Thin film magnetic head recessed partially into substrate and including planarization layers

• US 6,671,135 B2
• Filed: 04/21/2003
• Issued: 12/30/2003
• Est. Priority Date: 12/12/1997
• Status: Expired due to Fees

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: Iijima, Atsushi, Sasaki, Yoshitaka
• Primary Examiner(s): Renner, Craig A.
• Application Number:
  US10/419,087
• Publication Number:
  US 20030193743A1
• Time in Patent Office: 253 Days
• Field of Search: 360/317, 360/121, 360/126
• US Class Current: 360/317
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: G11B 5/3116 Shaping of layers, poles or gaps for improving the form of the electrical signal transduced, e.g. for shielding, contour effect, equalizing, side flux fringing, cross talk reduction between heads or between heads and information tracks G11B5/3113, G11B5/245 take precedence
• CPC Class Codes: G11B 5/313 Disposition of layers
• CPC Class Codes: G11B 5/3163 Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
• CPC Class Codes: G11B 5/3166 Testing or indicating in relation thereto, e.g. before the fabrication is completed
• CPC Class Codes: G11B 5/3967 Composite structural arrangements of transducers, e.g. inductive write and magnetoresistive read G11B5/3906 takes precedence

Abstract

A combination magnetic head includes a reading head portion and a writing head portion successively stacked on a substrate. A magnetic shield layer is formed on a portion of the substrate between a recessed portion formed in a surface of the substrate and an air bearing surface. A shield gap layer with a magnetoresistive reproducing element embedded therein is formed on the magnetic shield layer. A first magnetic layer has a pole portion formed on the shield gap layer and an extended portion extending along a bottom wall of the recessed portion. A thin film coil has a portion provided on the extended portion and fully embedded within the recessed portion such that the portion of the thin film coil is closer to the substrate than the reproducing element.

Claims

1. A combination type thin film magnetic head including a magnetoresistive type reproducing head portion and an inductive type recording head portion, comprising:

a substrate having a recessed portion formed in a surface thereof;

a magnetic shield layer formed on a portion of the surface of the substrate disposed between the recessed portion and an air bearing surface;

a shield gap layer made of an non-magnetic and electrically insulating material and formed on the magnetic shield layer;

a magnetoresistive reproducing element embedded within the shield gap layer;

a first magnetic layer having a pole portion formed on the shield gap layer and an extended portion extending along a bottom wall of the recessed portion, said pole portion being exposed on the air bearing surface;

a thin film coil having a portion provided on the extended portion of the first magnetic layer to be embedded within the recessed portion such that coil windings of the thin film coil are isolated by an insulating layer;

a write gap layer made of a non-magnetic material and provided at least on the pole portion of the first magnetic layer; and

a second magnetic layer having a pole portion which is opposed to the pole portion of the first magnetic layer via the write gap layer, a portion of the second magnetic layer remote from the pole portion thereof being magnetically coupled with a portion of the first magnetic layer remote from the pole portion of the first magnetic layer, said pole portion of the second magnetic layer being exposed on the air bearing surface;

wherein the portion of the thin film coil is fully embedded within the recessed portion such that the portion of the thin film coil is positioned closer to the substrate than the magnetoresistive reproducing element.

2. The combination type thin film magnetic head according to claim 1, wherein the insulating layer of the thin film coil is provided to constitute a flat surface together with the pole portion of the first magnetic layer, the write gap layer is provided on the flat surface to constitute a flat surface and the second magnetic layer is provided on the flat surface of the write gap layer to constitute a flat surface.

3. The combination type thin film magnetic head according to claim 1, wherein said recessed portion of the substrate is formed by etching using the magnetic shield layer as an etching mask.

4. The combination type thin film magnetic head according to claim 3, further comprising an insulating layer provided on the magnetic shield layer and the bottom wall of the recessed portion.

5. The combination type thin film magnetic head according to claim 1, wherein a side wall of the recessed portion has an inclination angle of 55-65°

.

6. The combination type thin film magnetic head according to claim 1, wherein the recessed portion has depth not less than 5 μ

m.

7. The combination type thin film magnetic head according to claim 1, wherein the first magnetic layer is made of a magnetic material having a high saturation flux density.