Apparatus and method for passive phase change thermal management

• US 6,672,370 B2
• Filed: 03/14/2000
• Issued: 01/06/2004
• Est. Priority Date: 03/14/2000
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Pullen, David, Searls, Damion T., Dishongh, Terrance J.
• Primary Examiner(s): Bennett, Henry
• Assistant Examiner(s): Doung, Tho V
• Application Number:
  US09/525,173
• Publication Number:
  US 20020104641A1
• Time in Patent Office: 1,393 Days
• Field of Search: 165/10, 165/104.14, 165/185, 165/104.33, 361/698, 361/700, 257/713
• US Class Current: 165/10
• CPC Class Codes: C09K 5/063 Materials absorbing or liberating heat during crystallisation; Heat storage materials
• CPC Class Codes: F28D 15/00 Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies F28D17/00, F28D19/00, F28D20/00 take precedence
• CPC Class Codes: F28D 20/021 the latent heat storage material and the heat-exchanging means being enclosed in one container F28D20/023 - F28D20/028 take precedence
• CPC Class Codes: F28D 2021/0031 Radiators for recooling a coolant of cooling systems
• CPC Class Codes: F28F 23/00 Features relating to the use of intermediate heat-exchange materials, e.g. selection of compositions heat-transfer, heat-exchange or heat-storage materials C09K5/00
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01L 23/4275 by melting or evaporation of solids
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y02E 60/14 Thermal energy storage
• CPC Class Codes: Y10T 29/49353 Heat pipe device making

Abstract

A heat sink includes a heat sink body including a number of fins and a cavity for holding a phase change material and a number of particles to enhance the mixing of the phase change material during the operation of the heat sink. In operation, the body of the heat sink conducts thermal energy to the phase change material. The energy is absorbed during the phase change of the phase change material. After absorbing energy and changing to a liquid state, the phase change material continues to dissipate energy by convection. The convection currents in the cavity are directed by the shape of the cavity surfaces and enhanced by the particles intermixed with the phase change material.

Claims

1. An apparatus comprising:

a phase change material;

a plurality of particles intermixed with the phase change material; and

a conductive structure encapsulating the phase change material and the plurality of particles, the conductive structure including a cavity having a first sloping surface, wherein the first sloping surface slopes upward from a first low area positioned above a hot spot of an integrated circuit die.

2. The apparatus of claim 1, wherein the conductive structure further comprises:

a second sloping surface, wherein the second sloping surface slopes upward from a second low area positioned above the hot spot of an integrated circuit die.

3. The apparatus of claim 2, wherein the second sloping surface is shaped to split convection currents included in the phase change material.

4. The apparatus of claim 1, wherein the cavity has a cavity surface including a plurality of structures.

5. The apparatus of claim 1, wherein at least one of the plurality of particles comprises SiO2.

7. The apparatus of claim 1, wherein the die includes a processor.

8. The apparatus of claim 1 wherein the conductive structure comprises copper.

9. The apparatus of claim 1, wherein the phase change material comprises TH58.

6. The apparatus of claiom 1, wherein the phase change material congeals on the plurality of particles in cooler regions of the phase change material.