×

Electroless copper deposition method for preparing copper seed layers

  • US 6,664,122 B1
  • Filed: 11/27/2001
  • Issued: 12/16/2003
  • Est. Priority Date: 10/19/2001
  • Status: Active Grant
First Claim
Patent Images

1. A method of forming a copper seed layer on a substrate surface, the method comprising:

  • providing a substrate having dielectric layer on its surface and recesses in said dielectric layer, the substrate further comprising a partially complete copper seed layer formed in at least some recesses of the substrate surface;

    contacting the substrate surface with an electroless plating bath comprising a reducing agent and a source of copper ions, to deposit additional copper on the substrate surface; and

    monitoring the plating rate via a potential between the substrate and a reference electrode.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×