Method for producing a piezoelectric/electrostrictive device

• US 6,671,939 B2
• Filed: 03/15/2002
• Issued: 01/06/2004
• Est. Priority Date: 10/01/1999
• Status: Expired due to Fees

• Current Assignee: NGK Insulators Limited
• Original Assignee: NGK Insulators Limited
• Inventors: Kimura, Koji, Takeuchi, Yukihisa, Nanataki, Tsutomu
• Primary Examiner(s): Tugbang, A. Dexter
• Assistant Examiner(s): NGUYEN, TAI V
• Application Number:
  US10/099,671
• Publication Number:
  US 20020096972A1
• Time in Patent Office: 662 Days
• Field of Search: 29/253.5, 295/94, 298/31, 298/30, 298/962.2, 294/17, 310/324, 310/328, 310/358
• US Class Current: 29/25.35
• CPC Class Codes: H10N 30/05 Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
• CPC Class Codes: H10N 30/2043 connected at their free ends, e.g. parallelogram type
• CPC Class Codes: Y10T 29/42 Piezoelectric device making
• CPC Class Codes: Y10T 29/49005 Acoustic transducer
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49574 Musical instrument or tuning fork making
• CPC Class Codes: Y10T 29/49789 Obtaining plural product pieces from unitary workpiece
• CPC Class Codes: Y10T 29/49798 Dividing sequentially from leading end, e.g., by cutting or breaking

Abstract

A piezoelectric/electrostrictive device includes a pair of mutually opposing thin plate sections, a movable section, and a fixation section for supporting the thin plate sections and the movable section. One or more piezoelectric/electrostrictive elements are arranged on the pair of thin plate sections. A hole is formed by both inner walls of the pair of thin plate sections, an inner wall of the movable section, and an inner wall of the fixation section. At least one thin plate section of the pair of thin plate sections is previously bent in a direction to make mutual approach so that it has an inwardly convex configuration to the hole.

Claims

1. A method for producing a piezoelectric/electrostrictive device comprising:

a pair of mutually opposing thin plate sections, a movable section, and a fixation section for supporting said thin plate sections and said movable section;

one or more piezoelectric/electrostrictive elements arranged on at least one thin plate section of said pair of thin plate sections said piezoelectric/electrostrictive element comprising a piezoelectric/electrostrictive layer and a pair of electrodes formed on said piezoelectric/electrostrictive layer; and

a hole formed by both inner walls of said pair of thin plate sections, an inner wall of said movable section, and an inner wall of said fixation section, said method comprising the steps of;

integrally sintering a ceramic green laminate including at least a first ceramic green sheet having a window for fanning at least said hole and second ceramic green sheets to be formed into said thin plate sections to produce a ceramic laminate;

forming a precursor of one of said pair of electrodes and/or said piezoelectric/electrostrictive layer on at least an outer surface of a portion of said ceramic laminate to be formed into said at least one thin plate section;

sintering said precursor to integrate said ceramic laminate with said precursor and simultaneously denting inwardly a portion to be formed into said at least one thin plate section; and

producing a ceramic substrate in which said pair of thin plate sections are bent in directions to make mutual approach, by means of at least a one time cutoff treatment of at least a portion of said ceramic laminate.

2. The method for producing said piezoelectric/electrostrictive device according to claim 1, wherein said step of forming said precursor of one of at least said pair of electrodes and/or said piezoelectric/electrostrictive layer is carried out by a film formation method.

3. The method for producing said piezoelectric/electrostrictive device according to claim 2, wherein said precursor is formed while controlling a difference in thermal expansion at least between a material for said portion to be formed into said thin plate section and a material of said precursor when said precursor of one of said pair of said electrodes and/or said piezoelectric/electrostrictive layer is formed on said ceramic laminate.

4. A method for producing a piezoelectric/electrostrictive divide comprising:

a pair of mutually opposing thin plate sections, a movable section, and a fixation section for supporting said thin plate sections and said movable section;

one or more piezoelectric/electrostrictive elements arranged on at least one thin plate section of said pair of thin plate sections; and

a hole formed by both inner walls of said pair of thin plate sections, an inner wall of said movable section, and an inner wall of said fixation section, said method comprising the steps of;

producing a ceramic green laminate including at least a ceramic green sheet having a window for forming at least said hole and ceramic green sheets to be formed into said tin plate sections;

forming a precursor for constructing at least a part of said piezoelectric/electrostrictive element on at least an outer surface of a portion to be formed into said at least one thin plate section of said ceramic green laminate;

co-firing said ceramic green laminate and said precursor for constructing at least said part or all of said piezoelectric/electrostrictive element so that a ceramic laminate including portions to be formed into said thin plate sections thereafter denting inwardly is produced, and at least said part or all of said piezoelectric/electrostrictive element is formed on at least the outer surface of said portion to be formed into said thin plate section; and

producing a ceramic substrate in which said pair of thin plate sections are bent in directions to make mutual approach, by means of at least a one time cutoff treatment of at least a portion of said ceramic laminate.

5. The method for producing said piezoelectric/electrostrictive device according to claim 4, wherein said precursor is formed while controlling a difference in thermal expansion at least between a material for said portion to be formed into said thin plate section and a material for said piezoelectric/electrostrictive element when said precursor for constructing at least said part of said piezoelectric/electrostrictive element is formed on said ceramic green laminate.