Electronic surface mount package

• US 6,662,431 B1
• Filed: 02/05/2002
• Issued: 12/16/2003
• Est. Priority Date: 08/06/1997
• Status: Expired due to Term

• Current Assignee: Halo Electronics Incorporated
• Original Assignee: Halo Electronics Incorporated
• Inventors: Lu, Peter, Heaton, James W., Lam, Robert Loke Hang, Sun, Tsang Kei, Heaton, Jeffrey, Pao, Peter Loh Hang
• Primary Examiner(s): MAI, ANH T
• Application Number:
  US10/072,309
• Time in Patent Office: 679 Days
• Field of Search: 336/192, 336/229, 336/65, 336/96, 296/021, 296/05, 296/06
• US Class Current: 29/602.1
• CPC Class Codes: H01F 17/062 Toroidal core with turns of coil around it
• CPC Class Codes: H01F 27/027 specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H01F 41/005 Impregnating or encapsulating insulating of windings H01F41/12
• CPC Class Codes: H01F 41/10 Connecting leads to windings making electric connections in general H01R43/00
• CPC Class Codes: H05K 3/301 by means of a mounting structure H05K3/325 takes precedence
• CPC Class Codes: H05K 3/3421 Leaded components
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49073 by assembling coil and core

Abstract

An electronic surface mount package provides a one piece construction package (with an open bottom) with one or more terminal pins molded into the package. Each of the pins have a notched post upon which a wire is wound which is from a toroid transformer carried within the package. Each of the posts are notched so their respective wires are separate from one another so as to prevent arcing. The case is opened at the bottom which prevents harm from expansion or cracking.

Claims

1. A method of making an electronic surface mount package, the method comprising the steps for:

forming a package having a side wall with a bottom end;

encapsulating a plurality of toroid transformers within the package with a resilient material;

molding a plurality of terminal pins within the side wall, each of the pins extending through the side wall and having a solder post end, each of the post ends extending beyond the bottom end of the side wall; and

wrapping and soldering the wires from the transformers to the solder post ends for each of the pins.

2. The method of claim 1 wherein the resilient material is a soft silicone material.

3. A method of making an electronic surface mount package, the method comprising the steps for:

molding a one piece construction package having a side wall with a bottom end and a plurality of terminal pins within and extending from the bottom of the package;

encapsulating and carrying a plurality of toroid transformers within the package; and

wrapping and soldering the wires from the transformers to an end of a solder post for each of the pins.

4. The method of claim 3 wherein the step for encapsulating and carrying the plurality of toroid transformers pours a resilient material into the package and subsequently sets the resilient material.

5. The method of claim 3 wherein the resilient material is a soft silicone material.