Power supply apparatus

• US 6,665,183 B1
• Filed: 02/19/2003
• Issued: 12/16/2003
• Est. Priority Date: 02/19/2002
• Status: Active Grant

• Current Assignee: Sansha Electric Manufacturing Company Limited
• Original Assignee: Sansha Electric Manufacturing Company Limited
• Inventors: Katooka, Masao, Ishii, Hideo, Kawashima, Yoshimasa, Shikata, Kunio
• Primary Examiner(s): TOLIN, GERALD P
• Application Number:
  US10/368,993
• Time in Patent Office: 300 Days
• Field of Search: 165/80.2, 165/80.3, 165/185, 165/121-126, 174/16.3, 363/141, 363/144, 257/706, 257/707, 257/713, 257/721, 257/722-724, 361/695, 361/697, 361/703-705, 361/707-712, 361/715-719, 454/184
• US Class Current: 361/697
• CPC Class Codes: H05K 7/20918 the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels

Abstract

A power supply apparatus has chassis (42, 44) mounted on opposing surfaces of a heat sink (40). Printed circuit boards (46, 48) are disposed outward of the chassis (42, 44) and detachably secured to the chassis (42, 44). Semiconductor modules (4, 16a, 16b, 32) are mounted on the respective surfaces of the heat sink (40) facing toward the printed circuit boards (46, 48) and extend through the chassis (42, 44). The semiconductor modules (4, 16a, 16b, 32) are electrically connected to the printed circuit boards (46, 48) to form a power supply circuit.

Claims

1. A power supply apparatus comprising:

first and second spaced apart chassis;

a heat sink disposed between said first and second chassis, said first and second chassis being mounted to said heat sink;

a printed circuit board detachably mounted to a surface of at least one of said first and second chassis opposite to a surface of said at least one chassis facing said heat sink; and

at least one semiconductor module, said at least one, semiconductor module being mounted on the surface of said heat sink facing toward said printed circuit board and electrically connected to said printed circuit board to form a power supply circuit.

2. The power supply apparatus according to claim 1 wherein said semiconductor module protrudes through a window formed in said at least one chassis toward said printed circuit board.

3. The power supply apparatus according to claim 2 wherein said semiconductor module is connected to said printed circuit board with a detachable connector.

4. The power supply apparatus according to claim 1 wherein said heat sink is formed of two split members which are mated with each other to form said heat sink, each of said split members having a plurality of fins on their mating sides.

5. The power supply apparatus according to claim 1 wherein a blower is disposed between corresponding one ends of said first and second chassis.

6. The power supply apparatus according to claim 1 wherein said power supply circuit includes a transformer, said transformer being disposed beneath said heat sink and having parts thereof extending through said first and second chassis.

7. The power supply apparatus according to claim 6 wherein said transformer is small in thickness.

8. The power supply apparatus according to claim 1 wherein:

first and second printed circuit boards are detachably mounted to said first and second chassis, respectively, said first printed circuit board including an input side circuit of said power supply circuit, said second printed circuit board including an output side circuit of said power supply circuit; and

a first semiconductor module relating to said input side circuit of said power supply circuit and a second semiconductor module relating to said output side circuit of said power supply circuit are provided, said first semiconductor module being mounted on a surface of said heat sink facing said first chassis and extending through said first chassis to protrude toward said first printed circuit board, said second semiconductor module being mounted on a surface of said heat sink facing said second chassis and extending through said second chassis to protrude toward said second printed circuit board.

9. The power supply apparatus according to claim 8 wherein said power supply circuit includes a transformer, said transformer having a small thickness and being disposed beneath said heat sink, an input side of said transformer being connected to said first printed circuit board, an output side of said transformer being connected to said second printed circuit board.