Antenna-integrated printed wiring board assembly for a phased array antenna system

• US 6,670,930 B2
• Filed: 12/05/2001
• Issued: 12/30/2003
• Est. Priority Date: 12/05/2001
• Status: Active Grant

• Current Assignee: The Boeing Co.
• Original Assignee: The Boeing Co.
• Inventors: Navarro, Julio A.
• Primary Examiner(s): Wong, Don
• Assistant Examiner(s): CHEN, SHIH CHAO
• Application Number:
  US10/007,067
• Publication Number:
  US 20030103012A1
• Time in Patent Office: 755 Days
• Field of Search: 343/700.MS, 343/776, 343/777, 343/778, 343/824, 343/771, 343/853, 343/772
• US Class Current: 343/776
• CPC Class Codes: H01Q 21/0087 Apparatus or processes specially adapted for manufacturing antenna arrays manufacturing waveguides H01P11/00
• CPC Class Codes: H01Q 21/0093 Monolithic arrays

Abstract

A phased array antenna system formed from an antenna-integrated printed wiring board for performing the functions of a waveguide impedance matching layer, a honeycomb support structure, RF antenna probes, DC logic and RF distribution. The printed wiring board construction of the present invention significantly reduces the number of component parts required to form a phased array antenna assembly, as well as simplifying the manufacturing process of the antenna assembly. The antenna-integrated printed wiring board is formed from an inexpensive, photolithographic process to create a single part (or optionally a two part) structure for performing the above-listed functions.

Claims

1. A phased array antenna system, comprising:

a multilayer printed wiring board including;

a via forming at least one antenna element;

a first plurality of layers for providing DC power, logic signals and RF power distribution;

at least one layer forming a waveguide structure disposed adjacent said first plurality of layers, and including a plurality of vias extending adjacent a portion of said antenna element to form a can at least substantially circumscribing said antenna element;

an uppermost layer forming a impedance matching layer for covering said layer forming said at least one waveguide structure; and

an additional plurality of vias formed through selected ones of said layers for electrically communicating said DC power, said logic signals and said RF power distribution within said multilayer printed wiring board.

2. The antenna system of claim 1, wherein said multilayer printed wiring board comprises at least one trace for providing a positive DC voltage from a DC voltage source to said antenna system.

3. The antenna system claim 1, wherein said multilayer printed wiring board comprises a trace for providing a negative DC voltage from a negative DC voltage source to said antenna system.

4. The antenna system of claim 1, wherein said multilayer printed wiring board comprises a separate layer for providing a clock signal to said antenna system.

5. The antenna system of claim 1, wherein said multilayer printed wiring board comprises a separate layer for providing data to said antenna system.

6. The antenna system of claim 1, wherein said layer comprising said waveguide structure comprises a plurality of sub-layers sandwiched together, and wherein a plurality of vias are arranged in a circular pattern to extend through said sub-layers to form said can.

7. A phased array antenna system, comprising:

a multilayer printed wiring board including;

a probe-integrated, multi-layer wiring board assembly having a first plurality of layers and including circuits for providing DC power, logic signals and RF signal distribution functions, and for providing a plurality of RF radiating elements on one of said first plurality of layers thereof; and

a waveguide, multi-layer wiring board assembly disposed adjacent said probe-integrated, multi-layer wiring board assembly, said waveguide, multi-layer wiring board assembly including;

a second plurality of layers having a plurality of vias extending therethrough to form a plurality of cans;

said cans functioning as waveguides and being aligned over said RF radiating elements,

at least one of said second plurality of layers forming an impedance matching layer;

wherein said RF radiating elements are arranged in pairs, with each said can being aligned over a single respective pair of said RF radiating elements.

8. A method for manufacturing a phased array antenna system comprising:

using a sub-plurality of layers of a multi-layer printed wiring board to provide DC power signals and RF signal distribution functions;

using a plurality of RF vias to form a plurality of RF radiating elements extending through a plurality of layers of said multi-layer printed wiring board; and

using a plurality of vias formed to extend through a selected sub-plurality of said layers of said multi-layer printed wiring board to circumscribe each of said RF vias, to thereby form a plurality of cans, each said can circumscribing a respective pair of said RF vias to form a waveguide structure.

9. The method of claim 8, wherein said antenna system is formed from a photolithographic process.

10. The method of claim 8, further forming an impedance matching layer on one outer surface of said sub-layers of said multi-layer printed wiring board.

11. A method for forming a phased array antenna system comprising:

using a plurality of layers of a multi-layer printed wiring board to provide DC power signals, logic signals and RF signal distribution functions;

using a plurality of RF vias to form a plurality of RF radiating elements extending through a plurality of layers of said multi-layer printed wiring board;

using a plurality of vias formed to extend through a selected subplurality of layers of said multi-layer printed wiring board to circumscribe each of said RF vias, to thereby form a plurality of cans, each said can circumscribing a selected pair of said RF vias to form a waveguide structure for its associated said selected pair of RF vias; and

using at least one layer of said multi-layer printed wiring board to form an impedance matching layer.

12. A phased array antenna system, comprising:

a multilayer printed wiring board including;

a probe-integrated, multi-layer wiring board assembly having a first plurality of layers and including circuits for providing DC power, logic signals and RF signal distribution functions, and for providing a plurality of RF radiating elements on one of said first plurality of layers thereof; and

a waveguide, multi-layer wiring board assembly disposed adjacent said probe-integrated, multi-layer wiring board assembly, said waveguide, multi-layer wiring board assembly including;

a second plurality of layers having a plurality of vias extending therethrough to form a plurality of cans;

said cans functioning as waveguides and being aligned over said RF radiating elements,

at least one of said second plurality of layers forming an impedance matching layer; and

wherein said probe-integrated multi-layer wiring board assembly and said waveguide multi-layer wiring board assembly are formed as a single piece printed wiring board assembly.