plate without having a separate layer of adhesive material disposed in-between the window and the plate;

wherein the geometrical relationship between the outer edge of the integral window and the multilayered plate is selected from the group consisting of an encased joint, a lip recessed inside of the plate, a self-locking geometry, and a geometry that substantially fills the aperture.

2. The package of claim 1, wherein the at least one said first electrical conductor comprises a thick-film metallized trace.

3. The package of claim 1, wherein the first electrical conductor comprises an electrical lead.

4. The package of claim 1, wherein the window is bonded directly to a lip recessed inside of the plate.

5. The package of claim 1, wherein the geometrical relationship between the window and the plate comprises an encased joint geometry.

6. The package of claim 1, wherein the geometry of the outer edge of the window comprises a self-locking geometry selected from the group consisting of a tapered outer edge, a convex rounded outer edge, and a chevron-shaped double-tapered outer edge.

7. The package of claim 1, wherein the window substantially fills the aperture.

8. The package of claim 1, wherein the window has a convex outer shape for concentrating light passing through the window.

9. The package of claim 1, wherein the window comprises an optically transparent material selected from the group consisting of glass, sapphire, fused silica, clear plastic and clear polymer.

10. The package of claim 1, wherein the window comprises a material selected from the group consisting of silicon, germanium, metal, metal alloy, lithium niobate and lithium tantalate.

11. The package of claim 1, wherein the window comprises a material selected from the group consisting of barium fluoride, calcium fluoride, lithium fluoride, magnesium fluoride, potassium fluoride, sodium chloride, zinc oxide, and zinc selenide.

12. The package of claim 1, wherein the window comprises an anti-reflection coating.

13. The package of claim 1, wherein the window comprises means for filtering selected wavelengths of light.

14. The package of claim 1, wherein the window further comprises an array of binary optic lenslets for optically transforming the light that passes through the window.

15. The package of claim 1, wherein the multilayered material comprises a low-temperature cofired ceramic multilayered material fired at a temperature from about 600°

C. to about 1000°

C.

16. The package of claim 1, wherein said multilayered material comprises a high-temperature cofired ceramic multilayered material fired at a temperature from about 1300°

C. to about 1800°

C.

17. The package of claim 1, wherein said multilayered material comprises a polymer-based printed wiring board composition.

18. The package of claim 1, further comprising a first microelectronic device flip-chip interconnected to the first electrical conductor.

19. The package of claim 18, wherein the first microelectronic device comprises a light-sensitive side facing the window.

20. The package of claim 18, further comprising a polymer underfill encapsulating at least one of the flip-chip electrical interconnections.

21. The package of claim 18, wherein said first microelectronic device comprises a chip selected from the group consisting of a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode chip, a LED chip, a MEMS chip, and a IMEMS chip.

22. The package of claim 18, further comprising a continuous ring seal disposed in-between the first microelectronic device and the plate.

23. The package of claim 18, wherein the first electrical conductor comprises an electrical lead, and wherein the first electrical device is TAB bonded to the electrical lead.

24. The package of claim 22, further comprising a second microelectronic device, mounted back-to-back to the first microelectronic device.

25. The package of claim 18, wherein the atmosphere in-between the window and the ring seal comprises a dry inert gas other than air, selected from the group consisting of argon, nitrogen, and helium, and combinations thereof.

26. The package of claim 24, wherein the plate further comprises a second electrical conductor disposed on the second surface of the plate, and wherein the second microelectronic device is wirebonded to said second electrical conductor.

27. The package of claim 26, wherein the wirebond and the pair of microelectronic devices are substantially encapsulated in a polymer-based encapsulant.

28. The package of claim 27, further comprising an opening in the polymer-based encapsulant for providing open access to the front side of the second microelectronic device.

29. The package of claim 28, wherein the opening in the polymer-based encapsulant is defined by a dam that encircles at least some of the front side of the second microelectronic device, which prevents the encapsulant from occluding the front side of the second microelectronic device during encapsulation of the wirebond.

30. The package of claim 29, wherein the dam comprises a U-shaped cap having a top that covers the opening in the polymer-based encapsulant defined by the sidewalls of the U-shaped cap.

31. The package of claim 30, wherein the U-shaped cap is transparent.

32. The package of claim 24, further comprising a protective cover attached to the second surface of the plate, which covers and protects the wirebonds and the pair of microelectronic devices.

33. The package of claim 32, wherein the protective cover is attached to the plate with a material selected from the group consisting of a hermetic sealant and an adhesive.

34. The package of claim 32, wherein the protective cover is transparent.

35. The package of claim 32, wherein the protective cover comprises a window.

36. A package with an integral window for housing a microelectronic device, comprising:

an electrically insulating plate comprising a first surface, an opposing second surface, and an aperture disposed through the plate;

a first electrical conductor disposed on the second surface of the plate;

an integral window disposed across the aperture and bonded directly to the plate, without having a separate layer of adhesive material disposed in-between the window and the plate; and

a first microelectronic device flip-chip interconnected to the first electrical conductor;

wherein the package is mounted on, and electrically interconnected to, a printed wiring board;

wherein the printed wiring board comprises an opening through the board; and

wherein the aperture in the package is aligned with the opening in the printed wiring board, thereby allowing light to pass through both the opening and the aperture to interact with a light-sensitive side of the first microelectronic device.