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Fluid-cooled heat sink for electronic components

  • US 6,661,658 B2
  • Filed: 04/12/2002
  • Issued: 12/09/2003
  • Est. Priority Date: 04/27/2001
  • Status: Expired due to Term
First Claim
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1. A fluid-cooled heat sink for electronic components, comprising:

  • a first metal plate having a first face and a second face, the first metal plate being associated to at least one electronic component at least along the first face;

    a second plate having a first face and a second face, the first face of the second plate being joined to the second face of the first plate, said second plate having a thickness substantially less than the thickness of said first plate;

    at least one groove for a cooling fluid defined in the first face of the second plate; and

    means of connection between the first plate and the second plate, the heat sink being characterized in that the first face and the second face of the second plate are substantially parallel to each other at least along the length of the groove.

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