METHOD OF MOUNTING A SEMICONDUCTOR CHIP, CIRCUIT BOARD FOR FLIP-CHIP CONNECTION AND METHOD OF MANUFACTURING THE SAME, ELECTROMAGNETIC WAVE READABLE DATA CARRIER AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC COMPONENT MODULE FOR AN ELECTROMAGNETIC WAVE READABLE DATA CARRIER

• US 6,664,645 B2
• Filed: 04/16/2002
• Issued: 12/16/2003
• Est. Priority Date: 11/24/1999
• Status: Expired due to Term

• Current Assignee: Omron Corporation
• Original Assignee: Omron Corporation
• Inventors: Kawai, Wakahiro
• Primary Examiner(s): Nelms, David
• Assistant Examiner(s): Le, Thao P
• Application Number:
  US10/122,317
• Publication Number:
  US 20020115278A1
• Time in Patent Office: 609 Days
• Field of Search: 257/777, 257/778, 257/793, 257/783
• US Class Current: 257/778
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01327 : Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H05K 1/09 : Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 2201/0129 : Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/10674 : Flip chip
• CPC Class Codes: H05K 2201/10977 : Encapsulated connections applying non-metallic protective coatings for encapsulating mounted components H05K3/284
• CPC Class Codes: H05K 2203/0285 : Using ultrasound, e.g. for cleaning, soldering or wet treatment
• CPC Class Codes: H05K 2203/1189 : Pressing leads, bumps or a die through an insulating layer
• CPC Class Codes: H05K 3/061 : Etching masks
• CPC Class Codes: H05K 3/328 : by welding

Abstract

To provide a semiconductor chip mounting method by a flip-chip connection method in which a semiconductor chip can be mounted on a circuit board promptly, electrically and mechanically surely and further at a low cost, a process for pushing a melted thermoplastic resin coat aside by pressing a bump of the bare semiconductor chip on the melted thermoplastic resin coat applying an ultrasonic wave in a state in which the thermoplastic resin coat covering an electrode area on a wiring pattern is heated and melted and touching the bump and the electrode area, a process for bonding the bump and the electrode area by continuously applying an ultrasonic wave in a state in which the bump and the electrode area are touched and a process for cooling and solidifying the melted thermoplastic resin coat and bonding the body of the bare semiconductor chip on the circuit board are provided.

Claims

1. An electromagnetic wave readable data carrier comprising:

an electronic component module including a circuit board and a semiconductor chip mounted on the circuit board, said circuit board having a wiring pattern with an electrode area and a thermoplastic resin coat covering the electrode area of the wiring pattern, said semiconductor chip having a bump at a side of the circuit board thereof, the bump of the semiconductor chip penetrating the thermoplastic resin coat and being ultrasonically bonded with the electrode area of the wiring pattern.

2. The electromagnetic wave readable data carrier according to claim 1, further comprising:

a body of a data carrier including an insulating base material and a conductive pattern held on the insulating base material.

3. The electromagnetic wave readable data carrier according to claim 2, wherein the conductive pattern is curled.

4. The electromagnetic wave readable data carrier according to claim 1, wherein the electromagnetic wave readable data carrier uses an electromagnetic filed as a read medium.

5. The electromagnetic wave readable data carrier according to claim 1, wherein the electronic component module is manufactured by a method comprising:

heating and melting the thermoplastic resin coat of the circuit board;

pressing the bump of the semiconductor chip on the thus melted thermoplastic resin coat while applying an ultrasonic wave to the bump so that the bump penetrates the incited thermoplastic resin coat and contacts the electrode area;

bonding the bump and the electrode area by continuously applying the ultrasonic wave to the bump while the bump is in contact with the electrode area;

cooling and solidifying the melted thermoplastic resin coat so as to securely mount the semiconductor chip to the circuit board.

6. The electromagnetic wave readable data carrier according to claim 1, wherein the semiconductor chip is mounted at a corner of the circuit board.