Fluid-cooled heat sink for electronic components
First Claim
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1. A fluid-cooled heat sink for electronic components, comprising:
- a first metal plate having a first face and a second face, the first metal plate being associated to at least one electronic component at least along the first face;
a second plate having a first face and a second face, the first face of the second plate being joined to the second face of the first plate, said second plate having a thickness substantially less than the thickness of said first plate;
at least one groove for a cooling fluid defined in the first face of the second plate; and
means of connection between the first plate and the second plate, the heat sink being characterized in that the first face and the second face of the second plate are substantially parallel to each other at least along the length of the groove.
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Abstract
A fluid-cooled heat sink for electronic components includes a first metal plate designed to be positioned in contact with at least one electronic component and a second plate having a first face and a second face. The first face of the second plate is joined to the first plate. The first face of the second plate has a groove formed therein for accommodating a cooling liquid. The first face and the second face of the second plate are parallel at least along the length of the groove.
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Citations
16 Claims
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1. A fluid-cooled heat sink for electronic components, comprising:
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a first metal plate having a first face and a second face, the first metal plate being associated to at least one electronic component at least along the first face;
a second plate having a first face and a second face, the first face of the second plate being joined to the second face of the first plate, said second plate having a thickness substantially less than the thickness of said first plate;
at least one groove for a cooling fluid defined in the first face of the second plate; and
means of connection between the first plate and the second plate, the heat sink being characterized in that the first face and the second face of the second plate are substantially parallel to each other at least along the length of the groove. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A process for making a fluid-cooled heat sink for electronic components, comprising the following steps:
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providing a first metal plate having a first face and a second face;
providing a second metal plate having a first face and a second face, said second plate having a thickness substantially less than the thickness of said first plate;
defining in the second plate a groove through which a cooling fluid can pass;
joining the first face of the second plate to the second face of the first plate in such a way that the groove faces the first plate, the process being characterized in that the step of forming the groove consists in forming the groove on the second plate by plastic deformation; and
forming at least two through holes in the first plate to form the inlet and the outlet of the groove. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
placing at least one seal between the first plate and the second plate; and
attaching the first and second plates to each other using at least one screw.
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16. The process according to claim from 9, further comprising the step of finishing the first plate at least on its first face to flatten the first face of the first plate guarantees maximum contact between the two for increasing surface contact between the electronic component and the first face of the first plate.
Specification