Method for acoustic and vibrational energy for assisted drying of solder stencils and electronic modules

• US 6,662,812 B1
• Filed: 07/21/2000
• Issued: 12/16/2003
• Est. Priority Date: 07/24/1999
• Status: Expired due to Fees

• Current Assignee: Allen David Hertz, Dennis D. Epp, Eric Hertz
• Original Assignee: Allen David Hertz, Dennis D. Epp, Eric Hertz
• Inventors: Epp, Dennis D., Hertz, Eric L., Hertz, Allen David
• Primary Examiner(s): Stinson, Frankie L.
• Application Number:
  US09/621,249
• Time in Patent Office: 1,243 Days
• Field of Search: 134/1, 134/1.3, 134/32, 134/25.4, 342/79
• US Class Current: 134/1.3
• CPC Class Codes: B08B 7/028 Using ultrasounds
• CPC Class Codes: B41F 35/005 for flat screens
• CPC Class Codes: B41P 2235/14 using ultrasonic energy
• CPC Class Codes: F26B 5/02 by using ultrasonic vibrations using sonic energy generated by pulse jet combustion F26B23/026
• CPC Class Codes: F26B 5/12 by suction
• CPC Class Codes: H05K 3/1216 by screen printing or stencil printing
• CPC Class Codes: H05K 3/227 Drying of printed circuits
• CPC Class Codes: H05K 3/26 Cleaning or polishing of the conductive pattern

Abstract

A method and apparatus are disclosed for improving drying of a module, tooling, and solder stencils via the introduction of acoustic pressure waves and/or vibrational energy to the module, tooling, or solder stencils. The acoustic pressure waves may be created by a transducer where the waves are transferred to the module through air or a vibrational interface medium. The acoustic pressure waves impinge on the water droplets to atomize the droplets on the surface of the module and in the cracks, crevices and hard to reach areas of connectors and other components, without undesirable heat. The acoustic energy may further be used to assist in cleaning solder stencils within an automated screen printer.

Claims

1. A method for cleaning at least one of electronic assembly, stencil, and tooling related to manufacture of electronic assemblies, the steps comprising:

applying a fluid to the at least one of electronic assembly, stencil, and tooling related to manufacture of electronic assemblies,

applying vibrational energy by at least one of mechanically coupling a vibrational energy source and the at least one of electronic assembly, stencil, and tooling related to manufacture of electronic assemblies and transferring the vibrational energy through the air directed towards the at least one of electronic assembly, stencil, and tooling related to manufacture of electronic assemblies to aid in at least one of cleaning and drying the at least one of electronic assemblies and tooling related to manufacture of electronic assemblies by atomizing moisture droplets resident to the at least one of electronic assemblies and tooling related to manufacture of electronic assemblies.

2. The method of claim 1, the method further comprising the step of:

applying vibrational energy to aid in both cleaning and drying of at least one of electronic assemblies and tooling related to manufacture of electronic assemblies.

3. The method of claim 2, the method further comprising transferring the relational proximity of the vibrational energy source and the at least one of electronic assembly, stencil, and tooling related to manufacture of electronic assemblies to one another.

4. The method of claim 1, the method further comprising transferring the relational proximity of the vibrational energy source and the at least one of electronic assembly, stencil, and tooling related to manufacture of electronic assemblies to one another.

5. The method of claim 1, the method further comprising:

transferring vibrational energy through air to the at least one of electronic assembly, stencil, and tooling related to manufacture of electronic assemblies to aid in the drying process.

6. A method for cleaning a solder stencil, the method comprising the steps:

applying a fluid for cleaning the solder stencil, and

applying vibrational energy by at least one of mechanically coupling a vibrational energy source and the solder stencil and transferring the vibrational energy through the air directed towards the solder stencil to aid in drying the solder stencil.

7. The method of claim 6, the method further comprising the step:

transferring the relational proximity of the vibrational energy source and the solder stencil to one another.

8. The method of claim 7, the method further comprising the step:

applying vibrational energy to the fluid to assist in a cleaning process.

9. The method of claim 6, the method further comprising the step:

applying vibrational energy to the fluid to assist in a cleaning process.

10. The method of claim 9, the method further comprising the steps commonly associated with automated solder screen printing, the commonly associated steps of solder screen printing comprising aligning electronic pads of a printed circuit board and apertures of the solder stencil, passing solder paste across apertures of a stencil, and separating the printed circuit board and the solder stencil.

11. The method of claim 6, the method further comprising the steps commonly associated with automated solder screen printing, the commonly associated steps of solder screen printing comprising aligning electronic pads of a printed circuit board and apertures of the solder stencil, passing solder paste across apertures of a stencil, and separating the printed circuit board and the solder stencil.

12. The method of claim 6, the method further comprising the step:

wiping the stencil with the wiping material.

13. The method of claim 12, method further comprising the step:

applying a vacuum force to aid in cleaning the stencil.

14. The method of claim 6, the method further comprising the step:

applying a vacuum force to aid in cleaning the stencil.

15. A method for cleaning and drying a stencil, the method comprising the steps:

aligning a printed circuit board to the stencil, the stencil comprising at least one aperture,

positioning the printed circuit board proximate the stencil;

passing a printable medium across the at least one aperture of the stencil to apply a pattern of printable medium onto the printed circuit board,

applying a fluid based cleaning process to at least one of the stencil and a wiping material; and

applying vibrational energy by at least one of through the air, via mechanical contact to the stencil, and to the wiping material, to aid in at least one of cleaning and drying the stencil.

16. The method of claim 15, the method further comprising the step:

applying the vibrational energy to aid in both cleaning and drying of the stencil.

17. The method of claim 15, the method further comprising the step:

wiping the stencil with the wiping material.

18. The method of claim 15, the method further comprising the step:

applying a vacuum force to aid in cleaning the stencil.

19. The method of claim 17, the method further comprising the step:

applying a vacuum force to aid in cleaning the stencil.