Spring interconnect structures

• US 6,672,875 B1
• Filed: 12/29/1999
• Issued: 01/06/2004
• Est. Priority Date: 12/02/1998
• Status: Expired due to Term

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Mathieu, Gaetan L., Grube, Gary W., Larder, Richard A., Eldridge, Benjamin N.
• Primary Examiner(s): Bradley, P. Austin
• Assistant Examiner(s): LEON, EDWIN A
• Application Number:
  US09/474,788
• Time in Patent Office: 1,469 Days
• Field of Search: 439/66, 439/862, 439/81, 439/83, 439/515
• US Class Current: 439/66
• CPC Class Codes: G01R 1/06727 Cantilever beams
• CPC Class Codes: G01R 1/06733 Geometry aspects G01R1/06727 takes precedence
• CPC Class Codes: G01R 1/06761 related to layers
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: H01L 24/72 Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01011 Sodium [Na]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01042 Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01045 Rhodium [Rh]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01055 : Cesium [Cs]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H05K 3/326 : the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: H05K 3/4092 : Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Abstract

An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The second resilient element is coupled to the first resilient element through respective securing regions and positioned such that upon sufficient displacement of the first contact region toward the second resilient element, the second contact region will contact the third contact region. The interconnection, in one aspect, is of a size suitable for directly contacting a semiconductor device. A large substrate with a plurality of such interconnection elements can be used as a wafer-level contactor. The interconnection element, in another aspect, is of a size suitable for contacting a packaged semiconductor device, such as in an LGA package.

Claims

1. An electronic component comprising a substrate and a plurality of interconnect elements for electrically interconnecting said electronic component to a second electronic component, wherein each said interconnect element comprises:

a post structure joined to a terminal of said electronic component;

a conductive cantilever beam structure comprising a plurality of leaves, there being a separating space between portions of adjacent leaves, a first outer leaf of said cantilever beam structure joined to said post structure; and

a tip structure joined to a second outer leaf of said cantilever beam structure, said tip structure disposed to contact a terminal of said second electronic component,

wherein said post structure, said cantilever beam structure, and said tip structure are structurally distinct elements that are joined one to another,

wherein a cantilever beam structure of one of said plurality of interconnect elements overlaps a cantilever beam structure of another of said plurality of interconnect elements.

2. The electronic component of claim 1, wherein said plurality of leaves comprises at least three leaves.

3. The electronic component of claim 1, wherein said plurality of leaves comprises at least four leaves.

4. The electronic component of claim 1, wherein each of said leaves is tapered along a length thereof.

5. The electronic component of claim 1, wherein each of said leaves is disc shaped.

6. The electronic component of claim 1, wherein each of said leaves is square shaped.

7. The electronic component of claim 1, wherein each of said leaves is “

H”

shaped.

8. The electronic component of claim 1, wherein said cantilever beam structure is integrally formed.

9. The electronic component of claim 1, wherein said cantilever beam structure comprises a solid end, said plurality of leaves extending from said solid end.

10. The electronic component of claim 1, wherein said leaves comprise beams and joining material joining adjacent beams provides said separating space between portions of adjacent leaves.

11. The electronic component of claim 1, wherein said leaves comprise beams and a raised portion integrally formed with at least one of said beams provides said separating space between portions of adjacent leaves.

12. The electronic component of claim 1, wherein said leaves comprise beams, said interconnect element further comprising at least one support disposed between adjacent beams, said at least one support providing said separating space between portions of adjacent leaves.

13. The interconnect element claim 1, wherein each of said leaves comprises a change of direction along a length thereof.

14. The electronic component of claim 13, wherein each of said leaves comprises a plurality of changes of direction along a length thereof.

15. The electronic component of claim 1, wherein each of said leaves includes an opening.

16. The electronic component of claim 15, wherein said opening is centrally located in each said leaf.

17. The electronic component of claim 1, wherein each of said plurality of leaves is a different size.

18. The electronic component of claim 17, wherein each of said plurality of leaves has a different length.

19. The electronic component of claim 17, wherein each of said plurality of leaves has a different width.

20. The electronic component of claim 1, wherein said conductive cantilever beam structure is compliant such that said conductive cantilever beam structure deforms in response to a first force urging said second electronic component against said tip structure.

21. The electronic component of claim 20, wherein said conductive cantilever beam structure deforms such that at least parts of said portions of adjacent leaves separated by said space contact each other.

22. The electronic component of claim 20, wherein said conductive cantilever beam structure is resilient such that said conductive cantilever beam structure provides a second force in opposition to said first force.

23. The electronic component of claim 20, wherein said conductive cantilever beam structure is resilient such that upon removal of said first force, said cantilever beam structure returns substantially to its original, undeformed shape.