Inline and “Y” input-output bus topology

• US 6,670,558 B2
• Filed: 08/22/2001
• Issued: 12/30/2003
• Est. Priority Date: 12/29/1999
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Dabral, Sanjay, Zeng, Ming, Schoenborn, Zale T., Sampath, Dillip
• Primary Examiner(s): Talbott, David L.
• Assistant Examiner(s): Norris, Jeremy
• Application Number:
  US09/935,421
• Publication Number:
  US 20020033276A1
• Time in Patent Office: 860 Days
• Field of Search: 428/74, 361/783, 361/777-779, 174/262, 174/260, 174/261
• US Class Current: 174/261
• CPC Class Codes: H05K 1/0224 Patterned shielding planes, ground planes or power planes H05K1/0253 takes precedence
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/0253 Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings H05K1/0251 takes precedence
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 2201/044 Details of backplane or midplane for mounting orthogonal PCBs
• CPC Class Codes: H05K 2201/09236 Parallel layout layout of balanced signal pairs H05K1/0245; superposed layout H05K2201/09672
• CPC Class Codes: H05K 2201/093 Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein reduction of cross-talk, noise or interference by patterned shielding planes, ground planes or power planes H05K1/0224
• CPC Class Codes: H05K 2201/09609 Via grid, i.e. two-dimensional array of vias or holes in a single plane interposers H05K2201/10378
• CPC Class Codes: H05K 2201/09681 Mesh conductors, e.g. as a ground plane
• CPC Class Codes: H05K 2203/1178 Means for venting or for letting gases escape

Abstract

Various bus trace topologies are provided which allow for shorter stub lengths, reduced motherboard costs, more efficient routing between multiple agents, and bus traces with better matched characteristic impedances.

Claims

1. An electronic system comprising:

a circuit board having a first trace segment and a second trace segment; and

an interconnector supported by the circuit board, the interconnector having a third trace segment connected to the first trace segment by way of a first via, and having a fourth trace segment connected to the second trace segment by way of a second via, wherein the first, second, third, and fourth trace segments form a bus trace.

2. The electronic system as set forth in claim 1, wherein first, second, third, and fourth trace segments have substantially equivalent characteristic impedances.

3. The electronic system as set forth in claim 1, further comprising:

a die; and

a die package to support the die, the die package having a stub connected to the third and fourth trace segments by way of a third via.