Two stage method

• US 6,665,054 B2
• Filed: 10/22/2001
• Issued: 12/16/2003
• Est. Priority Date: 10/22/2001
• Status: Expired due to Fees

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Inoue, Fuyuhiko
• Primary Examiner(s): FULLER, RODNEY EVAN
• Application Number:
  US10/036,976
• Publication Number:
  US 20030076482A1
• Time in Patent Office: 785 Days
• Field of Search: 355/46, 355/53, 355/72, 355/77
• US Class Current: 355/77
• CPC Class Codes: G03B 27/42 for automatic sequential copying of the same original G03B27/34, G03B27/53 take precedence
• CPC Class Codes: G03F 7/70716 Stages
• CPC Class Codes: G03F 7/70733 Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask

Abstract

The method for positioning two stages during semiconductor wafer processing facilitates the use of two stages to improve system throughput by decreasing the rest-time of certain system components. While a typical single-stage apparatus requires that each step in the process be performed serially, this invention allows an amount of parallel processing with each stage at different steps of the process, and thus improves system throughput.

Claims

1. A method of employing a lithography apparatus and a stage assembly with a first and a second stage in a lithography process, the method comprising:

exposing a pattern on a first substrate disposed on a first stage in said lithography apparatus;

loading a second substrate for processing on a second stage and aligning said loaded substrate on said second stage, said loading and aligning together comprising at least part of a preparing step of said method;

resetting said apparatus at least once;

removing said first substrate from said first stage;

positioning said first stage for a subsequent preparing step;

positioning said second stage for a subsequent exposing step;

determining the locations of said first and said second stages employing a plurality of interferometers and a plurality of encoders, wherein said interferometers are employed to determine the positions of said first and said second stages during said exposing step, during said preparing step, and during said resetting step and wherein both said interferometers and said encoders are employed during said positioning steps; and

wherein said preparing step, said at least one resetting step, and said positioning steps occur at least partly simultaneously with said exposing step.

2. The method of claim 1, wherein both said aligning step and said exposing step are preceded by one said resetting step.

3. The method of claim 1, wherein said assembly comprises an electron beam exposure apparatus.

4. The method of claim 1, wherein said exposure assembly comprises an x-ray exposure apparatus.

5. The method of claim 1, wherein said assembly comprises a photolithography apparatus.

6. The method of claim 1, wherein said process further comprises a step-and-repeat method.

7. The method of claim 1, wherein said process further comprises a step-and-scan method.

8. A method of employing a lithography apparatus and a stage assembly with a first and a second stage in a lithography process, the method comprising:

continuously monitoring the positions of a first stage and a second stage during the processing of substrates, said processing comprising a plurality of steps wherein a first group of said steps is directed at changing said positions of said stages and a second group of said steps is directed at effectuating changes to said substrates;

employing a plurality of interferometers and a plurality of encoders for said monitoring during said first group of steps;

employing said interferometers for said monitoring during said second group of steps; and

moving said first and said second stages so that when one said stage is undergoing one step from one said group said other stage is undergoing at least part of one or more of the remaining steps from said first or said second groups.

9. The method of claim 8, wherein said second group of steps comprises:

exposing said substrates;

reseting said apparatus;

aligning said substrates;

unloading said stage; and

loading said stages.

10. The method of claim 9, said method further comprising exposing said first substrate while positioning said second stage, while loading or unloading said second stage;

while reseting said second stage, and while aligning said second substrate.

11. The method of claim 10, said method further comprising exposing said second substrate while positioning said first stage, while loading or unloading said first substrate, while reseting said first stage, and while aligning said first stage.

12. The method of claim 11, said method further comprising reseting said first stage while positioning said second stage and positioning said first stage while reseting said second stage.

13. The method of claim 8, wherein said lithography apparatus comprises an electron beam exposure apparatus.

14. The method of claim 8, wherein said lithography apparatus comprises an x-ray exposure apparatus.

15. The method of claim 8, wherein said process further comprises a step-and-repeat method.

16. The method of claim 8, wherein said process further comprises a step-and-scan method.