Monolithic in-plane shutter switch

• US 6,667,823 B2
• Filed: 05/22/2002
• Issued: 12/23/2003
• Est. Priority Date: 05/22/2002
• Status: Expired due to Fees

• Current Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Greywall, Dennis S.
• Primary Examiner(s): Dang, Hung Xuan
• Assistant Examiner(s): TRA, TUYEN Q
• Application Number:
  US10/153,294
• Publication Number:
  US 20030218789A1
• Time in Patent Office: 580 Days
• Field of Search: 359/295, 359/290, 359/230, 359/223, 359/224, 359/214, 359/212, 359/198, 310/309.12, 385/18
• US Class Current: 359/224.1
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means

Abstract

A shutter switch that may be fabricated using a single wafer, which alleviates the alignment problem associated with a two-piece prior art design. The switch has a movable mirror that is designed for in-plane motion. The mirror is connected to a drive shaft that can be moved, e.g., using one or more serpentine springs and a comb drive actuator. During operation, the mirror is in either one of two terminal positions. The mirror moves between the terminal positions in response to a voltage applied to the actuator. The springs and actuator are designed such that small voltage variations around the voltage values corresponding to the terminal positions do not substantially displace the mirror from those positions. As a result, any electrostatic charge accumulation will not result in significant drifting of the mirror. Multiple shutter switches may be arrayed in a single integrated structure.

Claims

1. A shutter switch, comprising:

(A) a stationary part, comprising;

(1) a substrate; and

(2) an immobile portion of an actuator rigidly connected to the substrate;

(B) a movable part supported on the substrate and comprising;

(1) a plate;

(2) a shaft rigidly connected to the plate; and

(3) a mobile portion of the actuator rigidly connected to the shaft; and

(C) one or more springs, each connected between the stationary part and the movable part, wherein;

the actuator is configured to move the movable part relative to the stationary part in response to an electrical signal such that motion of the movable part generates plate motion parallel to the plane of the substrate; and

the mobile and immobile portions of the actuator, the plate, and the shaft are formed in a single layer of a wafer.

2. The invention of claim 1, wherein the switch is formed in the wafer, the wafer comprising at least three layers, wherein:

a first layer comprises the substrate;

a second layer is formed over the first layer; and

a third layer is formed over the second layer, wherein;

the second layer electrically insulates the first layer from the third layer; and

the mobile and immobile portions of the actuator, the plate, and the shaft are formed in the third layer.

3. The invention of claim 2, wherein the first and third layers comprise semiconductor material and the second layer comprises an oxidized semiconductor material.

4. The invention of claim 2, wherein the shaft comprises a plurality of wells patterned to detach the shaft from the second layer using etching.

5. The invention of claim 1, wherein the portions of the actuator are electrically isolated from each other.

6. The invention of claim 5, wherein the mobile portion moves toward the immobile portion in response to a voltage applied between said portions.

7. The invention of claim 5, wherein the portions are comb-shaped.

8. The invention of claim 1, wherein:

the wafer comprises a cavity beneath the plate, when the plate rests in a terminal position;

the plate has two reflective surfaces; and

the shutter switch is configured as an add/drop element.

9. The invention of claim 1, wherein the plate is covered by a layer of light absorbing material and the shutter switch is configured as a blocker.

10. The invention of claim 1, wherein the shutter switch further comprises:

a second substrate attached to the stationary part; and

a tilted reflector attached to the second substrate and positioned beneath the plate when the plate rests in a terminal position, wherein the plate has a reflective surface and the shutter switch is configured as a 1×

2 switch.

11. The invention of claim 1, wherein the shutter switch is implemented in an integrated device having two or more shutter switches.

12. The invention of claim 1, wherein the stationary part comprises a cavity to accommodate spring expansion during the plate translation.

13. The invention of claim 1, wherein the one or more springs comprise four serpentine springs, wherein two serpentine springs are attached between the stationary part and an end of the shaft and two serpentine springs are attached between the stationary part and a middle section of the shaft.

14. A method of fabricating a movable structure supported on a substrate in an integrated device, comprising the steps of:

(a) forming on a first layer, which is a substrate of a wafer, second and third layers, wherein said third layer is on top of said second layer, which is on top of said first layer;

(b) performing a first etch to form one or more openings in the third layer to expose portions of the second layer; and

(c) performing a second etch to remove material from the second layer to detach the movable structure from the first and second layers, wherein;

the movable structure is formed in the third layer and configured to move parallel to the plane of the wafer; and

the step of performing the first etch comprises the step of forming a pattern of openings in a portion of the third layer corresponding to the movable structure, which pattern facilitates the detachment of the movable structure from underlying portions of the second and first layers during the second etch.

15. The method of claim 14, wherein:

the wafer is a silicon-on-insulator (SOI) wafer;

the first and third layers comprise silicon; and

the second layer comprises a silicon oxide.

16. The method of claim 14, further comprising the step of forming a plurality of separate movable structures supported on the substrate.

17. The method of claim 14, wherein the step of performing the second etch comprises the step of laterally removing material from the second layer using the pattern of openings to undercut the portion of the third layer corresponding to the movable structure.

18. A shutter switch, comprising:

(A) a substrate;

(B) means for supporting a plate by the substrate; and

(C) means for moving the plate parallel to the plane of the substrate in response to an electrical signal applied to said means for moving, wherein;

the means for supporting comprises;

(1) a shaft rigidly connected to the plate; and

(2) one or more springs, each configured between the shaft and the substrate;

the means for moving comprises an actuator, which comprises;

(1) an immobile portion rigidly connected to the substrate; and

(2) a mobile portion rigidly connected to the means for supporting, wherein the mobile portion moves toward the immobile portion in response to a voltage applied between said portions to generate plate motion; and

the mobile and immobile portions of the actuator, the plate, and the shaft are formed in a single layer of a wafer.

19. A shutter switch, comprising:

(A) a stationary part, comprising;

(1) a substrate; and

(2) an immobile portion of an actuator rigidly connected to the substrate;

(B) a movable part supported on the substrate and comprising;

(1) a plate;

(2) a shaft rigidly connected to the plate; and

(3) a mobile portion of the actuator rigidly connected to the shaft; and

(C) one or more springs, each connected between the stationary part and the movable part, wherein;

the actuator is configured to move the movable part relative to the stationary part in response to an electrical signal such that motion of the movable part generates plate motion parallel to the plane of the substrate;

the switch is formed in a wafer, the wafer comprising at least three layers, wherein;

a first layer comprises the substrate;

a second layer is formed over the first layer; and

a third layer is formed over the second layer, wherein;

the second layer electrically insulates the first layer from the third layer; and

the mobile and immobile portions of the actuator, the plate, and the shaft are

formed in the third layer; and

the shaft comprises a plurality of wells patterned to detach the shaft from the second layer using etching.

20. A shutter switch, comprising:

(A) a stationary part, comprising;

(1) a substrate; and

(2) an immobile portion of an actuator rigidly connected to the substrate;

(B) a movable part supported on the substrate and comprising;

(1) a plate;

(2) a shaft rigidly connected to the plate; and

(3) a mobile portion of the actuator rigidly connected to the shaft;

(C) one or more springs, each connected between the stationary part and the movable part, wherein;

the actuator is configured to move the movable part relative to the stationary part in response to an electrical signal such that motion of the movable part generates plate motion parallel to the plane of the substrate;

(D) a second substrate attached to the stationary part; and

(E) a tilted reflector attached to the second substrate and positioned beneath the plate when the plate rests in a terminal position, wherein the plate has a reflective surface and the shutter switch is configured as a 1×

2 switch.

21. A shutter switch, comprising:

(A) a stationary part, comprising;

(1) a substrate; and

(2) an immobile portion of an actuator rigidly connected to the substrate;

(B) a movable part supported on the substrate and comprising;

(1) a plate;

(2) a shaft rigidly connected to the plate; and

(3) a mobile portion of the actuator rigidly connected to the shaft; and

(C) one or more springs, each connected between the stationary part and the movable part, wherein;

the actuator is configured to move the movable part relative to the stationary part in response to an electrical signal such that motion of the movable part generates plate motion parallel to the plane of the substrate; and

the one or more springs comprise four serpentine springs, wherein two serpentine springs are attached between the stationary part and an end of the shaft and two serpentine springs are attached between the stationary part and a middle section of the shaft.