Plasma CVD apparatus for large area CVD film

• US 6,663,715 B1
• Filed: 11/07/2000
• Issued: 12/16/2003
• Est. Priority Date: 11/10/1999
• Status: Expired due to Term

• Current Assignee: Anelva Corporation (Canon Inc.), NEC Corporation
• Original Assignee: Anelva Corporation (Canon Inc.), NEC Corporation
• Inventors: Yuda, Katsuhisa, Ikemoto, Manabu
• Primary Examiner(s): Hassanzadeh, Parviz
• Application Number:
  US09/706,818
• Time in Patent Office: 1,134 Days
• Field of Search: 118/723.E, 118/723.ER, 118/723.I, 118/723.IR, 118/723.MW, 156/345.34, 156/345.33, 156/345.47, 156/345.75
• US Class Current: 118/723.00R
• CPC Class Codes: C23C 16/45519 Inert gas curtains
• CPC Class Codes: C23C 16/45565 Shower nozzles
• CPC Class Codes: C23C 16/5096 Flat-bed apparatus
• CPC Class Codes: H01J 37/3244 Gas supply means

Abstract

A plasma CVD apparatus includes first and second electrodes, neutral gas introduction pipes, and a plasma confining electrode interposed between the first and second electrodes separating a plasma generation region and a substrate processing region. The plasma confining electrode has a hollow structure defined by an upper electrode plate, and a lower electrode plate and is connected to the neutral gas introduction pipes. A plurality of neutral gas passage holes are provided for the lower electrode plate and the gas diffusing plates to supply neutral gas into the substrate processing region. A total opening area of the plurality of neutral gas passage holes in the gas diffusing plate on a side of the upper electrode plate is smaller than that of the plurality of neutral gas passage holes in the gas diffusing plate on a side of the lower electrode plate.

Claims

1. A plasma CVD apparatus comprising a plasma confining electrode for plasma separation provided between a plasma generation region and a substrate processing region to have a plurality of radical passage holes,

wherein said plasma confining electrode is a hollow structure,

neutral gas passage holes are provided for said plasma confining electrode on a side of said substrate processing region,

a plurality of gas diffusion plates having neutral gas passage holes are provided in said plasma confining electrode,

gas introduction pipes, which extend from a lateral direction of said plasma confining electrode to be coupled to side portions of said plasma confining electrode and are provided to supply gas such that a concentration distribution of a neutral gas between an upper plate of said plasma confining electrode and said gas diffusion plate on a side of said plasma generation region is higher in an outer region and lower in a center region,

a total opening area of said neutral gas passage holes of said plurality of gas diffusion plates is higher on a side of said substrate processing region than that of said neutral gas passage holes on the side of said plasma generation region, and

a distribution of the total opening area of said neutral gas passage holes for each of said plurality of gas diffusion plates is lower in said outer region and higher in said center region.

2. The plasma CVD apparatus according to claim 1, wherein the number of said neutral gas passage holes of said plurality of gas diffusing plates on the side of said substrate processing region is more than the number of said neutral gas passage holes in said gas diffusing plate on the side of said plasma generating region.

3. The plasma CVD apparatus according to claim 1, wherein first ones of said plurality of neutral gas passage holes in each of said gas diffusing plates are different in diameter from second ones of said plurality of neutral gas passage holes in each of said gas diffusing plates.

4. The plasma CVD apparatus according to claim 1, wherein positions of said neutral gas passage holes of said plurality of gas diffusing plates nearer to said substrate processing region are different from positions of said neutral gas passage holes of said plurality of gas diffusing plates nearer to said plasma generating region.

5. The plasma CVD apparatus according to claim 4, wherein a region of said neutral gas passage holes of said gas diffusing plates nearer to said substrate processing region is arranged in an outside region of a region of said neutral gas passage holes in said gas diffusing plate nearer to said plasma generating region.

6. A plasma CVD apparatus comprising a plasma confining electrode for plasma separation provided between a plasma generation region and a substrate processing region to have a plurality of radical passage holes,

wherein said plasma confining electrode is a hollow structure,

neutral gas passage holes are provided for said plasma confining electrode on a side of said substrate processing region,

a plurality of gas diffusion plates having neutral gas passage holes are provided in said plasma confining electrode,

a gas introduction pipe, which extends from a lateral direction of said plasma confining electrode to be coupled to upper portions of said plasma confining electrode, and is provided to supply gas such that a concentration distribution of a neutral gas between an upper plate of said plasma confining electrode and a first one of said plurality of gas diffusion plates is higher in an outer region and lower in a center region,

a total opening area of said neutral gas passage holes of said plurality of gas diffusion plates is higher on a side of said substrate processing region than that of said neutral gas passage holes on the side of said plasma generation region, and

a distribution of the total opening area of said neutral gas passage holes for each of said plurality of gas diffusion plates is lower in said outer region and higher in said center region.

7. The plasma CVD apparatus according to claim 6, wherein the number of said neutral gas passage holes of said plurality of gas diffusing plates on the side of said substrate processing region is more than the number of said neutral gas passage holes of said plurality of gas diffusing plates on the side of said plasma generating region.

8. The plasma CVD apparatus according to claim 6, wherein first ones of said plurality of neutral gas passage holes in each of said gas diffusing plates are different in diameter from second ones of said plurality of neutral gas passage holes in each of said gas diffusing plates.

9. The plasma CVD apparatus according to claim 6, wherein positions of said neutral gas passage holes of said plurality of gas diffusing plates nearer to said substrate processing region are different from positions of said neutral gas passage holes of said plurality of gas diffusing plates nearer to said plasma generating region.

10. The plasma CVD apparatus according to claim 9, wherein a region of said neutral gas passage holes of said plurality of gas diffusing plates nearer to said substrate processing region is arranged in an outside region of a region of said neutral gas passage holes of said plurality of gas diffusing plates nearer to said plasma generating region.