Package with environmental control material carrier

• US 6,664,779 B2
• Filed: 11/05/2001
• Issued: 12/16/2003
• Est. Priority Date: 11/16/2000
• Status: Active Grant

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Lopes, Vincent C., Liu, Jwei Wien
• Primary Examiner(s): Cuneo, Kamand
• Assistant Examiner(s): NGUYEN, TRUNG Q
• Application Number:
  US09/992,178
• Publication Number:
  US 20020056898A1
• Time in Patent Office: 771 Days
• Field of Search: 257/682, 257/721, 134/1, 134/1.3, 134/19, 134/26, 134/30, 427/299, 438/694, 438/770, 438/771, 438/586, 438/706, 438/711, 438/768, 438/638, 430/329
• US Class Current: 257/682
• CPC Class Codes: B81B 3/0005 Anti-stiction coatings
• CPC Class Codes: B81B 7/0038 using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
• CPC Class Codes: H01L 23/26 including materials for absorbing or reacting with moisture or other undesired substances , e.g. getters
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A drop-in environmental control material carrier assembly 55, which improves the performance and lowers the cost of semiconductor packages. The environmental control materials are positioned inside the package cavity by means of a drop-in environmental control material carrier assembly 54, which can hold up to eight materials. Three types of environmental control materials are typically used in micromirror packages: (1) one for absorbing moisture inside the package, (2) one for absorbing adhesive outgassing constituents inside the package, and (3) one for storing the PFDA lubricant used to prevent the micromirror mirrors from sticking. The performance and lifetime of the micromirror devices are improved and the cost of projection display systems, in which these micromirrors are central components, is lowered.

Claims

1. A semiconductor package, comprising:

a substrate;

a semiconductor device supported by said substrate;

a environmental control materials carrier assembly supported by said substrate; and

a top cover supported by said substrate to enclose said semiconductor device and said environmental control materials carrier assembly.

2. The semiconductor package of claim 1, said environmental control material carrier assembly secured to said substrate by means of an adhesive.

3. The semiconductor package of claim 1, said environmental control material carrier assembly fabricated in a lead-frame with break away tabs attaching each said carrier assembly to said lead-frame.

4. The semiconductor package of claim 1, said semiconductor device comprising a spatial light modulator.

5. The semiconductor package of claim 4, said spatial light modulator comprising a micromirror.

6. The semiconductor package of claim 1, further comprising an aperture having a peripheral opaque light shield area and a center perture area.

7. The semiconductor package of claim 6, wherein said aperture is separate from said cover glass.

8. The semiconductor package of claim 6, said aperture located to prevent light from reaching surfaces around a perimeter of semiconductor device.

9. The semiconductor package of claim 1 wherein said cover is glass with an anti-reflective coating.

10. A semiconductor package comprising:

a substrate

a semiconductor device supported by said substrate;

a environmental control materials carrier assembly supported by said substrate, said environmental control materials carrier assembly comprising;

a frame having at least two slots; and

environmental control material mounted in at least one of said slots; and

a top cover supported by said substrate to enclose said semiconductor device and said environmental control materials carrier assembly.

11. The semiconductor package of claim 10, said environmental control material carrier assembly frame having inside structural walls with openings to provide paths for gases and/or liquids inside said package to flow between said semiconductor device and said getter material.

12. The semiconductor package of claim 10, said slots having mesh structures for holding said environmental control material.

13. The semiconductor package of claim 10, said environmental control material comprising moisture-collecting desiccants.

14. The semiconductor package of claim 10, said environmental control material comprising adhesive outgassing desiccants.

15. The semiconductor package of claim 10, said environmental control material comprising lubricant storage reservoirs.

16. The semiconductor package of claim 10, said environmental control material comprised of at least two materials selected from a group consisting of:

moisture collecting desiccants, adhesive outgassing absorbing desiccants, and lubricant storage reservoirs.

17. The semiconductor package of claim 10, said environmental control material comprised of at least one material selected from a group consisting of:

moisture collecting desiccants, adhesive outgassing absorbing desiccants, and lubricant storage reservoirs.

18. A semiconductor package, comprising:

a substrate;

a semiconductor device supported by said substrate;

a environmental control materials carrier assembly supported by said substrate;

environmental control material supported by said environmental control materials carrier assembly; and

a top cover supported by said substrate to enclose said semiconductor device and said environmental control materials carrier assembly.