Single chip device for voice communications

• US 6,664,713 B2
• Filed: 12/04/2001
• Issued: 12/16/2003
• Est. Priority Date: 12/04/2001
• Status: Expired due to Fees

• Current Assignee: Martha Trout
• Original Assignee: Peter V Boesen
• Inventors: Boesen, Peter V.
• Primary Examiner(s): Dougherty, Thomas M.
• Application Number:
  US10/004,572
• Publication Number:
  US 20030103638A1
• Time in Patent Office: 742 Days
• Field of Search: 310/328, 310/329, 381/312, 181/130, 181/135
• US Class Current: 310/328
• CPC Class Codes: H04R 1/083 Special constructions of mouthpieces
• CPC Class Codes: H04R 2460/13 Hearing devices using bone conduction transducers
• CPC Class Codes: H10N 39/00 Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00

Abstract

The present invention is a chip for use in a voice communication device. The chip provides for both bone conduction sensing and air conduction sensing. The chip includes a bone conduction sensing pattern disposed within the chip and a microphone sensing pattern disposed within the chip. In addition, the chip can optionally include an integrated circuit portion interconnected to the bone conduction sensing pattern and the microphone sensing pattern. The pattern can be of a piezoelectric polymer, the patterns overlaying the substrate. Preferably, the bone conduction sensing pattern and the microphone sensing pattern are placed on opposite ends of the chip.

Claims

1. A chip for use in a voice communication device comprising:

a bone conduction sensing pattern disposed within the chip; and

a microphone sensing pattern disposed within the chip.

2. The chip of claim 1 further comprising an integrated circuit portion interconnected to the bone conduction sensing pattern and the microphone sensing pattern.

3. The chip of claim 1 wherein the bone conduction sensing pattern is positioned on a first end of the chip, the first end opposite a second end of the chip, the microphone sensing pattern positioned on the second end of the chip.

4. A chip for use in a voice communication device comprising:

a substrate;

a piezoelectric polymer overlaying the substrate;

the piezoelectric polymer having a first pattern and a second pattern, the first pattern being an accelerometer sensor pattern and the second pattern being a microphone sensor pattern.

5. The chip of claim 4 further comprising an electronic sensor portion overlaying the substrate.

6. The chip of claim 5 wherein the electronic sensor portion includes a signal conditioning circuit.

7. The chip of claim 4 wherein the piezoelectric polymer is divided into a first portion and a second portion at opposite ends of the chip, the accelerometer sensor pattern defined within the first portion and the microphone sensor pattern defined within the second portion.

8. A voice communication device comprising:

a chip having a microphone sensor and an accelerometer.