Printhead chip having a plurality of nozzle arrangements that each incorporate a motion transmitting structure

• US 6,669,332 B2
• Filed: 11/23/2002
• Issued: 12/30/2003
• Est. Priority Date: 07/15/1997
• Status: Expired due to Fees

• Current Assignee: Memjet Technology Ltd. (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia
• Primary Examiner(s): Gordon, Raquel Yvette
• Application Number:
  US10/302,275
• Publication Number:
  US 20030090543A1
• Time in Patent Office: 402 Days
• Field of Search: 347/54, 347/68, 347/69, 347/70, 347/71, 347/72, 347/50, 347/40, 347/20, 347/44, 347/47, 347/27, 347/63, 399/261, 361/700, 310/328-330, 298/901
• US Class Current: 347/54
• CPC Class Codes: B41J 2/14427 Structure of ink jet print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/1601 Production of bubble jet print heads B41J2/1606, B41J2/162 take precedence
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1626 etching
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1635 dividing the wafer into individual chips
• CPC Class Codes: B41J 2/1637 molding
• CPC Class Codes: B41J 2/1639 sacrificial molding
• CPC Class Codes: B41J 2/1642 thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1643 thin film formation by plating
• CPC Class Codes: B41J 2/1645 thin film formation by spincoating
• CPC Class Codes: B41J 2/1646 thin film formation by sputtering
• CPC Class Codes: B41J 2/1648 Production of print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/16585 for paper-width or non-reciprocating print heads
• CPC Class Codes: B41J 2/17513 Inner structure
• CPC Class Codes: B41J 2/17596 Ink pumps, ink valves
• CPC Class Codes: B41J 2002/041 Electromagnetic transducer
• CPC Class Codes: B41J 2202/21 : Line printing
• CPC Class Codes: H04N 23/00 : Cameras or camera modules comprising electronic image sensors; Control thereof
• CPC Class Codes: H04N 5/2628 : Alteration of picture size, shape, position or orientation, e.g. zooming, rotation, rolling, perspective, translation

Abstract

A printhead chip for an inkjet printhead includes a substrate. A plurality of nozzle arrangements is positioned on the substrate. Each nozzle arrangement includes a nozzle chamber structure that defines a nozzle chamber in which ink is received. An ink-ejecting member is operatively positioned with respect to the nozzle chamber so that displacement of the ink-ejecting member results in ejection of ink from the nozzle chamber. At least one actuator is positioned on the substrate. The, or each, actuator is displaceable with respect to the substrate on receipt of a driving signal. A motion transmitting structure is interposed between the actuator and the ink-ejecting member so that displacement of the actuator relative to the substrate is transmitted to the ink-ejecting member so that ink is ejected from the nozzle chamber.

Claims

1. A printhead chip for an inkjet printhead, the printhead chip comprising

a substrate;

and

a plurality of nozzle arrangements positioned on the substrate, each nozzle arrangement comprising

a nozzle chamber structure that defines a nozzle chamber in which ink is received;

an ink-ejecting member that is operatively positioned with respect to the nozzle chamber so that displacement of the ink ejecting member results in ejection of ink from the nozzle chamber;

at least one actuator that is positioned on the substrate, the, or each, actuator being displaceable with respect to the substrate on receipt of a driving signal; and

a motion transmitting structure interposed between the actuator and the ink-ejecting member so that displacement of the actuator relative to the substrate is transmitted to the ink-ejecting member so that ink is ejected from the nozzle chamber.

2. A printhead chip as claimed in claim 1, which is the product of an integrated circuit fabrication technique.

3. A printhead chip as claimed in claim 2, in which the substrate includes a silicon wafer substrate and a CMOS drive circuitry layer positioned on the wafer substrate.

4. A printhead chip as claimed in claim 3, in which the nozzle chamber structure includes nozzle chamber walls that extend from the substrate and a roof that spans the nozzle chamber walls, the roof defining an ink ejection port from which ink is ejected, in use.

5. A printhead chip as claimed in claim 4, in which the nozzle chamber walls and the roof are configured so that the nozzle chamber is substantially rectangular in plan, with the nozzle chamber walls defining a distal end wall, a proximal end wall and a pair of opposed side walls.

6. A printhead chip as claimed in claim 5, in which each nozzle arrangement includes a sealing structure that is positioned on the substrate and is interposed between the, or each, actuator and the ink ejecting member to inhibit a passage of ink between the ink-ejecting member and the actuator, the ink ejecting member being positioned in the nozzle chamber and the sealing structure and the motion transmitting structure defining at least part of the proximal end wall.

7. A printhead chip as claimed in claim 6, in which the motion transmitting structure of each nozzle arrangement includes an effort formation that is connected to the working portion of the actuator, a load formation that is connected to the ink-ejecting member and a lever arm formation that interconnects the effort formation and the load formation, the lever arm formation being pivotal with respect to the nozzle chamber structure so that reciprocal movement of the working portion of the actuator is accommodated by pivotal movement of the lever arm formation with the result that the ink-ejecting member is reciprocally displaced towards and away from the ink ejection port.

8. A printhead chip as claimed in claim 7, in which each nozzle arrangement includes a thermal bend actuator that includes an elongate actuator arm having a fixed end that is fixed with respect to the substrate and a working end, defined by the working portion, that is displaceable with respect to the substrate, the thermal bend actuator being configured so that, when the actuator receives a signal from the drive circuitry layer, the elongate actuator arm bends towards the substrate, the working end being fixed to the effort formation of the motion transmitting structure so that, upon such movement of the actuator arm towards the substrate, the lever arm formation pivots and the load formation acts on the ink ejection member to drive the ink ejection member towards the ink ejection port.

9. A printhead chip as claimed in claim 7, in which the lever arm formation is mounted on the nozzle chamber walls with a pair of opposed, resiliently flexible connectors.

10. An inkjet printhead that includes at least one printhead chip as claimed in claim 1.