High temperature probe card
First Claim
Patent Images
1. A probe card for testing a semiconductor device-under-test comprising:
- a plurality of printed circuit boards stacked together to form a probe interface board having a top surface and lower testing face;
a heat sink mounted on the probe interface board at the top surface and extending to the lower testing face; and
a needle supporting module carried by the heat sink at the lower testing face and having a plurality of probe needles for electrically connecting to electrical contacts of a semiconductor device-under-test.
1 Assignment
0 Petitions
Accused Products
Abstract
The probe card of the present invention permits testing of a semiconductor device-under-test under high temperatures and includes a plurality of printed circuit boards stacked together to form a probe interface board having a top surface and a lower testing face. A heat sink is mounted on the probe interface board at the top surface and extends to the lower testing face. A needle supporting module is carried by the heat sink at the lower testing face and has a plurality of probe needles for electrically connecting to electrical contacts of a semiconductor device-under-test.
28 Citations
32 Claims
-
1. A probe card for testing a semiconductor device-under-test comprising:
-
a plurality of printed circuit boards stacked together to form a probe interface board having a top surface and lower testing face;
a heat sink mounted on the probe interface board at the top surface and extending to the lower testing face; and
a needle supporting module carried by the heat sink at the lower testing face and having a plurality of probe needles for electrically connecting to electrical contacts of a semiconductor device-under-test. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A probe card for testing a semiconductor device-under-test comprising:
-
a plurality of printed circuit boards stacked together to form a probe interface board having a top surface and lower testing face;
a heat sink mounted on the probe interface board at the top surface and extending to the lower testing face;
at least one copper layer positioned within said probe interface board and interconnecting said heat sink to accumulate heat within said probe interface board and transfer heat to said heat sink and provide internal support to said probe interface board; and
a needle supporting module carried by the heat sink at the lower testing face and having a plurality of probe needles for electrically connecting to electrical contacts of a semiconductor device-under-test. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
-
-
22. A probe card for testing a semiconductor device-under-test comprising:
-
a plurality of printed circuit boards stacked together to form a probe interface board having a top surface, a central opening forming an edge, and a lower testing face;
a heat sink mounted on the probe interface board at the top surface and extending along said edge defined by said central opening to the lower testing face;
at least one copper layer positioned within said probe interface board and interconnecting said heat sink to accumulate heat within said probe interface board and transfer heat to said heat sink and provide internal support to said probe interface board; and
a needle supporting module carried by the heat sink at the lower testing face and having a plurality of probe needles for electrically connecting to electrical contacts of a semiconductor device-under-test. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
-
Specification