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Method for acoustic and vibrational energy for assisted drying of solder stencils and electronic modules

  • US 6,662,812 B1
  • Filed: 07/21/2000
  • Issued: 12/16/2003
  • Est. Priority Date: 07/24/1999
  • Status: Expired due to Fees
First Claim
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1. A method for cleaning at least one of electronic assembly, stencil, and tooling related to manufacture of electronic assemblies, the steps comprising:

  • applying a fluid to the at least one of electronic assembly, stencil, and tooling related to manufacture of electronic assemblies, applying vibrational energy by at least one of mechanically coupling a vibrational energy source and the at least one of electronic assembly, stencil, and tooling related to manufacture of electronic assemblies and transferring the vibrational energy through the air directed towards the at least one of electronic assembly, stencil, and tooling related to manufacture of electronic assemblies to aid in at least one of cleaning and drying the at least one of electronic assemblies and tooling related to manufacture of electronic assemblies by atomizing moisture droplets resident to the at least one of electronic assemblies and tooling related to manufacture of electronic assemblies.

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